max_homer (22.08.2013 22:04, просмотров: 1) ответил Ксения на For enhanced thermal, electrical, and board level performance, the exposed pad on the package needs to be soldered to the board using a corresponding thermal pad on the board. Furthermore, for proper heat conduction through the board,
max_homer (22.08.2013 22:04, просмотров: 1) ответил Ксения на For enhanced thermal, electrical, and board level performance, the exposed pad on the package needs to be soldered to the board using a corresponding thermal pad on the board. Furthermore, for proper heat conduction through the board,