Инжекция носителей на границу раздела п/п и диэлектрика в области
перехода. Вот, что пишет Toshiba в "Designing for Reliability": Degradation of device characteristics due to hot carriers also occurs in bipolar transistors. This is a
well-known phenomenon characterized by a reduced hFE when a reverse bias is applied across the
emitter-base. With the appearance of advanced shallow junction devices in recent years, there is a
tendency towards increased reverse leakage current between the emitter and base and therefore a
tendency towards greater degradation of characteristics due to hot carriers.
или Безналоговые Девицы в "Reliability Handbook
UG-311":
A major reliability issue for high-performance bipolar transistors is the reduction of forward current gain (hfe) resulting from hot carrier (HC) generation during reverse bias operation of the emitter-base pn junction [70]. Bipolar HC-induced degradation is strongly dependent on device size. The overall objective is to develop reliability-driven rules that can be used to reduce HC degradation and improve transistor reliability.
Можно сказать, что всё было про СВЧ транзисторы... Но N. TOUFIK, F.
PILANCHON and P. MIALHE
в "Degradation of junction parametes of an electrically stressed NPN bipolar transistor" - значимо убили дубовый 2N2222. Пусть и током в 60 мА.