Моя конференция

Аналоги микросхем памяти SRAM европейских брендов от Chiplus

Компания Макро Групп расширяет линейку доступных аналогов для микросхем статической памяти. 20-07-2026

SiC-диод Шоттки в изолированном корпусе TO-247ISO-3 от AMG Power

AMG Power объявляет о выпуске кремниево-карбидного SiC диода Шоттки с номинальным напряжением 650 В и током 60 А в изолированном корпусе TO-247ISO-3 A3G60D650GT3Ci. 17-07-2026

АТЕ-5035 - сочетание простоты и инноваций для контроля температуры и влажности

Если вам необходимо контролировать влажность и температуру в производственном цехе или офисе обратите внимание на АКТАКОМ АТЕ-5035. Это решение для тех кому нужна мобильность лаборатории и запись результатов измерений без лишних посредников в виде установленного на ПК… 16-07-2026

Каталог Cosmo Ferrites 2026. Начало поставок материалов Ni-Zn и готовых магнитных компонентов

Компания Макро Групп представляет обновленный каталог продукции Cosmo Ferrites 2026 и сообщает о расширении ассортимента продукции доступной российским заказчикам. 16-07-2026

Дисплеи Tianma для промышленности медицины и транспорта

Компания Теллур Электроникс предлагает к поставке дисплеи Tianma одного из наиболее узнаваемых и востребованных брендов на российском рынке электронных компонентов. Tianma крупный производитель дисплейных решений основанный в городе Шэньчжэнь Китай. Компания занимает лидирующие позиции в отрасли и выпускает широкий ассортимент дисплеев для различных сфер применения. Дисплеи Tianma используют 16-07-2026

Портативные тестеры сопротивления изоляции АММ-2002

Портативные тестеры сопротивления изоляции Актаком АММ-2002 предназначены для испытания сопротивления изоляции электрооборудования до 4 99 ГОм тестовым напряжением 250 / 500 / 1000 В. Прибор может проводить измерения напряжения постоянного и переменного тока от 20 до 1000 В или до 750 В соответственно. Тестер изоляции Актаком АММ-2002 имеет компактные размеры и небольшой вес что позволяет использ 13-07-2026

SiC-диод Шоттки в изолированном корпусе TO-247ISO-3 от AMG Power

AMG Power объявляет о выпуске кремниево-карбидного SiC диода Шоттки с номинальным напряжением 650 В и током 60 А в изолированном корпусе TO-247ISO-3 A3G60D650GT3Ci. 13-07-2026

UMA: The Architecture Edge AI Needs to Scale

Edge AI won t be saved by more chips it needs unified memory to stop models from choking mid-task. The post UMA: The Architecture Edge AI Needs to Scale appeared first on EE Times… 20-07-2026

Graph Transformer Speeds IC Interconnect Signal Integrity Analysis Buffalo Stuttgart IBM

Researchers at the University at Buffalo University of Stuttgart and IBM Research published SI-GT: Fast Interconnect Signal Integrity Analysis For Integrated Circuit Design Via Graph Transformers. Abstract Excerpt: In this paper we propose Si-GT a novel transformer-based model for fast and accurate signal integrity analysis in IC interconnects. Find the technical paper here. April… 20-07-2026

A Feature-Rich Drum Machine

A little over a month ago we featured a project from Igor who built 64 bits of DRAM from scratch using discrete components. Jokes about memory pricing aside he did read… 20-07-2026

3D Mask Effects Enhance Imaging in High-NA EUV and Hyper-NA EUV Litho Fraunhofer ASML

Researchers at the Fraunhofer Institute for Integrated Systems and Device Technology IISB and ASML published a technical paper titled Benefits of three-dimensional mask M3D effects in high-NA and hyper-NA EUV lithography. Excerpt: This study aims to offer an alternative perspective on M3D effects in EUV lithography. We demonstrate that M3D effects can be harnessed under... read more… 20-07-2026

Inference Accelerator that Integrates Compute-in-Interconnect and Memory to Mitigate the Memory Wall NUS

Researchers at the National University of Singapore published a technical paper titled CIMERA: Compute-in-Interconnect and Memory with Reconfigurable Precision for LLM Inference. Abstract Excerpt: This paper presents CIMERA a reconfigurable-precision LLM inference accelerator that integrates compute-in-interconnect and memory to mitigate the memory wall and enable precision-aware execution.  20-07-2026

NbAs Nanowires Show Lower Resistivity as Interconnect Dimensions Shrink Cornell NYCU IBM et al.

Researchers at Cornell University National Yang Ming Chiao Tung University IBM Research Johns Hopkins University et al. published a technical paper titled Surface-dominant transport in Weyl semimetal NbAs nanowires for next-generation interconnects. Abstract Excerpt: We report the synthesis of Weyl semimetal niobium arsenide NbAs nanowires through thermomechanical nanomolding with… 20-07-2026

Litho Patterning of Conformal Thin-Film Coatings on Complex 3D Structures KTH Royal

Researchers at KTH Royal Institute of Technology published a technical paper titled Lithographic patterning of conformal thin films on 3D structures using Scaffold-architected Lift-off masks. Abstract Excerpt: Here we present a robust approach for patterning of conformal thin-film coatings on complex 3D structures. It is agnostic to the used thin-film deposition process and enables… 20-07-2026

Hackaday Europe 2026: Project Gigapixel

There was once a race to put out cameras with ever higher numbers of megapixels to snare customers eager to take the highest quality digital photos. These days we know read… 20-07-2026

Nisshinbo Micro Devices Expands High-Voltage IC Lineup for Next-Gen Automotive 48 V Systems

Addressing the new challenges posed by the shift to 48 V automotive power supplies with Nisshinbo Micro Devices The post Nisshinbo Micro Devices Expands High-Voltage IC Lineup for Next-Gen Automotive 48 V Systems appeared first on EE Times… 20-07-2026

SEM-Guided Low-kV FIB Finishing for Leading-Edge Semiconductor Failure Analysis

Discover how the ZEISS Crossbeam 750 FIBSEM sets a new benchmark for precise TEM lamella prep tomography and advanced nanofabrication. This delivers better resolution better SNR larger usable FOV and shorter acquisition times. Learn how uninterrupted FIB milling will reduce damage and rework accelerate time to TEM and increase first pass success so your FA yield and materials teams make… 20-07-2026

Old SSDs Find New Life as Game Cartridges

Game companies might not like physical media much anymore but gamers sure do. There s nothing like pawing over your collection to find what to play and inserting a cartridge with read… 20-07-2026

Modular test architecture is driving force for Emerson

The modular system based on NI technology combines a high-performance FPGA core for processing real-time data and interchangeable SerDes interface devices which can be swapped according to the configuration requirements The post Modular test architecture is driving force for Emerson appeared first on Electronics Weekly… 20-07-2026

Launching Rockets is Hard Bring them Back is Harder

Since the first V2 rocket sailed above the K rm n line back in 1944 and right up until the modern era the trajectory of most space-bound rockets was more or less read… 20-07-2026

SWISSto12 70m raises Series C for HummingSat development

SWISSto12 the Swiss manufacturer of satellite and payload systems has closed its 70 million Series C funding round. The capital raise follows the award of 84.8 million from the European The post SWISSto12 70m raises Series C for HummingSat development appeared first on Electronics Weekly… 20-07-2026

Powering the Automotive Revolution: From Zonal Architecture to 48V

Explore how Monolithic Power Systems 48V automotive solutions including the MPQ5884-AEC1 support safer smarter and more efficient zonal architecture. The post Powering the Automotive Revolution: From Zonal Architecture to 48V appeared first on EE Times… 20-07-2026

Photonics Components - The Eyes and Ears of the Future Unmanned System and Connected Soldiers

Discover how optoelectronics plays a central role in sensing and data generation including light-based distance measurement for UAVs and robotic platforms. The post Photonics Components The Eyes and Ears of the Future Unmanned System and Connected Soldiers appeared first on EE Times… 20-07-2026