Caxapa

Поздравляем Бoмж с днём рождения!

Безопасные спички, 1855 год

Deep Purple, 1969 год

SDR модули CR-P047/CR-P047P от Cruetech: Макро Групп предлагает SDR модули CR-P047 и CR-P047P под брендом… 20-04-2026

Промышленные eMMC NAND и DDR ИС и модули от Cruetech для встраиваемых систем: Cruetech продолжает укреплять своё предложение высоконадежной памяти для промышленных и коммерческих встраиваемых решений. 17-04-2026

Промышленные столы Актаком АРМ-4х1х с антистатической столешницей. Скидка 15%: Информируем о продлении акции на промышленные столы АКТАКОМ АРМ-4х1х с антистатической ESD-столешницей в рамках которой действует скидка 15% от розничной цены. Новый срок действия - до 01 июня 2026… 16-04-2026

Автомобильный дискретный IGBT на 1200 В от Sunco: Компания Sunco производитель силовой электроники анонсировала новое поколение дискретных автомобильных IGBT-транзисторов напряжением 1200 В в корпусе… 15-04-2026

Аналоговые и mixed-signal ИС для промышленной автомобильной и потребительской электроники от NOVOSENSE Microelectronics: Компания Макро Групп начала сотрудничество с производителем высоконадёжных аналоговых и mixed-signal микросхем для промышленной автомобильной и потребительской электроники NOVOSENSE Microelectronics. 13-04-2026

Развитие направления гражданских БПЛА: решения от Теллур Электроникс: Компания Теллур Электроникс приглашает ознакомиться с новой специализированной страницей посвящённой решениям для разработки и производства гражданских беспилотных летательных аппаратов. В условиях стремительного роста рынка БПЛА и задач импортозамещения мы системно расширяем портфель электронных компонентов и модулей востребованных в таких областях как: мониторинг и безопасность сельское… 13-04-2026

Высоковольтный тестер сопротивления изоляции Актаком АММ-2093: Возобновлены продажи высоковольтного тестера сопротивления изоляции модели АММ-2093 предназначенного для проведения испытаний стойкости изоляции напряжением до 5/6 кВ AC/DC и измерения сопротивления изоляции до… 10-04-2026

Why XPO Resonated at OFC 2026: XPO redefines AI data center networking with improved density efficiency and scalability. The post Why XPO Resonated at OFC 2026 appeared first on EE Times… 20-04-2026

Indian Deep-Tech Startup Bets on Cooling Humans Not Rooms: What if you could carry your own climate with you on a bike ride at work or even while you sleep This startup is building wearable cooling tech that ditches traditional AC and puts comfort under your control. Curious how it works and why global demand is already heating up In a country battling… 20-04-2026

TP-Link s Tapo H100: Smart sensing unencumbered: Smart home hubs from different companies supporting comparable-spectrum wireless links. How do they differ and are similar Let s find out. The post TP-Link s Tapo H100: Smart sensing unencumbered appeared first on… 20-04-2026

Electronic biosensing: A quick take on ketone detection: Ketone detection translates chemical presence into measurable electrical signals using signal conversion amplification and conditioning. The post Electronic biosensing: A quick take on ketone detection appeared first on… 20-04-2026

Fluidic Contact Lens Treats Glaucoma: We ve always been interested in fluidic computers a technique that uses moving fluids to perform logic operations. Now Spectrum reports that researchers have developed an electronics-free contact lens that monitors read… 20-04-2026

AI optical transceiver market to grow 57% to US 26bn in 2026: Market analyst firm TrendForce forecasts that the global AI-focused optical transceiver market will rise at more than 57% year-on-year from US 16.5bn in 2025 to 26bn in 2026 as it has entered a phase of rapid growth. This surge is driven not only by specification upgrades but also reflects a broader structural reshaping of the optical communications supply chain amid accelerating AI data-center 20-04-2026

Electronics Engineering - Intern At OneAccord In Mumbai: APPLY HERE Location: Mumbai Company: One Accord Key Responsibilities Skill s… 20-04-2026

Lockheed Martin wins 105m Space Force contract for GPS IIIF: The U.S. Space Force is awarding Lockheed Martin a 105 million contract to further modernise GPS ground control networks via GPS IIIF. The aim is to better support resilient PNT ... The post Lockheed Martin wins 105m Space Force contract for GPS IIIF appeared first on Electronics Weekly… 20-04-2026

UK Semiconductor Centre appoints director of international partnerships: The UK Semiconductor Centre UKSC has appointed Brian Robertson as director of international partnerships to lead on strengthening the UK s global position in semiconductors and deepening connections between the UK ecosystem and international partners... 20-04-2026

Anti Jamming GNSS Receiver for Battlefield Use: When signals disappear and systems lose sync a compact receiver quietly keeps navigation timing and coordination intact in environments where interference dominates. Thales Group has introduced the TopStar Smart Receiver a compact Position Navigation and Timing solution engineered to maintain operational reliability in electronically contested environments. Designed for modern battlefield… 20-04-2026

Laser Radar for High Speed Non Contact Measurement: In high speed production measurement often becomes the bottleneck a new system aims to deliver faster consistent inspection without interrupting workflows. Nikon Corporation has introduced the APDIS MV5X laser radar system extending its non contact metrology lineup with a focus on speed portability and deployment flexibility across manufacturing environments. The APDIS MV5X is engineered… 20-04-2026

Targeting Scalable Deployment With Embodied AI Platform: As AI moves beyond software a new platform connects data models and machines to enable real world deployment of intelligent robotic systems. AGIBOT has introduced a new generation of embodied AI systems combining robotic platforms data pipelines and foundational models to accelerate real world deployment of intelligent machines across industrial and commercial environments.… 20-04-2026

India Moves Up the Chip Stack With 3D Packaging Push: Moving past fabrication focus India explores advanced packaging where stacking integration and materials innovation begin to shape next generation electronic systems India s semiconductor ecosystem is taking a step beyond conventional assembly with the introduction of advanced 3D chip packaging capabilities at Info Valley Bhubaneswar. The new facility led by 3D Glass Solutions brings… 20-04-2026

DIY Nuclear Battery with PV Cells and Tritium: Nuclear batteries are pretty simple devices that are conceptually rather similar to photovoltaic PV solar just using the radiation from a radioisotope rather than solar radiation. It s also possible to read… 20-04-2026

YMTC s NAND Design Surprise Alongside a New Fab: China s memory underdog defies sanctions by building a fab that mostly sources equipment materials and tools locally. The post YMTC s NAND Design Surprise Alongside a New Fab appeared first on EE Times… 20-04-2026

Why Proof Convergence Matters: Leveraging patterns in formal verification to reach sign-off faster. The post Why Proof Convergence Matters appeared first on Semiconductor Engineering… 20-04-2026

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