Caxapa

Александр Иванович Шокин, 1909 год

200G QSFP56 трансиверы DAC и AOC от Cruetech: экономически эффективное масштабирование сетевой инфраструктуры ЦОД: Российский бренд Cruetech расширяет линейку поставляемых оптических компонентов и представляет высокопроизводительные решения 200G в форм-факторе QSFP56 с интерфейсом… 28-10-2026

SoC со встроенным драйвером затворов для управления двигателями от Geehy: Geehy Semiconductor представила серию систем на кристалле SoC для управления электродвигателями со встроенным драйвером затворов и стабилизатором LDO G32M3122/3114/3115. 28-10-2026

32-битные микроконтроллеры Arm Cortex-M3 до 96 МГц от Geehy на складе Макро Групп: На складе Макро Групп доступны 32-битные микроконтроллеры Geehy на ядре Arm Cortex-M3 с тактовой частотой до 96 МГц 64 КБ Flash и 20 КБ SRAM APM32F103C8T6. 26-10-2026

Новое поступление на склад РУ Электроникс: компоненты RUICHI и аналоги мировых брендов: РУ Электроникс пополняет склад электронными компонентами и электротехникой ожидается более 700 позиций комплектующих. Часть позиций уже доступна на складе остальные ожидаются в ближайшее время. Следить за актуальным статусом можно в файле catalog - arrivals . xlsx . В поступлении - продукция собственного бренда RUICHI и доступные аналоги западных производителей. Поможем подобрать электронику… 23-10-2026

Снижение цен на монтажные паяльные станции Актаком АТР-1107 и АТР-1109: Информируем о снижении цен на 20% на самые популярные паяльные станции Актаком с керамическим нагревателем АТР-1107 и АТР-1109. 23-10-2026

Изменение компонентной базы шести оптических трансиверов APAC Opto: APAC Opto переводит шесть моделей оптических трансиверов на микросхему Semtech GN25L95 которая выполняет функции драйвера лазера и усилителя приёмника. 21-10-2026

1700 В 200 А 13 мОм паразитная индуктивность 20 нГн: трехфазный SiC MOSFET-модуль от AMG POWER: AMG POWER представил трехфазный SiC MOSFET-модуль на 1700 В и 200 А с сопротивлением сток-исток в открытом состоянии 13 мОм и паразитной индуктивностью 20 нГн A3G200N1700MEK6F. 20-10-2026

1700 В 200 А 13 мОм паразитная индуктивность 20 нГн: трехфазный SiC MOSFET-модуль от AMG POWER: AMG POWER представил трехфазный SiC MOSFET-модуль на 1700 В и 200 А с сопротивлением сток-исток в открытом состоянии 13 мОм и паразитной индуктивностью 20 нГн A3G200N1700MEK6F. 20-10-2026

C64 Keycaps For Everybody: If you ve got an MX-style keyboard and want some retro charm you might like a recent project from Levente Szabadkai . It s a set of C64-style keycaps that you can print read… 28-10-2026

DigiKey adds to its Standard Product range: DigiKey has expanded its DigiKey Standard Product range which addresses the everyday needs of engineers technicians and makers . Its own-label product line now includes a soldering station an ESD silicone The post DigiKey adds to its Standard Product range appeared first on Electronics Weekly… 28-10-2026

Turning an Old Phone s Motherboard into an RC Plane Controller: Upcycling smartphones makes a lot of sense especially since they contain so many components that remain useful long after their desirability as a smartphone has faded. In the case of read… 28-10-2026

Tesla s R D Costs Rising: Tesla s R D spending is rising significantly faster than its revenue. In Q1 2026 the company s R D-to-revenue ratio reached a new high of 8.7% up from 3.3% in early 2023. By The post Tesla s R D Costs Rising appeared first on Electronics Weekly… 28-10-2026

JPEG-XL Is Back On The Menu: Many of the image formats we re familiar with have been around for decades. We all know JPEG and PNG like the back of our hands and GIF even had a read… 28-10-2026

Microchip adds LX-820 Quartz Oscillator to L-Series for LEO apps: Microchip is adding the LX-820 Radiation-Tolerant Quartz Oscillator to its L-Series of timing devices. The part is designed for Low Earth Orbit LEO and other space applications. The L-Series is The post Microchip adds LX-820 Quartz Oscillator to L-Series for LEO apps appeared first on Electronics Weekly… 28-10-2026

Emulate the 486 in Your Browser: You might fondly remember the days of the Intel 486 but you probably don t have one on your desk anymore. If you d like to emulate that classic hardware you can read… 28-10-2026

High-Voltage Contactors: TDK launches 1000 V and 1500 V contactors for xEVs DC fast-charging and AI data center infrastructure: TDK Corporation has introduced the HVC28 and HVC29 series of gas-filled high-voltage DC contactors with optional mechanical auxiliary contact. Both series are available with continuous current ratings of 300 A 400 A 500 A and… 28-10-2026

SLAM Navigation For an Arduino Powered Car: There are plenty of robot projects out there that are really just a small remote control platform of some sort. We often like to think of robots of having some read… 28-10-2026

Introducing Build-A-Chip-Bench: From Workload Specification to GDS: Evaluate AI agents from workload specification through GDS layout using open-source tools and an open-source PDK to assess their ability to complete the chip-design workflow. The post Introducing Build-A-Chip-Bench: From Workload Specification to GDS appeared first on Semiconductor Engineering… 28-10-2026

Foundations of Power Management in the Age of AI: Make every layer of your hardware PDN-aware and reach your maximum compute density. The post Foundations of Power Management in the Age of AI appeared first on Semiconductor Engineering… 28-10-2026

Using AI for Analog Design: The growing role of AI in analog and mixed-signal design where complexity is rising schedules are tightening and the cost of mistakes is higher than ever. The post Using AI for Analog Design appeared first on Semiconductor Engineering… 28-10-2026

Foundation IP For The AI Era: Why Execution Saves You Millions On HPC And Edge AI SoCs: How a single integrated Foundation IP platform reduces re-spin risk and integration delays and helps lower TCO. The post Foundation IP For The AI Era: Why Execution Saves You Millions On HPC And Edge AI SoCs appeared first on Semiconductor Engineering… 28-10-2026

Planning Your AI Design Journey In RF EDA: Agentic solutions for RF design. The post Planning Your AI Design Journey In RF EDA appeared first on Semiconductor Engineering… 28-10-2026

How Much Can Semiconductor Models Hide: Advanced packaging requires models to cross company boundaries without exposing proprietary processes but hiding too much can make the prediction break down. The post How Much Can Semiconductor Models Hide appeared first on Semiconductor Engineering… 28-10-2026

Blog Review: Oct. 28: Large-format/curvilinear masks STCO for heterogeneous design physical AI interactions signing off AI-generated designs workload profile analysis. The post Blog Review: Oct. 28 appeared first on Semiconductor Engineering… 28-10-2026

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