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Изменение компонентной базы шести оптических трансиверов APAC Opto
APAC Opto переводит шесть моделей оптических трансиверов на микросхему Semtech GN25L95 которая выполняет функции драйвера лазера и усилителя приёмника. 21-10-2026
1700 В 200 А 13 мОм паразитная индуктивность 20 нГн: трехфазный SiC MOSFET-модуль от AMG POWER 1700 В 200 А 13 мОм паразитная индуктивность 20 нГн: трехфазный SiC MOSFET-модуль от AMG POWER
AMG POWER представил трехфазный SiC MOSFET-модуль на 1700 В и 200 А с сопротивлением сток-исток в открытом состоянии 13 мОм и паразитной индуктивностью 20 нГн A3G200N1700MEK6F. 20-10-2026
1700 В 200 А 13 мОм паразитная индуктивность 20 нГн: трехфазный SiC MOSFET-модуль от AMG POWER
AMG POWER представил трехфазный SiC MOSFET-модуль на 1700 В и 200 А с сопротивлением сток-исток в открытом состоянии 13 мОм и паразитной индуктивностью 20 нГн A3G200N1700MEK6F. 20-10-2026
20.10.2026: Новое поступление электронных компонентов KLS
Рады сообщить о поступлении на склад новой партии электронных компонентов производства KLS ведущего китайского производителя электронных компонентов. Продукция доступна для отгрузки со склада в Москве с 20.10.2026. В данной поставке представлены следующие компоненты: Полупроводники и диоды KLS: Диоды BAV99 более 1 5 млн шт. RS1M транзисторы BC817-40 защитные диоды SMBJ36CA SMCJ33A диоды.. 20-10-2026
Микроконтроллеры для оптических модулей от GigaDevice
igaDevice представила две серии микроконтроллеров для управления оптическими модулями: GD32E512 с тактовой частотой до 120 МГц и GD32E252 для низкоскоростных и промышленных применений. 19-10-2026
eMMC Cruetech: стабильные поставки и запас компонентов в условиях нестабильного рынка
Cruetech предлагает eMMC ёмкостью от 4 до 64 ГБ на базе NAND Flash памяти с ячейками MLC… 16-10-2026
Снижение цен на промышленные столы и тумбочки Актаком Снижение цен на промышленные столы и тумбочки Актаком
На 15% снижены цены на большинство моделей промышленных столов Актаком со стандарной и антистатической ESD столешницей всех модификаций а также тумбочки Актаком. 15-10-2026
Фемтосекундные лазеры с длиной волны 1030 и 515 нм и мощностью до 20 Вт от JPT
Компания JPT представила фемтосекундные лазеры со средней выходной мощностью до 20 Вт длиной волны 1030 и 515 нм и пассивным воздушным охлаждением: Jetlit 20 IR и Jetlit… 14-10-2026
Hacking a network switch for management enhancements
Interim steps to the end destination are often wise. And non-bleeding-edge gear can be made wiser in the process too. The post Hacking a network switch for management enhancements appeared first on… 22-10-2026
Why embedded engineering is becoming a bottleneck for industrial automation 
Industrial automation is increasingly becoming a strategic priority for manufacturers with robotics AI and connected production systems promising productivity flexibility and resilience writes Payam Pajoohi of PHYTEC. Despite this adopting The post Why embedded engineering is becoming a bottleneck for industrial automation  appeared first on Electronics Weekly… 22-10-2026
Floating-Point Addition and Subtraction on Intel s 8087 Floating-Point Addition and Subtraction on Intel s 8087
Although you can do basic floating point format operations like addition and subtraction just fine on any CPU having specialized hardware for it can provide a significant speed boost. Here read… 22-10-2026
Everspin Expands MRAM Push into AI Servers Data Centers Satellite Systems
In an exclusive interview Everspin CEO Sanjeev Aggarwal discusses MRAM opportunities amid NOR flash supply constraints. The post Everspin Expands MRAM Push into AI Servers Data Centers Satellite Systems appeared first on EE Times… 22-10-2026
Trying to Get Linux Running on a Nokia E6 Trying to Get Linux Running on a Nokia E6
The Nokia E6 is a smartphone from back in the old days when Symbian was a thing. fluffleswaffled has been doing the work to get the ancient handset running Linux read… 22-10-2026
Temperature Sensors: TDK presents robust and easy-to-mount NTC systems for demanding industrial applications with voltages up to 4000 V
TDK Corporation announces the expansion of its NTC temperature sensor portfolio with the M704 ordering code: B57704M0103A001 and M705 ordering code: B57705M0103A001 series engineered for reliable temperature measurement in high-voltage environments. 22-10-2026
Beyond The EPE Budget: Building The Next Generation Of Computational Lithography
Why better models richer metrology explainable AI and cross-industry collaboration must come together to extend semiconductor scaling. The post Beyond The EPE Budget: Building The Next Generation Of Computational Lithography appeared first on Semiconductor Engineering… 22-10-2026
PVTW: Extending Silicon Characterization From PVT To Real-World Workload
Two devices operating at exactly the same voltage frequency and temperature can behave differently depending on what they are being asked to do. The post PVTW: Extending Silicon Characterization From PVT To Real-World Workload appeared first on Semiconductor Engineering… 22-10-2026
Chip Scaling Moves Beyond The Transistor
SEMICON West 2026: Advanced packaging photonics test and AI are increasingly intertwined very different conversations ahead. The post Chip Scaling Moves Beyond The Transistor appeared first on Semiconductor Engineering… 22-10-2026
How Self-Aligned CFET Technology Could Extend CMOS Scaling Beyond 10
A process sequence for SRAM and logic that delivers higher performance through larger effective channel width and improved electrostatics at smaller nodes. The post How Self-Aligned CFET Technology Could Extend CMOS Scaling Beyond 10 appeared first on Semiconductor Engineering… 22-10-2026
Stacked-Die Multi-Chip Architectures: The Tradeoff Between Scaling And Power Delivery
Integrated voltage regulators reduce current density provide higher regulation bandwidth and reduce reliance on large decoupling capacitor networks. The post Stacked-Die Multi-Chip Architectures: The Tradeoff Between Scaling And Power Delivery appeared first on Semiconductor Engineering… 22-10-2026
What Breaks When Packaging Moves From Wafer To Panel
Engineers are discovering many things they thought were process assumptions were actually wafer assumptions. The post What Breaks When Packaging Moves From Wafer To Panel appeared first on Semiconductor Engineering… 22-10-2026
Foundries And OSATs Increasingly Overlap
Advanced packaging growth and capacity constraints are pushing more onto OSATs. The post Foundries And OSATs Increasingly Overlap appeared first on Semiconductor Engineering… 22-10-2026
Hydrogen truck for Dakar Rally
Toyota is to enter a hydrogen-powered truck pictured with driver Dania Akeel in the January 2027 Dakar Rally. The truck is a hydrogen fuel cell version of the ICE Hilux The post Hydrogen truck for Dakar Rally appeared first on Electronics Weekly… 22-10-2026
Flapping Airplanes raises 1bn
Flapping Airplanes a one year-old San Francisco AI neolab has raised 1 billion at a 6 billion valuation before it has put a product on the market. Neolab denotes an The post Flapping Airplanes raises 1bn appeared first on Electronics Weekly… 22-10-2026
Photon Bridge raises 10m
Photon Bridge the Dutch photonics specialist has raised 10 million to tackle an emerging bottleneck in AI infrastructure: producing the millions of lasers that will be needed to connect increasingly The post Photon Bridge raises 10m appeared first on Electronics Weekly… 22-10-2026