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Итоги выставки Газ. Нефть. Технологии - 2026

С 26 по 29 мая 2026 года компания Теллур Электроникс приняла участие в международной выставке Газ. Нефть. Технологии 2026 которая прошла в Уфе и традиционно собрала ведущих представителей нефтегазовой отрасли промышленности и приборостроения. В течение четырех дней специалисты компании проводили встречи с действующими и потенциальными партнерами обсуждали актуальные задачи предприятий… 04-06-2026

Модуль охлаждения полупроводников от A-MEC

A-MEC представляет модуль охлаждения полупроводников оснащённый двумя алюминиевыми радиаторами и двумя вентиляторами. 03-06-2026

Герметичные разъёмы ZH28 аналоги СНЦ28

Компания Теллур Электроникс начала поставки герметичных цилиндрических соединителей ZH28. Данные разъёмы фиксируются квадратным фланцем на приборную панель под 4 винта и имеют изолятор из стеклянного спая. Являются аналогом российской серии СНЦ28. Аналог ZH28 Российский артикул СНЦ28 ZH28-10/18B-1-b-B СНЦ28-10/18В-1-б-В ZH28-10/18B-1-B СНЦ28-10/18В-1-В ZH28-10/22B-1-b-B СНЦ28-10/22В-1-б-В… 02-06-2026

Официальный сайт Neditek полностью обновлён: новая структура новые каталоги и раздел о качестве

Компания Neditek NEDI Technology Co. Ltd. в апреле 2026 запустила полностью новую версию официального сайта. 01-06-2026

Коннекторы до 500 C и 200 МПа для геофизического оборудования от Sunkye

Sunkye разработала специальные версии высокотемпературных соединителей для работы при температуре до… 28-05-2026

4-канальный приемопередающий модуль трансивера X-диапазона от Hisiwell

Компания Hisiwell представляет SiP-трансивер System in Package transceiver с четырьмя независимыми радиочастотными каналами X-диапазона модуль HX9X40210G20. 27-05-2026

Квантово-каскадные лазеры Фабри-Перо от Thorlabs

Компания Thorlabs анонсировала квантово-каскадный лазер Фабри-Перо… 26-05-2026

Nidec debuts highest capacity in-rack cooling prototype

At Interop Tokyo 2026 Nidec will introduce a prototype in-rack CDU coolant distribution unit with a cooling capacity of up to 300kW. The CDU is designed to manage the thermal ... The post Nidec debuts highest capacity in-rack cooling prototype appeared first on Electronics Weekly… 08-06-2026

PM applauds British brains

The Prime Minister s speech to London Tech Week this morning showed an appreciation of British brain power. Sir Keir said that the UK gets half of all the tech startup ... The post PM applauds British brains appeared first on Electronics Weekly… 08-06-2026

QPT unveils AI-driven design service for optimizing thermal interface layer

Independent power electronics company Quantum Power Transformation QPT Ltd of Cambridge UK which was founded in 2019 and develops gallium nitride GaN -based electric motor controls has unveiled qDesign an AI-driven generative design service that programmatically generates simulates and iterates on QPTs patented qAttach thermal interface layer for any power module replacing weeks… 08-06-2026

onsemi s role in NVIDIA MGX ecosystem expanding into 800VDC power architectures

As hyperscalers and enterprise operators race to build increasingly powerful AI infrastructure power delivery and energy efficiency are emerging as the most critical constraints. Industry analysts estimate that AI rack power requirements could grow beyond 1MW/rack in the very near… 08-06-2026

Qorvo showcasing RF solutions with live demos and technical participation at IMS

In booth 20036 at 2026 IEEE MTT-S International Microwave Symposium IMS in Boston MA USA 7 12 June Qorvo Inc of Greensboro NC USA which provides core technologies and RF solutions for mobile infrastructure and defense applications is highlighting its latest innovations under the theme: Proven RF Solutions. Live at… 08-06-2026

CGD s new 650V ICeGaN device for automotive applications helps increase EV range

Fabless firm Cambridge GaN Devices Ltd CGD which was spun out of the University of Cambridge in 2016 to design develop and commercialize power transistors and ICs that use GaN-on-silicon substrates has developed a 650V GaN IC for automotive applications that addresses automakers desire to improve inverter efficiency. ICeGaN helps designers to realise smaller lighter inverters that help… 08-06-2026

Fixing the Failure of the Reevo

There are a lot of traditional features of a bike that rarely change. The spokes the chain and the inability for it to take off like a rocket to mention read… 08-06-2026

Antenna-First Design: The RF Shift IoT Cannot Avoid 

Wireless IoT devices are shrinking while adding bands and certification complexity. Antenna integration can t wait until after layout lock. The post Antenna-First Design: The RF Shift IoT Cannot Avoid  appeared first on EE Times… 08-06-2026

Embedded World Video: AMD on what s changing for AI and industrial robotics

At Embedded World 2026 we caught up with AMD s Senior Director of Embedded Product Marketing Amey Deosthali as part of our promotional coverage for the event. He talks about how ... The post Embedded World Video: AMD on what s changing for AI and industrial robotics appeared first on Electronics Weekly… 08-06-2026

Embedded World Video: AMD on FPGA Innovation and AI at the Edge

We recently caught up with AMD s Director of FPGA Solutions Manuel Uhm as part of our promotional coverage for Embedded World 2026. He discusses how FPGAs are enabling efficient AI ... The post Embedded World Video: AMD on FPGA Innovation and AI at the Edge appeared first on Electronics Weekly… 08-06-2026

Radiosondes: Disposable guardians of the sky

Radiosondes precision tool for science and playground for exploration continue to inspire both professionals and hobbyists. The post Radiosondes: Disposable guardians of the sky appeared first on… 08-06-2026

Disturbance In Verification

We have started to see what may be the largest disturbance in the role of a verification engineer since the founding of the industry. Should you be worried The post Disturbance In Verification appeared first on Semiconductor Engineering… 08-06-2026

Chip Industry Technical Paper Roundup: June 8

IGZO FeFET AI memories zero-knowledge proof acceleration Rowhammer in monolithic 3D eDRAM monolayer TMD nanoribbon transistors graph attention virtual metrology selective-area III-V MBE open-source DNN accelerators ultra-low-power AI-MCUs for transformers. The post Chip Industry Technical Paper Roundup: June 8 appeared first on Semiconductor Engineering… 08-06-2026

Research Bits: June 8

Multi-tasking transistor p-bit fabrication tiny MoS2 nanotubes. The post Research Bits: June 8 appeared first on Semiconductor Engineering… 08-06-2026

Connectivity Revolution or Evolution Inside Data Centers

AI transforms intra-data center networking accelerating optical innovation while extending decades-long evolution in high-performance connectivity. The post Connectivity Revolution or Evolution Inside Data Centers appeared first on EE Times… 08-06-2026

Rinse and Repeat for Intel 14A

Intel s five-nodes-in-four years process technology catch-up was an attempt to go too far too fast said CFO David Zinsner at  at the Bank of America 2026 Global Technology Conference in ... The post Rinse and Repeat for Intel 14A appeared first on Electronics Weekly… 08-06-2026