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SDR модули CR-P401D и CR-P501D от Cruetech SDR модули CR-P401D и CR-P501D от Cruetech
Компания Макро Групп предлагает SDR модули от бренда Cruetech CR-P401D… 18-03-2026
SDR модули CR-P401D и CR-P501D от Cruetech
Компания Макро Групп предлагает SDR модули на базе СнК Zynq MP-SOC от бренда Cruetech CR-P401D… 18-03-2026
DIASOM на выставке АВТОМАТИЗАЦИЯ. ЭЛЕКТРОНИКА. ЭЛЕКТРОТЕХ. СВЕТ DIASOM на выставке АВТОМАТИЗАЦИЯ. ЭЛЕКТРОНИКА. ЭЛЕКТРОТЕХ. СВЕТ
DIASOM представил свою продукцию на международной выставке АВТОМАТИЗАЦИЯ. ЭЛЕКТРОНИКА. ЭЛЕКТРОТЕХ. СВЕТ 17 19 марта 2026 года в Минске. 17-03-2026
Промышленные столы Актаком с ESD столешницей Промышленные столы Актаком с ESD столешницей
Предлагаем к поставке различные разновидности промышленных столов Актаком с ESD столешницей. Уже сейчас в наличии имеются столы с антистатическими столешницами 100 и 150 см с цветовым исполнением каркаса RAL-8017 и RAL-9006 с минимальными сроками изготовления можно заказать столы со столешницей… 17-03-2026
Приглашаем посетить наш стенд на выставке ExpoElectronica 2026 Приглашаем посетить наш стенд на выставке ExpoElectronica 2026
Уважаемые клиенты и партнеры Приглашаем вас посетить наш стенд на международной выставке ExpoElectronica 2026 которая пройдет в Москве в МВЦ Крокус Экспо с 14 по 16 апреля. ExpoElectronica является крупнейшей выставкой электронной отрасли в Евразии объединяющей производителей поставщиков и разработчиков электронных компонентов и технологий. На нашем стенде C5061 вы сможете ознакомиться… 16-03-2026
Новинка Ремонтный паяльный комплекс Актаком ASE-4213 Новинка Ремонтный паяльный комплекс Актаком ASE-4213
Представляем новый ремонтный паяльный комплекс Актаком ASE-4213 который совмещает в одном корпусе два независимых канала: радиомонтажный мощностью 70 Вт и термовоздушный с максимальной мощностью 1280… 16-03-2026
Герметичные разъемы на основе сплава КОВАР от SUNKYE
SUNKYE представила герметичные разъемы на основе сплава КОВАР 4J29 и 4J50… 16-03-2026
Разъем USB 4.0 Type-C со скоростью до 40 Гбит/с от компании OUPIIN
Компания OUPIIN выпустила разъем USB 4.0 Type-C серии 8976 с поддержкой скорости передачи данных до 40 Гбит/с. 16-03-2026
Guerrilla RF expands aerospace defense focus with new SatCom initiative
Guerrilla RF Inc GRF of Greensboro NC USA which develops and manufactures radio-frequency integrated circuits RFICs and monolithic microwave integrated circuits MMICs for wireless applications says that it has expanded its focus and readiness to support the rapidly evolving satellite communications SatCom market. With a portfolio spanning low-noise small-signal devices through… 19-03-2026
Scoping out the chiplet-based design flow Scoping out the chiplet-based design flow
The chiplets design combines IP access interposer expertise and relationships with HBM suppliers foundries and OSATs worldwide. The post Scoping out the chiplet-based design flow appeared first on… 19-03-2026
Robots That Catch Mistakes Early Robots That Catch Mistakes Early
A new system lets robots read human brain signals to detect mistakes early and react in real time reducing delay and improving control in critical tasks. Robots usually react after a mistake happens. A team at Oklahoma State University is working on a system that lets robots respond the moment a human senses something… 19-03-2026
Simple MIDI Sample Player Runs on ESP32 Simple MIDI Sample Player Runs on ESP32
Jakub is a musician and found himself in need of a simple way to trigger samples via MIDI when on stage. So many commercial solutions exist but most were overkill read… 19-03-2026
NVIDIA Presents GaN Supplier Award to Innoscience for AI Datacenter 800 VDC Rack Power Support
NVIDIA honored Innoscience for advancing 800VDC rack power and delivering high-efficiency GaN solutions for next-generation AI data centers. The post NVIDIA Presents GaN Supplier Award to Innoscience for AI Datacenter 800 VDC Rack Power Support appeared first on EE Times… 19-03-2026
Power Chip That Makes Systems Smaller and Faster
A new power device could change how high voltage systems are designed by simplifying architectures reducing cost and replacing existing approaches. Wolfspeed has announced the industry s first commercially available 10 kV silicon carbide SiC power MOSFET. It is aimed at high-voltage systems where it enables more flexible system design improves durability and supports reliable… 19-03-2026
Platform Targets Real-World AI Bottlenecks Platform Targets Real-World AI Bottlenecks
A new emulation system focuses on validating AI infrastructure under realistic workloads helping operators optimise performance before deployment. As AI adoption shifts from model training to real-world deployment a newly launched platform from Keysight Technologies aims to solve one of the industry s biggest challenges: validating and optimising inference performance at scale. The system… 19-03-2026
Ultra-Low Power Kit for Presence Sensing
The presence detection kit helps devices use less power work in crowded signals and makes it easier to build and launch connected products quickly. SPARK Microsystems has announced a new presence detection kit PDK that enables designers to overcome the limitations of legacy wireless connectivity for next-generation smart devices with advanced presence detection capabilities. Presence-aware 19-03-2026
400G Photonics Integration Progress 400G Photonics Integration Progress
New TGV-based board advances high-speed optical engine testing OpenLight and Suzhou TFC Optical Communication have advanced silicon photonics back-end integration with a new evaluation platform supporting data rates up to 400G signalling continued progress in scaling optical interconnect performance for next-generation networks. At the centre of the development is the OLP-PM13306 evaluation… 19-03-2026
Quantifying The Impact Of Gravity On Strip Warpage Across Assembly Stages
Closing the gap between warpage simulation results and actual measurement data. The post Quantifying The Impact Of Gravity On Strip Warpage Across Assembly Stages appeared first on Semiconductor Engineering… 19-03-2026
Exploring The Frontiers Of Lithography And Patterning: Highlights From SPIE Advanced Lithography Patterning 2026
High NA EUV s reduced field size is driving new innovation in optical proximity correction and mask synthesis. The post Exploring The Frontiers Of Lithography And Patterning: Highlights From SPIE Advanced Lithography Patterning 2026 appeared first on Semiconductor Engineering… 19-03-2026
Process Model Precision: Calibrating For Accurate Predictions Of FinFET Device Profiles
Matching a simulated device to its real-world counterpart with sub-nanometer accuracy. The post Process Model Precision: Calibrating For Accurate Predictions Of FinFET Device Profiles appeared first on Semiconductor Engineering… 19-03-2026
Scaling AI Infrastructure: Overcoming Interconnect Bottlenecks Via CPO And Heterogeneous Integration
Co-packaged optics face scaling challenges such as bandwidth density mismatches assembly complexity and the need for precise fiber alignment. The post Scaling AI Infrastructure: Overcoming Interconnect Bottlenecks Via CPO And Heterogeneous Integration appeared first on Semiconductor Engineering… 19-03-2026
Liquid Cooling Drives Other Localized Cooling
Chips that didn t need cooling may require it now. The post Liquid Cooling Drives Other Localized Cooling appeared first on Semiconductor Engineering… 19-03-2026
2D Semiconductors Inch Forward
Progress is steady but fundamental questions remain. The post 2D Semiconductors Inch Forward appeared first on Semiconductor Engineering… 19-03-2026
Aligning The Semiconductor Value Chain In A Virtuous AI Cycle At SEMICON Korea 2026
Using AI to transform semiconductor operations which in turn advances the next generation of AI systems. The post Aligning The Semiconductor Value Chain In A Virtuous AI Cycle At SEMICON Korea 2026 appeared first on Semiconductor Engineering… 19-03-2026