Пусть errata поживает. Конечно я могу прошуршать по-быстрому DS, RM, освежить свою пaмять и привести здесь характеристики, подвига в этом не будет. Там масса всяких моментов. Но вопрос у меня по "бомбовости" Renesas. Если именно в этом его бомба, ну, какая-то она не сильно ядрёная получается. :)
STM32F756:
The Flash memory has the following main features:
• Capacity up to 1 Mbyte
• 256 bits wide data read
• Byte, half-word, word and double word write
• Sector and mass erase
The Flash memory is organized as follows:
• A main memory block divided into 4 sectors of 32 Kbytes, 1 sector of 128 Kbytes, and 3
sectors of 256 Kbytes
• Information blocks containing:
– System memory from which the device boots in System memory boot mode
– 1024 OTP (one-time programmable) for user data
– The OTP area contains 16 additional bytes used to lock the corresponding OTP
data block.
– Option bytes to configure read and write protection, BOR level, watchdog, boot
memory base address, software/hardware and reset when the device is in
Standby or Stop mode.
The embedded flash has three main interfaces:
• 64-bits ITCM interface:
– It is connected to the ITCM bus of Cortex-M7 and used for instruction execution
and data read access.
– Write accesses are not supported on ITCM interface
– Supports a unified 64 cache lines of 256 bits (ART accelerator)
• 64-bits AHB interface:
– It is connected to the AXI bus of Cortex-M7 through the AHB bus matrix and used
for code execution, read and write accesses.
– DMAs and peripherals DMAs data transfer on flash are supported only through the
AHB interface.
• 32-bits AHB register interface:
– It is used for control and status register accesses.