Схемы, платы, компоненты

Ну и до кучи: http://frontdoor.biz/HowToPCB/HowToPCB-extra/CADlib.pdf
Non-collapsing - this is normally employed for 0.50 mm pitch and smaller BGAs, where the land (pad) is larger than the ball to allow for via-in-pad technology and to provide an adequate annular ring. The solder mask can be the same size as the land with non-collapsing balls. Стр 33, 35 по ссылке.