ARM, RISC-V контроллеры

Воззрения STM на разводку корпусов 448-pin LFBGA package: 18 x 18 mm, 0.8 mm pitch package enabling a 6-layer plated-through hole (PTH) PCB - это как я понял VIA-in-PAD? 354-pin LFBGA package: 16 x 16 mm, 0.8 mm pitch package enabling a 4-layer PTH PCB 361-pin TFBGA package: 12 x 12 mm, 0.5 mm pitch package enabling a 4-layer PTH and laser-drilled via PCB 257-pin TFBGA package: 10 x 10 mm, 0.5 mm pitch package enabling a 4-layer PTH PCB