Схемы, платы, компоненты

Николай Дмитриевич Кузнецов, 1911 год

Тест Тьюринга, 1950 год

Макро Групп - официальный поставщик резисторов RESURS производства компании АО РЕСУРС: Компания Макро Групп заключила соглашение с компанией АО Ресурс о поставках её продукции выпускаемой под торговой маркой RESURS… 22-06-2026

Источники питания драйверы для светодиодных ламп и прожекторов: Драйверы для светодиодных ламп и прожекторов. Аналоги ARPV-LG48100-PFC-A ARPJ-KE421400A и ARPJ-KE401050A 19-06-2026

Источники питания драйверы для светодиодных ламп и прожекторов: Источники питания драйверы для светодиодных ламп и прожекторов. Аналоги ARPV-LG48100-PFC-A ARPJ-KE421400A и ARPJ-KE401050A 18-06-2026

Опция XDS батарея для осциллографов АКТАКОМ ADS-6000: немедленно со склада: На сайте снова появилась возможность заказать востребованный аксессуар для модернизации измерительной техники аккумуляторный блок питания XDS для осциллографов серии… 18-06-2026

Умные помощники: обзор ИИ-сервисов для обработки изображений. Часть 2 актуализированная: Технологии искусственного интеллекта продолжают активно наращивать своё присутствие в потребительском сегменте. Подтверждением этому служит наша очередная подборка веб-инструментов способных оказать неоценимую помощь при работе с графическими файлами 18-06-2026

Высокочастотные компоненты и корпуса для сборок - со склада в Москве: 3 5 ГГц усилитель TQP3M9028 разъём J01151A0201 47 ГГц Si/Ge транзистор фильтр LFCN-1000 экранированный корпус 3710.16 и много другое - со склада в Москве. 17-06-2026

Скидка 15% на широкий ассортимент промышленной мебели: С 16 июня по 1 сентября 2026 года на широкий ассортимент промышленной мебели включая промышленные столы АКТАКОМ со столешницей в стандартном исполнении а также на ряд сопутствующих позиций предоставляется скидка 15% от розничной цены. Товары доступны к заказу с минимальными сроками поставки. 16-06-2026

200G QSFP56 трансиверы DAC и AOC от Cruetech: экономически эффективное масштабирование сетевой инфраструктуры ЦОД: Российский бренд Cruetech расширяет линейку поставляемых оптических компонентов и представляет высокопроизводительные решения 200G в форм-факторе QSFP56 с интерфейсом… 15-06-2026

Why Real-Time LLM Performance Still Hits a Wall Despite Faster GPUs: Benchmark gains often mask a deeper challenge: memory-bound token generation remains LLM inference s limiting factor. The post Why Real-Time LLM Performance Still Hits a Wall Despite Faster GPUs appeared first on EDN Asia… 23-06-2026

Synopsys Rolls Out Multiphysics Fusion Solutions to Tackle Advanced Chip Design Complexity: New portfolio integrates EDA and multiphysics analysis accelerating signoff design closure and multi-die development. The post Synopsys Rolls Out Multiphysics Fusion Solutions to Tackle Advanced Chip Design Complexity appeared first on EDN Asia… 23-06-2026

DigiKey Sponsors AIoT Design Challenge 2026: The AIoT Design Challenge 2026 aims to foster innovation at the intersection of AI and the Internet of Things. The post DigiKey Sponsors AIoT Design Challenge 2026 appeared first on EDN Asia… 23-06-2026

Dynamic RAM from First Principles: Before the past year many of us took computer memory for granted. It was one of the lower-cost parts of a PC build and was usually available in whatever quantity read… 23-06-2026

Few European Transistors In ARINC Spec: A NEW specification from Aeronautical Radio Inc ARINC covering the selection and application of transistors lists 44 different types recommended for usecin civil aviation equipment. But only five of them ... The post Few European Transistors In ARINC Spec appeared first on Electronics Weekly… 23-06-2026

LightComposer - Reach Out and Touch Your Lighting: While there is a time and place for wirelessly controlled devices sometimes you want something you can just reach out and touch to interact with no apps to install or read… 23-06-2026

Investigating Annealing as Fix for Poor CF Adhesion in 3D Prints: After recently publishing a few videos covering research into the poor adhesion between chopped carbon fiber CCF and the thermoplastic filaments as used with FDM 3D printing some of the read… 22-06-2026

Advancements In Atomic-Scale Plasma Processing: Researchers from Nagoya University Boise State University Korea Institute of Fusion Energy Hitachi High-Tech Corp. and Princeton Plasma Physics Laboratory published a technical paper titled Recent Progress in Atomic-Scale Controlled Plasma Processing. Abstract Excerpt: Atomic-scale control in plasma processing is becoming increasingly critical for fabricating of advanced semiconductor… 22-06-2026

Breaking Into a Prison Tablet: Usually the term jailbreaking isn t meant to be taken quite that literally but in the case of the US prison tablet that Hugh Jeffreys got sent it s really quite apt. read… 22-06-2026

Interference Risks In Processing-Using-DRAM U. of Tokyo ETH Zurich CISPA Riken: Researchers from The University of Tokyo ETH Zurich CISPA and RIKEN published a technical paper titled PuDGhost: Experimental Analysis of Computation Result Corruption in Processing-using-DRAM Operations on Real DRAM Chips and Implications for Future Systems. Abstract excerpt: We reveal PuDGhost an interference phenomenon where a PuD operation in a given column produces erroneous results… 22-06-2026

Atom Probe Framework Tracks Phase Instability In Si-Doped Gallium Oxide SUNY Ohio State LLNL: Researchers from University at Buffalo-SUNY The Ohio State University and Lawrence Livermore National Laboratory published a technical paper titled Coordination-Sensitive Nanoscale Analysis of Defect-Driven Phase Transformation in Si-Doped AlxGa1 x 2O3. Abstract excerpt: Defect-driven phase instability critically influences the structural reliability of ultrawide bandgap oxides yet direct… 22-06-2026

ASML TSMC and imec present 300mm integration route for industry-ready 2D-material-based transistors: In partnership with equipment provider Advanced Semiconductor Materials Lithography ASML of Veldhoven The Netherlands and foundry Taiwan Semiconductor Manufacturing Corp TSMC nanoelectronics research center imec of Leuven Belgium has presented a novel robust and scalable 300mm integration route for 2D-material-based nFETs and pFETs at the 2026 IEEE/JSAP Symposium on VLSI Technology … 22-06-2026

Critical Components for Reliable Factory Automation Design: This webinar will provide a practical overview of product selection and implementation within factory automation applications. The post Critical Components for Reliable Factory Automation Design appeared first on EE Times… 22-06-2026

GlobalFoundries Qualinx Put Europe s Chip Sovereignty to the Fab Test: GlobalFoundries and Qualinx deliver Europe s first fully secure chip supply chain. The post GlobalFoundries Qualinx Put Europe s Chip Sovereignty to the Fab Test appeared first on EE Times… 22-06-2026

AdapSkin stretchable sensor improves AI-driven prosthetic control: Michigan State University recently released news on its AdapSkin wearable sensor platform which collects biological data more accurately to improve responsive assistive devices. Skin-interfaced wearable health technology has a hidden flaw: Many systems work best on smoother skin which tends to be on younger bodies not the older adults who often need them most. This The post AdapSkin… 22-06-2026

Rockwell launches FactoryTalk Orchestration software: Rockwell Automation Inc. has announced FactoryTalk Orchestration software a solution designed to coordinate material flow and production processes from end to end. Rockwell will demonstrate the software at the Automate trade show taking place June 22-25 in Chicago. FactoryTalk Orchestration software is part of Rockwell s production logistics approach connecting automated equipment with… 22-06-2026