О смысле всего сущего

Кастомизированный шлейф для подключения к OrangePi 5: Кастомизированный шлейф который позволяет подключить наши модули DS-CIMX напрямую к платформе OrangePi… 05-05-2026

SDR модуль CR-P151Q от Cruetech: SDR модуль на СнК AMD XCZU15EG-2FFVB1156I - CR-P151Q под брендом… 04-05-2026

Совместимость модуля DS-RK3568 от Диасом с российской операционный системой РЕД ОС: Подтвердили совместимость DS-RK3568 с операционной системой РЕД… 28-04-2026

Модули широкополосных источников света от Box Optronics: Компания Box Optronics запустила серийные поставки модулей широкополосных источников света BSLD-840-7SM-FA-M. 28-04-2026

Выгодное предложение Cнижение цен на импульсные источники питания Актаком: Сообщаем о значительном снижении цен на популярные модели импульсных источников питания Актаком APS-5310 30 В/10 А и APS-3020 30 В/20… 27-04-2026

Радифотоника от Cruetech. Оптоэлектронный модуль 10-100 МГц: Оптоэлектронный модуль 10 100 МГц Cruetech состоит из передатчика и приёмника. 23-04-2026

Скидка 15% на имульсные тестеры обмоток Актаком АМ-3085 и АМ-3083: Акция на импульсные высоковольтные тестеры обмоток Актаком продлена До 1 июня 2026 года со скидкой 15% можно приобрести не только АМ-3085 но и его младшего собрата -АМ-3083. 22-04-2026

AI Will Not replace Engineers But It Will Remove Their Repetitive Work - Suresh Kumar Muthusamy ZettaOne Technologies: PCB design has moved beyond component placement. AI now generates symbols footprints and translates designs across multiple CAD tools automatically. Nidhi Agarwal and Saba Aafreen from EFY speak with Suresh Kumar Muthusamy of ZettaOne Technologies to explore the technology strategy and vision behind PCBPartz a platform redefining PCB design workflows and automation. Q. What… 06-05-2026

SiGe Chip Hits 500Gbps Barrier: A silicon-germanium chip reaches 500Gbps data speeds redefining high-frequency performance and signalling a major shift for next-generation electronics high-speed interconnects and data-intensive computing infrastructure worldwide. A silicon-germanium SiGe chip has achieved a record-breaking 500Gbps data transmission speed setting a new benchmark for high-frequency semiconductor performance. 06-05-2026

Earthworms Don t Bio-Accumulate Microplastics So There May be Hope For Us: Microplastics absolutely saturate the Earth s environment and that s probably not a good thing unless you re looking for a sediment marker for the Anthropocene period. On the other hand environmental contamination read… 06-05-2026

Top Ten Lenders To Datacentre Companies: Thanks to TMT Finance for this one the ten biggest lenders to datacentre companies last year: Sumitomo Mitsui Banking Corporation SMBC Mitsubishi UFG Bank MUFG J.P. Morgan Morgan Stanley ... The post Top Ten Lenders To Datacentre Companies appeared first on Electronics Weekly… 06-05-2026

Defeating the Works By Design s Unpickable Lock: Even though the very concept of an unpickable lock is as plausible as making water not be wet this doesn t take away from the intellectual thrill of devising solutions to read… 06-05-2026

A Detailed Evaluation of A Production Server With High-End MRDIMM Main Memory BSC Micron Intel UPC: A new technical paper Performance and Energy Benefits of MRDIMMs was published by researchers at Barcelona Supercomputing Center Universitat Politecnica de Catalunya Micron and Intel Corporation. Abstract Multiplexed Rank DIMMs MRDIMMs have recently emerged as memory devices that enable higher bandwidth without increasing DRAM chip frequencies. This paper presents a detailed performance 06-05-2026

GPU Power Prediction Tool for AI Workloads MIT IBM: A new technical paper EnergAIzer: Fast and Accurate GPU Power Estimation Framework for AI Workloads was published by researchers at MIT and IBM Research. Abstract As AI workloads drive increases in datacenter power consumption accurate GPU power estimation is critical for proactive power management. However existing power models face a scalability bottleneck not in the... read more… 05-05-2026

Pre-Silicon Verification and Validation Methodology Targeting Robust RISC-V Chip Designs BSC: A new technical paper Verification and Validation V V -in-the-Loop for RISC-V Design: The Holistic Vision of BZL was published by researchers at Barcelona Supercomputing Center. Abstract The Barcelona Zetascale Lab BZL project aims to strengthening Europe s capacity in the design and manufacture of RISC-V based high-performance computing chips. In this context we present a holistic… 05-05-2026

Foundry-Compatible Grating Couplers Using an Inverse Design Framework Yale: A new technical paper Multimode grating couplers via foundry-compliant inverse design was published by researchers at Yale University. Abstract We apply a systematic inverse design approach to discover foundry-compliant multilayer grating couplers that can efficiently couple a number of independent waves from free space to on-chip propagating modes. For visible- and near-infrared couplers… 05-05-2026

SDVs: Modular Drive Architecture Using Power-Packet-Based Sensorless Control Kyoto U.: A new technical paper Modular Drive Architecture for Software-defined Vehicles Enabled by Power-packet-based Sensorless Control was published by researchers at Kyoto University. Abstract The transition toward software-defined vehicles requires standardization and modularization of hardware decoupled from software along with centralized electrical/electronic architectures. While electrified… 05-05-2026

Replacing GPU Compute Dies With PNM-Enabled HBM Cubes For Long-Context Decode Attention UCSD Columbia Yonsei U. NVIDIA Samsung: A new technical paper AMMA: A Multi-Chiplet Memory-Centric Architecture for Low-Latency 1M Context Attention Serving was published by researchers at UC San Diego Columbia University Yonsei University NVIDIA and Samsung. Abstract All current LLM serving systems place the GPU at the center from production-level attention-FFN disaggregation to NVIDIA s Rubin GPU-LPU heterogeneous… 05-05-2026

Cutting Steel Gears with Homemade EDM: Electrostatic discharge machining EDM may be slower than alternatives like laser cutting water jets or a milling machine but for some applications there s no alternative: it can cut through any read… 05-05-2026

Understanding Why Drain-Current in GAAFETs Deviates from Thermionic Dependence at Negative Gate Voltages Sandia National Lab LIST: A new technical paper Gate-Drain Leakage Enhanced by Drain-Induced Dielectric Barrier Lowering in Gate-All-Around Field Effect Transistors was published by researchers at Sandia National Laboratories and Luxembourg Institute of Science and Technology. Abstract Gate-All-Around Field-Effect Transistors GAAFETs now entering high-volume production as successors to fin field-effect transistor… 05-05-2026

UK Semiconductor Centre appoints first CEO: The UK Semiconductor Centre UKSC has appointed its first chief executive officer to deliver on its vision of establishing the UK as a global leader in semiconductors by accelerating scale-up investment and commercial growth across… 05-05-2026

Using NFC to Power Devices Instead of Qi: It shouldn t be any surprise that NFC and similar RFID implementations are capable of providing power to a receiver since this is after all how RFID tags can work without read… 05-05-2026

How Giant Tanks Of Fluid Could Help Support The Power Grid: If you ve been paying any attention to the renewable energy space you ll know that generation isn t really the problem anymore. Solar panels are cheap and wind turbines are everywhere. The read… 05-05-2026