ARM, RISC-V контроллеры

Выставка ЭКСПОЭЛЕКТРОНИКА 2026 в Крокус Экспо 14-16 Апреля 2026

Компания РАДИОТЕХ примет участие в 28-й Международной выставке электроники ExpoElectronica 2026 которая пройдёт с 14 по 16 апреля 2026 года в Московском выставочном центре Крокус Экспо Павильон 3 . На стенде компании посетители выставки смогут: - Ознакомиться с новинками поставляемой продукции - Получить консультации технических специалистов по подбору компонентов для различных... 16-02-2026

Процессор для AIoT применения от Rockchip

Процессор для AIoT RK3562 от Rockchip получил награду Продукт с выдающимися рыночными показателями… 16-02-2026

Дешевле до 50% Монтажные наконечники для паяльных станций Актаком

Снижаем цены до 50% на самые популярные модели наконечников и наконечников-картриджей применяемых в монтажных паяльных станциях Актаком. 13-02-2026

Процессорные модули Jetson NVIDIA в каталоге Макро Групп

Макро Групп анонсирует начало поставок процессорных модулей NVIDIA… 12-02-2026

Популярные модели токовых клещей Актаком серии АТК

Предлагаем уникальные модели токовых клещей Актаком серии АТК которые долгие годы пользуются повышенной популярностью у профессионалов в области энергетики. Готовы к поставке токоизмерительные клещи -ваттметр АТК-2200 до 1200 кВт универсальная модель АТК-2250 до 2500 А микротоковые клещи АТК-2001 а также токовые клещи с гибким магнитопроводом АТК-2011 и АТК-2012 10-02-2026

Приглашаем посетить наш стенд на ТБ Форум-2026

Компания Макро ЕМС приглашает посетить выставку в рамках международного форума Технологии и безопасность 2026 в Москве. 10-02-2026

Неохлаждаемый инфракрасный модуль с разрешением 1280 1024 от InfiRay

Компания InfiRay анонсировала компактный неохлаждаемый инфракрасный модуль с разрешением 1280 1024 предназначенный для интеграции в современные оптико-электронные системы … 05-02-2026

Наконечники для термофенов паяльных станций Актаком дешевле до 69%

До 69% снижены цены на практически всю номенклатуру сопел для пайки горячим воздухом термофенов паяльных станций и ремонтных центров с термовоздушных каналом 04-02-2026

120 kW Grid-Tied Inverter Test Platform 

The high-capacity automated system strengthens North India s access to advanced standards-compliant solar inverter validation infrastructure. India s rapidly expanding solar market has gained a significant boost with the introduction of a 120 kW grid-tied inverter GTI test system by Exeliq Tech Solutions designed to meet rising compliance safety and performance validation demands. The… 17-02-2026

Edge AI Platform With Real-Time Intelligence

The new edge-first system integrates industrial AI software with GPU-accelerated infrastructure to reduce latency protect data and fast-track adoption across manufacturing clusters. India s push to embed artificial intelligence into factories and critical infrastructure is getting a new edge-focused boost with the launch of YodaEdge a pre-integrated platform designed to run AI workloads… 17-02-2026

AI Chips Optimize Yeast Protein Coding

MIT s AI system boosts precision protein drug production cutting development costs by learning the language of genetic sequences. In a move that signals deeper convergence between artificial intelligence and bio-manufacturing electronics researchers at the Massachusetts Institute of Technology MIT have developed an advanced large language model-based tool that could significantly reduce… 17-02-2026

A Lidar That Sees Motion In 4D

This 4D LiDAR sensor sees all around tracks speed and distance together and helps machines move safely in tight spaces. Let us find out more Aeva has introduced Omni a short-range 4D LiDAR sensor for physical AI systems that need awareness in close spaces. Omni provides a 360-degree horizontal and 90-degree vertical field… 17-02-2026

Ultra-Compact Radar Chip Advances 6G

0.24 mm low-power FMCW design targets 6G sensing-communication convergence in edge electronics. Tokyo scientists have unveiled a tiny radar-on-chip prototype that could reshape future wireless hardware for beyond-5G and 6G ecosystems marrying sensing with communications in a power-lean design.  Developed at Japan s Institute of Science Tokyo the new chip packs a high-precision Frequency-Modulat 17-02-2026

New Class Of Semiconductors Made Of Germanium-Tin Alloy University of Edinburgh et al.

A new technical paper High Pressure and Compositionally Directed Route to a Hexagonal GeSn Alloy Class was published by researchers at the University of Edinburgh GFZ Helmholtz Centre for Geosciences the University of Lille Grenoble Alpes University the University of Bayreuth and the European Synchrotron facility. Abstract Despite their electronic dominance cubic diamond structured… 17-02-2026

What the FDA s 2026 Wellness Device Update Means for Wearables

With more and more sensors being crammed into the consumer devices that many of us wear every day the question of where medical devices begin and end and how they read… 17-02-2026

Less Power and Higher Performance With A Nanolaser With Extreme Dielectric Confinement DTU

A new technical paper titled A nanolaser with extreme dielectric confinement was published by researchers at Technical University of Denmark DTU . Abstract The interaction between light and matter can be enhanced by spatially concentrating the light field and extending photon dwell time. Plasmonic structures can provide strong light confinement but suffer from ohmic losses. Recent... read… 17-02-2026

Electromechanical polishing of semiconductor wafers

ELECTROCHEMICAL polishing of wafers of semiconducting material is claimed to be faster  more efficient and to offer a 50% saving in cost over conventional methods So 65 years ago started ... The post Electromechanical polishing of semiconductor wafers appeared first on Electronics Weekly… 17-02-2026

A Basic Guide To Shielding

GreatScott has recently been tinkering in the world of radio frequency emissions going so far as to put their own designs in a proper test chamber to determine whether they read… 17-02-2026

Chip Assembler ASE Sees Advanced Packaging Sales Doubling

ASE expects advanced packaging sales to double on AI chip demand. The post Chip Assembler ASE Sees Advanced Packaging Sales Doubling appeared first on EE Times… 17-02-2026

The Race Begins For Much Bigger Abstractions

New data centers and massive compute capabilities enable a whole new way of manipulating and using data. The post The Race Begins For Much Bigger Abstractions appeared first on Semiconductor Engineering… 17-02-2026

A Computer That Fits Inside A Camera Lens

For a long while digital single-lens reflex DSLR cameras were the king of the castle for professional and amateur photography. They brought large sensors interchangeable lenses and professional-level viewfinders to read… 17-02-2026

Retrotechtacular: Mr. Wizard Jams with IBM

You may not remember Mr. Wizard but he was a staple of nerd kids over a few decades teaching science to kids via the magic of television. The Computer History read… 16-02-2026

Perusing a LED-based gel nail polish UV lamp

This engineer doesn t use nail polish but his wife does. And he deals with plenty of PCBs. What do these things have in common Read on. The post Perusing a LED-based gel nail polish UV lamp appeared first on… 16-02-2026

SemiQ partners with distributor NAC Semi across North America

SemiQ Inc of Lake Forest CA USA which designs develops and manufactures silicon carbide SiC power semiconductors and 150mm SiC epitaxial wafers for high-voltage applications has announced a distribution agreement with global electronic component design services and distribution company NAC Semi NAC Group Inc of Clearwater FL… 16-02-2026