Caxapa

Многоканальные паяльные станции Актаком доступны к поставке: Информируем о доступности поставки с короткими сроками широкого ассортимента многоканальных паяльных станций - ремонтных комплексов Актаком различного функционального назначения. 24-03-2026

Высокомощные разъёмы стандарта OCP M-CRPS от Oupiin: Компания Oupiin представила высокомощных разъёмов соответствующие стандарту OCP M-CRPS серию… 23-03-2026

Преобразователи уровня К5017ПУ от АО НЗПП Восток: Серия К5017ПУ разработанная и производимая АО НЗПП Восток представляет собой линейку современных двунаправленных преобразователей логических уровней предназначенных для согласования цифровых сигналов между микросхемами и устройствами работающими при разных напряжениях. Микросхемы позволяют безопасно и эффективно устанавливать соединения между цифровыми устройствами что критически важно… 20-03-2026

Мотореле A-MEC: A-MEC представил мотореле с возможностью переключения тока и напряжения 100 А/250 В AC MR02-100… 20-03-2026

Приглашаем на выставку ExpoElectronica 2026: Рады сообщить что компания РУ Электроникс станет участником международной выставки электроники ExpoElectronica 2026 . Ждем вас с 14 по 16 апреля в Москве на крупнейшем отраслевом событии в России и ЕАЭС чтобы обсудить новинки текущие проекты и перспективы сотрудничества. Выставка пройдет в Москве в МВЦ Крокус Экспо . Получить билет на выставку. Что ждет вас на выставке ExpoElectronica … 19-03-2026

SDR модули CR-P401D и CR-P501D от Cruetech: Компания Макро Групп предлагает SDR модули от бренда Cruetech CR-P401D… 18-03-2026

SDR модули CR-P401D и CR-P501D от Cruetech: Компания Макро Групп предлагает SDR модули на базе СнК Zynq MP-SOC от бренда Cruetech CR-P401D… 18-03-2026

DIASOM на выставке АВТОМАТИЗАЦИЯ. ЭЛЕКТРОНИКА. ЭЛЕКТРОТЕХ. СВЕТ: DIASOM представил свою продукцию на международной выставке АВТОМАТИЗАЦИЯ. ЭЛЕКТРОНИКА. ЭЛЕКТРОТЕХ. СВЕТ 17 19 марта 2026 года в Минске. 17-03-2026

Superconducting Chips Enable Portable Terahertz Imaging Applications: A new chip uses terahertz waves to explore materials in ways not possible before hinting at advancements in science healthcare and security research. The researchers from the University of Glasgow the University of Tsukuba and Japan s National Institute of Advanced Industrial Science and Technology have developed the lightweight superconducting chip which they claim could… 24-03-2026

Disposable Vape Becomes Breath-Activated Synth: Makers and hardware hackers have been collecting disposable vapes for some time now usually to salvage their batteries or the unique displays many models now come with. But you can read… 24-03-2026

GiantEye Enables High-Resolution Computer Tomography of Massive Objects: A new high-energy CT system allows detailed inspection of large objects enabling non-destructive testing of complex components while maintaining their original orientation and structure. Non-destructive testing NDT allows engineers to inspect objects without opening or dismantling them. Traditionally only items that fit inside conventional scanners could be analysed limiting testing… 24-03-2026

Demystifying 3D ICs: A practical framework for heterogeneous integration: The move toward 3D ICs and heterogeneous integration overcomes limitations of 2D scaling by integrating multiple specialized chiplets. The post Demystifying 3D ICs: A practical framework for heterogeneous integration appeared first on… 24-03-2026

2D Oxyhalides Revolutionize Semiconductor Chip Manufacturing: A surprising ultrathin material is challenging long-standing limits in chip fabrication hinting at a new way to shape nanoscale circuits with greater precision and resilience. An international team of researchers led by Saptarshi Das Ackley Professor at Pennsylvania State University has reported a new approach to semiconductor patterning using an atomically thin material chromium oxychloride 24-03-2026

Chip Industry Technical Paper Roundup: Mar. 24: Natural-language chip design automotive semiconductor risk assessment wafer-on-wafer hybrid bonding rad-hard NAND neuromorphic computing monolithic 3D DRAM ECC-aware chiplet interconnects AI system validation with digital twins. The post Chip Industry Technical Paper Roundup: Mar. 24 appeared first on Semiconductor Engineering… 24-03-2026

Research Bits: Mar. 24: Dual-modulated transistor graphene FET biosensors more robust printed transistors. The post Research Bits: Mar. 24 appeared first on Semiconductor Engineering… 24-03-2026

GaN system for smaller chargers: A new GaN approach changes power design cuts size and heat supports higher output and points to smaller chargers and wider use across devices. Renesas has introduced a GaN-based Half-Wave LLC platform for AC/DC and power adapters targeting designs from 500W and above. The platform supports compact power systems and helps move beyond… 24-03-2026

Alibaba launches 5nm RISC-V CPU for inference: Alibaba s research arm Damo Academy has launched a RISC-V based CPU for AI inference which can be customised to a user s workload and is claimed to be the highest-performing RISC-V ... The post Alibaba launches 5nm RISC-V CPU for inference appeared first on Electronics Weekly… 24-03-2026

Foundry capacity underutilised but revenues and market share growing: Semiconductor wafer demand 12 equivalent reached 8.7 million wpm last year says Yole Group with the foundry industry earning 47% of all wafer manufacturing revenue worth 181 billion last year ... The post Foundry capacity underutilised but revenues and market share growing appeared first on Electronics Weekly… 24-03-2026

Cambridge researchers propose Hf Sr Ti O2 memristors for neuromorphic devices.: Researchers at the University of Cambridge have proposed an answer to escalating energy consumption of AI hardware multicomponent p-type Hf Sr Ti O2 thin films for memristor-based neuromorphic devices. Neuromorphic computing offers ... The post Cambridge researchers propose Hf Sr Ti O2 memristors for neuromorphic devices. appeared first on Electronics Weekly… 24-03-2026

EPC91121 BLDC motor drive evaluation board: Efficient Power Conversion EPC the eGaN power device specialist has introduced the EPC91121 motor drive inverter evaluation board built around the Gen-7 EPC2366 40 V eGaN power transistor. Measuring 79 ... The post EPC91121 BLDC motor drive evaluation board appeared first on Electronics Weekly… 24-03-2026

Terahertz Waves enable Real-Time monitoring of Electronic Chips: How are x-rays telling us what is happening inside semiconductor chips while they are operating A team of international researchers has developed a ground-breaking technique to observe what happens inside electronic chips while they are actively operating. This innovation allows engineers to monitor semiconductor devices without physically touching them dismantling their packaging … 24-03-2026

Radio Platform for Radar Satellite and Wireless: A software defined radio lets engineers use frequencies and signals making it easier to build and test radar satellite and wireless systems. Emerson has announced the launch of the NI USRP X420 a software defined radio SDR designed to meet the demanding requirements of advanced radar systems satellite communications and emerging 6G research.… 24-03-2026

Dual diodes for microwave WPT: Nisshinbo Micro Devices has announced the NT9000/NT9001/NT9002/NT9003 series these are dual diode devices designed for Wireless Power Transfer WPT . The new series utilizes the company s proprietary GaAs wafer process technology ... The post Dual diodes for microwave WPT appeared first on Electronics Weekly… 24-03-2026

OpenEnv Hackathon Targets AI Developers: India edition brings RL infrastructure 30K prizes and direct hiring access The OpenEnv AI Hackathon has arrived in India expanding access to advanced reinforcement learning RL infrastructure for developers and signalling a shift toward hands-on AI system building. Following its debut in San Francisco the national-level competition is being organised by Scaler School… 24-03-2026

Моя конференция