Микроконтроллеры

Совместимость модуля DS-RK3568 от Диасом с российской операционный системой РЕД ОС

Подтвердили совместимость DS-RK3568 с операционной системой РЕД… 28-04-2026

Модули широкополосных источников света от Box Optronics

Компания Box Optronics запустила серийные поставки модулей широкополосных источников света BSLD-840-7SM-FA-M. 28-04-2026

Выгодное предложение Cнижение цен на импульсные источники питания Актаком

Сообщаем о значительном снижении цен на популярные модели импульсных источников питания Актаком APS-5310 30 В/10 А и APS-3020 30 В/20… 27-04-2026

Радифотоника от Cruetech. Оптоэлектронный модуль 10-100 МГц

Оптоэлектронный модуль 10 100 МГц Cruetech состоит из передатчика и приёмника.  23-04-2026

Скидка 15% на имульсные тестеры обмоток Актаком АМ-3085 и АМ-3083

Акция на импульсные высоковольтные тестеры обмоток Актаком продлена До 1 июня 2026 года со скидкой 15% можно приобрести не только АМ-3085 но и его младшего собрата -АМ-3083. 22-04-2026

Итоги выставки ExpoElectronica 2026: ключевые тренды и новинки РУ Электроникс

Компания  РУ Электроникс приняла участие в 28-й международной выставке ExpoElectronica 2026 которая традиционно является ключевым отраслевым событием в сфере электронной промышленности. В рамках масштабной экспозиции был представлен широкий спектр линеек электронных компонентов RUICH I включая разъёмы дисплеи устройства коммутации клеммники конденсаторы тиристоры и многие другие.… 21-04-2026

Итоги выставки ExpoElectronica 2026

Компания Теллур Электроникс приняла участие в международной выставке ExpoElectronica 2026 которая традиционно является одной из ключевых площадок для демонстрации достижений в области электронной промышленности. В рамках мероприятия наша команда представила актуальные решения и продукцию по направлениям электромеханики микроэлектроники СВЧ датчиков дисплеев и отечественной элементной базы.… 21-04-2026

STMicro Introduces STM32C5 for Cost-Sensitive Smart Devices

Introducing STM32C5 in India STMicroelectronics explained how the new series targets cost-sensitive applications with improved performance memory and connectivity. The post STMicro Introduces STM32C5 for Cost-Sensitive Smart Devices appeared first on EE Times… 29-04-2026

Assuring Comprehensive Security Coverage In Hardware Design

Security coverage is a key component of a systematic framework for comprehensive traceable security verification. The post Assuring Comprehensive Security Coverage In Hardware Design appeared first on Semiconductor Engineering… 29-04-2026

How Long Will CAN Stick Around As Rival Networks Speed Up

New in-vehicle networking technology will likely take over as more AI is added but in the near term designers face challenges integrating new with old. The post How Long Will CAN Stick Around As Rival Networks Speed Up appeared first on Semiconductor Engineering… 29-04-2026

Blog Review: Apr. 29

Interface IP in 3D SOCAMM in data centers edge intelligence implementations deposition etch for 3D interconnect telemetry design manufacturing collaboration. The post Blog Review: Apr. 29 appeared first on Semiconductor Engineering… 29-04-2026

From Silos to Systems from Data to Insight

Transform fragmented siloed data into a governed connected and reusable organizational knowledge base. The post From Silos to Systems from Data to Insight appeared first on Semiconductor Engineering… 29-04-2026

Building An AI Chip: Silicon Design And Advanced Packaging

The second key stage of AI chip design: silicon design and packaging. The post Building An AI Chip: Silicon Design And Advanced Packaging appeared first on Semiconductor Engineering… 29-04-2026

Three-Phase Supply For Automation

A new 3000W industrial power supply adds wide-range three-phase input support improving flexibility reliability and easier global deployment for automation semiconductor process control and manufacturing systems. A new industrial AC-DC power supply from TDK Corporation has entered the market featuring enhanced three-phase input capability targeting factories semiconductor tools… 29-04-2026

Wafer Platform Adds Hidden Defect Detection

A new wafer inspection platform combines AI analytics sub-micron imaging SWIR sensing and precision metrology to help semiconductor fabs improve yields and the quality of advanced packaging. A newly launched wafer inspection and metrology platform by Test Research Inc. TRI   is targeting semiconductor fabs that need tighter defect control faster process feedback and higher… 29-04-2026

Software Helps Catch Production Issues Earlier

Assembly problems often surface late when fixes cost more and timelines slip. A new simulation approach aims to catch those issues earlier. Keysight Technologies has launched Keysight Assembly a new virtual process simulation solution designed to help manufacturers identify assembly issues earlier in development before they become costly production problems. Developed in collaboration with… 29-04-2026

Non-Magnetic Connectors for Advanced Systems

Non-magnetic connectors reduce interference and improve signal quality in medical devices wireless systems computing equipment and testing applications. Amphenol RF has expanded its non-magnetic MCX connector lineup with new connector configurations designed for applications where magnetic interference can compromise system performance. By using non-ferrous materials and specialized plating… 29-04-2026

ROHM Launches Compact Wireless Power Chipset for Wearables

ROHM s wireless power supply IC chipset is targeted at compact wearables such as smart rings and smart bands. The post ROHM Launches Compact Wireless Power Chipset for Wearables appeared first on EDN Asia… 29-04-2026

ST Redefines Entry-level MCU Performance and Value

ST s STM32C5 MCU is targeted at smart devices throughout factories homes cities and infrastructures while meeting extreme cost size and power limitations. The post ST Redefines Entry-level MCU Performance and Value appeared first on EDN Asia… 29-04-2026

King meets tech CEOs

King Charles met tech CEOs yesterday at Blair House the official guest house of the US government where he is staying on his  trip to the US. Tim Cook Jeff ... The post King meets tech CEOs appeared first on Electronics Weekly… 29-04-2026

AI finds irregularities at the Met

A Palantir AI tool has unearthed widespread irregularities in the Met with hundreds of investigations underway and three arrests made. The arrests were for allegations of abuse of authority for ... The post AI finds irregularities at the Met appeared first on Electronics Weekly… 29-04-2026

Soft Magnetic Material Could Build Tiny Machines

A 3D-printed gel that bends grips and changes shape with magnets could help build robots and medical tools for drug delivery and fluid control. Engineers at Massachusetts Institute of Technology MIT with collaborators at cole Polytechnique F d rale de Lausanne and University of Cincinnati have developed a magnetic hydrogel that can be printed into structures… 29-04-2026

Birmingham scientists find new way to build 2D materials

Researchers at the University of Birmingham have come up with a novel method for producing conductors semiconductors and electronic insulators uses vibrational energy to split and peel off molecular-thin layers ... The post Birmingham scientists find new way to build 2D materials appeared first on Electronics Weekly… 29-04-2026