Микроконтроллеры

1700 В / 100 А Gen3 SiC MOSFET от AMG Power: AMG Power представил новый карбид-кремниевый MOSFET с напряжением 1700 В и током 100 А A3G100N1700MDSK. 18-08-2026

DK8607 от Dongke Semiconductor - высокоинтегрированное GaN-решение для быстрой зарядки: Компания Dongke Semiconductor представила DK8607 высокоинтегрированное решение для создания компактных источников питания и устройств быстрой зарядки USB Power Delivery мощностью до 65 Вт. Микросхема объединяет силовую часть на базе GaN-транзисторов и функции управления преобразователем позволяя уменьшить количество внешних компонентов и габариты конечного устройства. Высокая степень интеграции 18-08-2026

Доступны к поставке портативные мультиметры Актаком серии АММ-1200 включенные в Госреестр СИ РФ: К поставке доступен широкий модельный ряд портативных цифровых мультиметров Актаком серии АММ-1200. Приборы имеют действующее свидетельство об утверждении типа и зарегистрированы в Госреестре СИ РФ за … 17-08-2026

Отладочная плата на AT32F403A с 6 датчиками и поддержкой Edge AI для AIoT от Artery Technology: Artery Technology предлагает отладочную плату AT32 EdgeAI Sensor EV Board на базе микроконтроллера AT32F403A с шестью типами датчиков и поддержкой Edge… 17-08-2026

Искусственный интеллект против ваших закупок: как HBM обрушила рынок обычной памяти: Планируйте закупки заранее. Мы продолжаем формировать складские запасы по памяти но какие-то объемы не сможем поддержать из складских запасов. 14-08-2026

НЗПП Восток расширяет линейку микросхем в пластиковых корпусах: НЗПП Восток продолжает расширять номенклатуру отечественной электронной компонентной базы осваивая новые изделия и совершенствуя производственные технологии. В числе последних новинок предприятия защитные сборки в пластиковых корпусах прецизионные и быстродействующие операционные усилители а также другие востребованные компоненты для современной электронной аппаратуры. Что выделяет ассортим 14-08-2026

Компактный миллиомметр АММ-6001 с точностью 0 1% уже в продаже: Измеритель сопротивления АММ-6001 создан для решения самых сложных задач по поиску межвитковых замыканий и анализу цепей. Этот прибор предлагает уникальное сочетание функциональности и доступности. Не откладывайте покупку пока прибор имеется на складе 13-08-2026

До 34% на комплектующие со склада в Москве: Снизили цены до 34% на ряд складских позиций. Ассортимент содержит качественные и сертифицированные комплектующие от ведущих производителей электронных компонентов и электротехники. Полный список продукции со скидкой Значительная часть позиций продукция собственной марки RUICHI : серийные аналоги российских и европейских компонентов соответствующие стандартам RoHS REACH с гарантией в… 12-08-2026

Quilter: AI-Powered PCB Design Tool for Automated PCB Layout: It uses physics-driven AI to automate PCB placement routing and validation giving engineers more layout options while keeping control over constraints and final design decisions. Designing a PCB is not simply about connecting one component to another. Engineers have to decide where components should sit how signals should travel how differential pairs and impedance-controlled… 19-08-2026

How thermal constraints are changing the semiconductor design process: Cooling is one of the clearest illustration of how semiconductor design teams need to work together. There is a running joke in engineering circles that the last time an electrical The post How thermal constraints are changing the semiconductor design process appeared first on Electronics Weekly… 19-08-2026

Photonic integrated circuits: the next frontier of advanced optoelectronic devices: Design simulation and manufacturing advances continue to push photonic integrated circuits PICs to smaller sizes which provide greater capabilities per chip writes Liam Critchley. Advanced optics and photonics where light The post Photonic integrated circuits: the next frontier of advanced optoelectronic devices appeared first on Electronics Weekly… 19-08-2026

Lumentum s quarterly revenue more than doubles year-on-year to over 1bn: For its fiscal full-year 2026 ended 27 June Lumentum Holdings Inc of San Jose CA USA which designs and makes optical and photonic products for optical networks and lasers for industrial and consumer markets has reported revenue of 3014m up 83.2% on fiscal 2025 s… 19-08-2026

Microchip advances PolarFire FPGA Ethernet Sensor Bridge with Rev 2.0: Microchip Technology has released Revision 2.0 of its PolarFire FPGA Ethernet Sensor Bridge. This is a smaller production-ready board for sensor integration using NVIDIA HSB Holoscan Sensor Bridge technology. The The post Microchip advances PolarFire FPGA Ethernet Sensor Bridge with Rev 2.0 appeared first on Electronics Weekly… 19-08-2026

Compliance Intern At Logesys Solutions India In Chennai: APPLY HERE ON LINKEDIN Location: Chennai Company: Logesys Solutions India Responsibilities Qualifications 19-08-2026

Neuromorphic Chips Bring New Security Risks To Devices: Brain-inspired chips can deliver efficient computing at the edge but their unusual architecture creates new attack surfaces requiring stronger hardware security measures before wider deployment. BrainChip s Akida AKD1000 illustrates the potential of neuromorphic intelligence for embedded systems while Chipus Quantum is cited as an example of work towards stronger security infrastructure. These… 19-08-2026

Humanoid Robot Claims New Speed And Jumping Records: A new humanoid robot claims remarkable athletic feats but its headline performance figures remain unverified relying on a company demonstration video rather than independent testing. Unitree s new humanoid robot dubbed Superman claims to have achieved impressive running and jumping performances including a top speed of 12.66 metres per second and a two-metre standing vertical… 19-08-2026

Diamond quantum sensors open new windows into universe: Diamond-based quantum sensors could deliver highly sensitive measurements helping scientists investigate magnetic fields fundamental physics and difficult environments across space and beyond. The US Department of Energy DOE is supporting research into diamond-based quantum sensors a technology that could help scientists make highly precise measurements and explore fundamental questions… 19-08-2026

New cellular modules broaden connectivity for IoT devices: New connectivity modules bring 4G entry-level 5G Wi-Fi and Android support to IoT systems targeting flexible deployments across diverse applications while simplifying integration for developers. Quectel has announced two new cellular IoT modules the SH602FA and SE505FE targeting premium 4G and entry-level 5G applications respectively. The MediaTek-powered system-on-modules combine cellular… 19-08-2026

XR technology could help address skilled worker shortages: New research explores AI-powered XR assistance that could help visually impaired professionals overcome workplace barriers retain expertise and strengthen labour-market participation in demanding professional roles. The Karlsruhe Institute of Technology KIT and Fraunhofer Institute of Optronics System Technologies and Image Exploitation IOSB are developing the AssistiveXR4Work system… 19-08-2026

Five metals driving demand behind the AI boom: The growth of AI data centres is increasing demand for copper gallium germanium rare earth elements and aluminium across power cooling and networking infrastructure systems. Interesting Engineering s report examines how AI processors and data-centre infrastructure are increasing demand for a range of metals needed to build and operate modern computing facilities. The AI boom… 19-08-2026

New CEO for SIA: The SIA has appointed Michael Robbins pictured to be its president and CEO as from Oct. 1. Robbins succeeds John Neuffer who announced his departure in January following nearly 12 years The post New CEO for SIA appeared first on Electronics Weekly… 19-08-2026

Building Custom Backyard Solar Lights: In this modern age if you want a truly swish garden that makes your friends sad when they visit you need good lighting. technocraftStudio has been working on just such a read… 19-08-2026

When Interoperability Becomes Infrastructure: As Matter matures manufacturers face a new challenge: maintaining visibility into connected products after deployment. The post When Interoperability Becomes Infrastructure appeared first on EE Times… 19-08-2026

The Future Of AI Compute Won t Run On Just One Kind Of Chip: Power token cost interconnects and software orchestration are pushing data centers toward heterogeneous clusters built from CPUs GPUs NPUs optics and custom accelerators. The post The Future Of AI Compute Won t Run On Just One Kind Of Chip appeared first on Semiconductor Engineering… 19-08-2026