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Портативные осциллографы-мультиметры серии ADS-2000: Доступны к поставке все модели цифровых осциллографов-мультиметров серии ADS-2000 включенных в Госреестр СИ за номером… 01-04-2026

OLED микродисплеи компании Element Touch: Компания Теллур Электроникс предлагает современные OLED микродисплеи предназначенные для применения в системах дополненной и виртуальной реальности AR/VR приборах наблюдения тепловизионной технике и других высокотехнологичных устройствах. В ассортименте представлены серии микродисплеев с различными характеристиками от компактных решений для AR до высокопроизводительных дисплеев с ультравыс 31-03-2026

Расширение ассортимента: компактные блоки питания HDR-12 на складе: Линейка блоков питания на DIN-рейку RUICHI пополнилась четырьмя моделями серии HDR-12: HDR-24-12 HDR-30-12 HDR-48-12 HDR-60-12. Все новинки выполнены в узком пластиковом корпусе с пассивным охлаждением что позволяет эффективно использовать место в щитах с высокой плотностью монтажа включая герметичные боксы. Новые блоки питания ориентированы на использование в системах промышленной автоматиза 27-03-2026

Скидка 15% на имульсные тестеры обмоток Актаком АМ-3085 и АМ-3083: Спешим сообщить о расширение акции на высоковольтные тестеры обмоток Актаком. Только до 1 мая 2026 года со скидкой 15% можно приобрести не только АМ-3085 но и его младшего собрата -АМ-3083. 27-03-2026

Высокотемпературные оптические трансиверы Cruetech: Оптические трансиверы российской торговой марки Cruetech серии DTABTP9 созданы для применения в приложениях с высокими температурными нагрузками. 27-03-2026

SiC MOSFET на 1200 В 75 А 30 мОм в корпусе TOLT с верхним отводом тепла от AMG Power: AMG Power анонсировал производства карбид-кремниевых МОП-транзисторов транзисторов на 1200 В с сопротивлением 30 мОм в корпусе TOLT с отводом тепла через верхнюю поверхность. 26-03-2026

Приглашаем на выставку ЭкспоЭлектроника-2026: Приглашаем посетить наш стенд компании Макро Групп на выставке ЭкспоЭлектроника-2026… 25-03-2026

Многоканальные паяльные станции Актаком доступны к поставке: Информируем о доступности поставки с короткими сроками широкого ассортимента многоканальных паяльных станций - ремонтных комплексов Актаком различного функционального назначения. 24-03-2026

What is the EDA problem worth solving with AI: Here is a sneak peek at the AI content in EDA and how it comprises four camps all missing the real opportunity. The post What is the EDA problem worth solving with AI appeared first on… 01-04-2026

UK Semiconductor Centre appoints two new directors: To help drive forward its goal of unlocking the full potential of the UK semiconductor industry the UK Semiconductor Centre UKSC has appointed Martin O Sullivan as director of investment and Steve Taylor as director of strategic marketing... 01-04-2026

Rugged Edge AI Across Temperature Extremes: As AI moves beyond controlled data centres can hardware keep up These modules focus on durability efficiency and real-world deployment readiness. congatec has introduced Computer-on-Modules COMs with rugged variants designed to operate in harsh industrial environments delivering energy-efficient AI performance across a temperature range of -40  C to 85  C. The modules are aimed… 01-04-2026

Secure at First Silicon: Reducing Cost and Risk: How integrating pre-silicon side-channel analysis into your standard verification process can reduce respins support certification and ensure your silicon meets its security requirements from day one. The post Secure at First Silicon: Reducing Cost and Risk appeared first on Semiconductor Engineering… 01-04-2026

Enabling Physical AI and Robotics: Platform for the Intelligent Edge: How physical AI systems combine sensors edge processing and connectivity to enable real-time intelligent decision-making directly on devices like robots and smart edge systems. The post Enabling Physical AI and Robotics: Platform for the Intelligent Edge appeared first on Semiconductor Engineering… 01-04-2026

Ensuring Trustworthiness of AI-Enhanced Embedded Systems: A road-vehicle standard-based unified AI safety lifecycle and blueprint for integrating both robustness and resilience into AI systems deployed in safety-critical domains. The post Ensuring Trustworthiness of AI-Enhanced Embedded Systems appeared first on Semiconductor Engineering… 01-04-2026

Accelerating Automotive Innovation: SRAM Compiler Breakthroughs for 5nm and 3nm SoCs: How a next gen SRAM compiler IP for TSMC N5A and N3A helps design teams with measurable gains in PPA reliability and system robustness. The post Accelerating Automotive Innovation: SRAM Compiler Breakthroughs for 5nm and 3nm SoCs appeared first on Semiconductor Engineering… 01-04-2026

Hardware Deployment for Secure AI Using Confidential Computing: Key considerations for secure AI along with limitations and recommendations to overcome the limitations for secure AI deployments. The post Hardware Deployment for Secure AI Using Confidential Computing appeared first on Semiconductor Engineering… 01-04-2026

Radar SLAM Application on Vision DSPs based on Novel IO-ICP: A novel IO-ICP makes radar-SLAM more accurate than other sensor-based SLAM applications. The post Radar SLAM Application on Vision DSPs based on Novel IO-ICP appeared first on Semiconductor Engineering… 01-04-2026

Blog Review: Apr. 1: Complex interactions challenge verification dynamic voltage drop analysis chiplet framework automotive Ethernet. The post Blog Review: Apr. 1 appeared first on Semiconductor Engineering… 01-04-2026

AI s Potential And Limitations In Chip Design: Full automation is still a goal but humans will still be in the loop for the foreseeable future. The post AI s Potential And Limitations In Chip Design appeared first on Semiconductor Engineering… 01-04-2026

Preparing For The Multiphysics Future of 3D ICs: Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical thermal and mechanical phenomena which are more complex than in 2D IC designs. The post Preparing For The Multiphysics Future of 3D ICs appeared first on Semiconductor Engineering… 01-04-2026

Molecular-scale DNA Robots Offering Breakthrough in Virus Hunting: This DNA robot based on the DNA origami is capable of delivering drugs and hunting viruses in the body. A research by Harbin Institute of Technology states that DNA robots are emerging as a ground-breaking technological innovation built using the unique structural and programmable properties of DNA. These nanoscale machines are engineered through advanced… 01-04-2026

Light-Responsive Perovskite Lattice Advancement: Researchers show perovskite materials can reversibly deform under light enabling adaptive optoelectronic and photonic devices A new study has demonstrated that perovskite semiconductor crystals can physically deform when exposed to light unlocking a pathway to a new class of light-controlled electronic and optoelectronic devices. Researchers found that halide perovskite crystals undergo rapid… 01-04-2026

Ultra-Heat Memory Chip Advancement: New memristor survives 700 C extremes A newly developed electronic memory chip capable of operating at extreme temperatures above 700 C marks a major breakthrough in next-generation electronics potentially enabling computing in environments previously considered impossible. Researchers have demonstrated a nanoscale memristor device that reliably stores data at temperatures hotter than molten… 01-04-2026

New High Precision Op Amps: A fresh lineup of CMOS operational amplifiers targets accuracy speed and versatility across automotive industrial and consumer applications. A new portfolio of 17 high-performance CMOS operational amplifiers by Rohm Semiconductor is expanding design options for engineers working on increasingly complex electronic systems. The additions respond to growing demand for higher precision… 01-04-2026