Схемы, платы, компоненты

Приглашаем на выставку ЭкспоЭлектроника-2026: Приглашаем посетить наш стенд компании Макро Групп на выставке ЭкспоЭлектроника-2026… 25-03-2026

Многоканальные паяльные станции Актаком доступны к поставке: Информируем о доступности поставки с короткими сроками широкого ассортимента многоканальных паяльных станций - ремонтных комплексов Актаком различного функционального назначения. 24-03-2026

Высокомощные разъёмы стандарта OCP M-CRPS от Oupiin: Компания Oupiin представила высокомощных разъёмов соответствующие стандарту OCP M-CRPS серию… 23-03-2026

Преобразователи уровня К5017ПУ от АО НЗПП Восток: Серия К5017ПУ разработанная и производимая АО НЗПП Восток представляет собой линейку современных двунаправленных преобразователей логических уровней предназначенных для согласования цифровых сигналов между микросхемами и устройствами работающими при разных напряжениях. Микросхемы позволяют безопасно и эффективно устанавливать соединения между цифровыми устройствами что критически важно… 20-03-2026

Мотореле A-MEC: A-MEC представил мотореле с возможностью переключения тока и напряжения 100 А/250 В AC MR02-100… 20-03-2026

Приглашаем на выставку ExpoElectronica 2026: Рады сообщить что компания РУ Электроникс станет участником международной выставки электроники ExpoElectronica 2026 . Ждем вас с 14 по 16 апреля в Москве на крупнейшем отраслевом событии в России и ЕАЭС чтобы обсудить новинки текущие проекты и перспективы сотрудничества. Выставка пройдет в Москве в МВЦ Крокус Экспо . Получить билет на выставку. Что ждет вас на выставке ExpoElectronica … 19-03-2026

SDR модули CR-P401D и CR-P501D от Cruetech: Компания Макро Групп предлагает SDR модули от бренда Cruetech CR-P401D… 18-03-2026

SDR модули CR-P401D и CR-P501D от Cruetech: Компания Макро Групп предлагает SDR модули на базе СнК Zynq MP-SOC от бренда Cruetech CR-P401D… 18-03-2026

Chiplets: 8 best practices for engineering multi-die designs: Multi-die designs introduce new engineering complexities and design considerations spanning packaging verification and thermal dynamics. The post Chiplets: 8 best practices for engineering multi-die designs appeared first on… 25-03-2026

RANSemi wins Apeiroon baseband design-in: RANSemi Limited the British semiconductor innovator pioneering Open RAN baseband SoCcplatforms for 4G and 5G networks today announced that its RNS802 5G RAN baseband SoC is being used to power mission-critical ... The post RANSemi wins Apeiroon baseband design-in appeared first on Electronics Weekly… 25-03-2026

Embedded World Video: How Octavo SiP accelerates embedded development: At Embedded World 2026 we caught up with Greg Sheridan Vice President of Strategy Product at Octavo Systems as part of our promotional coverage for the event. He asks: ... The post Embedded World Video: How Octavo SiP accelerates embedded development appeared first on Electronics Weekly… 25-03-2026

Build Your Own IR Audio Communication System at Home: Infrared Audio Communication is a method of transmitting sound wirelessly using pulses of invisible light rather than radio waves. It works by modulating the intensity of an IR LED to match the fluctuations of an audio signal. At the other end a phototransistor or a IR light sensing diode captures the flickering light… 25-03-2026

Piezo Actuators : Silver price hikes Don t worry TDK has the answer: The recent hike in precious metal prices is putting commercial pressure on conventional multilayer piezo designs that use silver. In addition to increasing costs silver is the primary cause of failure when moisture is present. By using copper instead of silver TDK offers a compelling solution to both challenges. 25-03-2026

SiC Gate Driver Reference Design: A 100 kW-class inverter reference platform that helps design engineers accelerate development of high-efficiency SiC-based traction and motor drive systems. For design engineers working on next-generation power electronics especially in electric vehicles EVs and industrial drive systems validated reference designs play a critical role in reducing development risk and accelerating time-to-marke 25-03-2026

What Policymakers Must Fix in Europe s Chips Act 2.0: As Brussels prepares the next phase of its semiconductor push the real challenge may lie less in technological choices than in fixing the policy machinery itself. The post What Policymakers Must Fix in Europe s Chips Act 2.0 appeared first on EE Times… 25-03-2026

Fault-tolerant Computation Method For Quantum Computers: Something unexpected is changing in quantum computing as fault-tolerant systems begin handling complex chemical calculations once thought far beyond practical reach Fujitsu and the University of Osaka have developed a new set of technologies aimed at accelerating the real-world use of quantum computers in chemistry and materials science. By combining the latest version… 25-03-2026

Processor with integrated memory for vehicle displays: One package combines processor and memory for vehicle displays and control reduces design steps and supports dashboards chargers and panels. Microchip s SAM9X75D5M System-in-Package SiP targets automotive and e-mobility HMI designs. It integrates an Arm926EJ-S processor with 512 Mbit DDR2 SDRAM in one package supports displays up to 10 inches at XGA resolution and… 25-03-2026

You Can Now Run MS-DOS Applications on the Apple IIe: After a lot of debugging Seth Kushniryk has managed to get the last issuess shaken out of his port of MS-DOS 2.0 to the Apple II and has released the read… 25-03-2026

Emergence of a Non-flammable Battery Electrolyte: A new non-flammable electrolyte is emerging promising safer more reliable batteries while nanoscale self-assembly still shapes its performance limits. Researchers at the University of Tennessee Knoxville are investigating polymeric ionic liquids PILs a nonflammable electrolyte that promises safer lithium-ion and lithium-metal batteries. While PILs conduct ions efficiently at room… 25-03-2026

Unified Charging Architecture for Mobile Devices and Robotics: What if one power system could charge devices instantly and control humanoid robots This charging architecture makes it possible. pSemi a leader in capacitor-based power conversion has introduced two groundbreaking products: the PE26100 multi-level buck converter for direct battery charging and the PE25304 integrated charge-pump switching-capacitor module for high-power robotics and mechatronic 25-03-2026

Power Modules for Data Center and Industrial Drives: Pushing power limits in data centres These modules enable smaller converters less heat and a shift from IGBT designs without a full redesign. SemiQ Inc has introduced QSiC Dual3 a family of 1200 V half-bridge MOSFET modules built on silicon carbide SiC . The modules are designed to replace IGBT modules with minimal design changes… 25-03-2026

Beating The Heat In 3D Packages: Thermal management is the biggest performance and reliability bottleneck in multi-die assemblies. The post Beating The Heat In 3D Packages appeared first on Semiconductor Engineering… 25-03-2026

Extraction Challenges of CFET and Backside Power Delivery: How to support workflow setup interface resistance modeling and RLCK extraction positioning design teams for reliability power efficiency and success in next-gen device engineering. The post Extraction Challenges of CFET and Backside Power Delivery appeared first on Semiconductor Engineering… 25-03-2026

Blog Review: Mar. 25: MBSE for multiphysics traceability vs. tracking UALink VIP EM simulation code migration SOI. The post Blog Review: Mar. 25 appeared first on Semiconductor Engineering… 25-03-2026