Средства и методы разработки

Сэр Исаак Ньютон, 1705 год

Герой Союза, 1934 год

Автомобильный дискретный IGBT на 1200 В от Sunco: Компания Sunco производитель силовой электроники анонсировала новое поколение дискретных автомобильных IGBT-транзисторов напряжением 1200 В в корпусе… 15-04-2026

Аналоговые и mixed-signal ИС для промышленной автомобильной и потребительской электроники от NOVOSENSE Microelectronics: Компания Макро Групп начала сотрудничество с производителем высоконадёжных аналоговых и mixed-signal микросхем для промышленной автомобильной и потребительской электроники NOVOSENSE Microelectronics. 13-04-2026

Развитие направления гражданских БПЛА: решения от Теллур Электроникс: Компания Теллур Электроникс приглашает ознакомиться с новой специализированной страницей посвящённой решениям для разработки и производства гражданских беспилотных летательных аппаратов. В условиях стремительного роста рынка БПЛА и задач импортозамещения мы системно расширяем портфель электронных компонентов и модулей востребованных в таких областях как: мониторинг и безопасность сельское… 13-04-2026

Высоковольтный тестер сопротивления изоляции Актаком АММ-2093: Возобновлены продажи высоковольтного тестера сопротивления изоляции модели АММ-2093 предназначенного для проведения испытаний стойкости изоляции напряжением до 5/6 кВ AC/DC и измерения сопротивления изоляции до… 10-04-2026

Интеллектуальные ИС для дымовых газовых и комбинированных датчиков безопасности от 3Think. Вебинар: Компания Макро Групп приглашает на технический вебинар посвящённый специализированным решениям в области систем безопасности на базе интеллектуальных микросхем компании… 10-04-2026

Приглашаем посетить наш стенд на 31-ой Международной выставке Securika Moscow: Компания Макро ЕМС приглашает посетить 31-ую Международную выставку технических средств охраны и оборудования для обеспечения безопасности и противопожарной защиты Securika Moscow 2026 в Москве. 09-04-2026

Модуль камеры DS-CAR0234-22 на базе сенсора ON Semi: Запустили серийное производство модуля камеры DS-CAR0234-22 на базе сенсора… 07-04-2026

India s Electronics Push Shifts to Design but Ownership Gap Remains: India eyes tech supremacy by shifting electronics focus from manufacturing to design ownership. The post India s Electronics Push Shifts to Design but Ownership Gap Remains appeared first on EE Times… 16-04-2026

Panel-Level Packaging s Second Wave Meets Engineering Reality: The cost case is strengthening but glass warpage and bonding yield stand in the way. The post Panel-Level Packaging s Second Wave Meets Engineering Reality appeared first on Semiconductor Engineering… 16-04-2026

Chiplet Standards Aim For Plug-n-Play: They re necessary although insufficient for a marketplace. The post Chiplet Standards Aim For Plug-n-Play appeared first on Semiconductor Engineering… 16-04-2026

Silicon Photonics Lights The Way To More Efficient Data Centers: Optical is the future but getting there is harder than it looks. The post Silicon Photonics Lights The Way To More Efficient Data Centers appeared first on Semiconductor Engineering… 16-04-2026

eBeam Initiative At SPIE ALP 2026: Continuing Progress On Curvilinear EUV And Data Challenges: Advances in GPU computing and multi-beam mask writing are removing constraints to enable entirely curvilinear masks. The post eBeam Initiative At SPIE ALP 2026: Continuing Progress On Curvilinear EUV And Data Challenges appeared first on Semiconductor Engineering… 16-04-2026

Breakthrough Thin GaN Chiplet Technology: Combining GaN transistors with silicon-based digital circuits enables complex computing functions built directly into power chiplets. The post Breakthrough Thin GaN Chiplet Technology appeared first on Semiconductor Engineering… 16-04-2026

Unraveling DRAM SAQP Process Complexity With Monte Carlo Virtual Fabrication: Small variations in mandrel and spacer dimensions can impact DRAM performance and yield. The post Unraveling DRAM SAQP Process Complexity With Monte Carlo Virtual Fabrication appeared first on Semiconductor Engineering… 16-04-2026

Meeting High-Frequency And Power Density Challenges With Flip Chip MLF Packaging: Optimized signal paths lower parasitics and enhanced board-level thermal performance. The post Meeting High-Frequency And Power Density Challenges With Flip Chip MLF Packaging appeared first on Semiconductor Engineering… 16-04-2026

Automate And Speed Up TCAD Calibration With Expert Modules And ML Calibration Accelerator: Fine-tuning TCAD parameters with real-world feedback from test wafers is essential for quantitatively accurate and predictive results. The post Automate And Speed Up TCAD Calibration With Expert Modules And ML Calibration Accelerator appeared first on Semiconductor Engineering… 16-04-2026

Advancing Autonomous Fabs: Preventive maintenance PM automation as a foundational enabler for autonomous semiconductor manufacturing. The post Advancing Autonomous Fabs appeared first on Semiconductor Engineering… 16-04-2026

The Thermal And Power Realities Of The AI Era: Achieving energy-efficient AI systems will require pre-competitive industry-wide collaboration on foundational capabilities. The post The Thermal And Power Realities Of The AI Era appeared first on Semiconductor Engineering… 16-04-2026

Compact high-voltage chokes for EMI control: Chokes help reduce EMI and save space supporting high-voltage designs in power converters motor drives and power supplies. TDK Corporation has launched the B82722V6 B040 series of compact high-voltage current-compensated ring-core double chokes designed to suppress EMI in systems operating up to 1250 V DC 630 V AC . The components target next-generation applications such… 16-04-2026

AI tool for improving cache performance: An AI tool improves processor speed by studying cache use and helping make memory decisions without repeated testing and tuning. Researchers at North Carolina State University have developed CacheMind an AI-assisted tool that helps improve processor performance by analyzing and optimizing memory management. It allows computer architects to ask open-ended questions about hardware software… 16-04-2026

Power supply module for industrial devices: A power module converts AC to DC supports remote control and parallel use and works in systems lighting setups and places with limited cooling. TDK Corporation has introduced the TDK-Lambda PFE1500FB a 1500 W AC-DC power module designed for industrial lighting and building automation systems. The third-generation unit operates across a wide 85… 16-04-2026

Can a useful quantum computer be built by 2033 Asks DARPA.: DARPA is evaluating whether a useful quantum computer can be built by 2033. There are three stages to DARPA s evaluation A B and C. Stage A is to describe a ... The post Can a useful quantum computer be built by 2033 Asks DARPA. appeared first on Electronics Weekly… 16-04-2026

Open Cosmos hooks up with Ubotica Technologies: Open Cosmos the satellite manufacturer is collaborating with Ubotica Technologies on the Flight Demonstration of Federated Autonomous MEasurement FAME a project led by NASA s Jet Propulsion Laboratory JPL . The ... The post Open Cosmos hooks up with Ubotica Technologies appeared first on Electronics Weekly… 16-04-2026