Caxapa

Изменение компонентной базы шести оптических трансиверов APAC Opto: APAC Opto переводит шесть моделей оптических трансиверов на микросхему Semtech GN25L95 которая выполняет функции драйвера лазера и усилителя приёмника. 21-10-2026

1700 В 200 А 13 мОм паразитная индуктивность 20 нГн: трехфазный SiC MOSFET-модуль от AMG POWER: AMG POWER представил трехфазный SiC MOSFET-модуль на 1700 В и 200 А с сопротивлением сток-исток в открытом состоянии 13 мОм и паразитной индуктивностью 20 нГн A3G200N1700MEK6F. 20-10-2026

1700 В 200 А 13 мОм паразитная индуктивность 20 нГн: трехфазный SiC MOSFET-модуль от AMG POWER: AMG POWER представил трехфазный SiC MOSFET-модуль на 1700 В и 200 А с сопротивлением сток-исток в открытом состоянии 13 мОм и паразитной индуктивностью 20 нГн A3G200N1700MEK6F. 20-10-2026

20.10.2026: Новое поступление электронных компонентов KLS: Рады сообщить о поступлении на склад новой партии электронных компонентов производства KLS ведущего китайского производителя электронных компонентов. Продукция доступна для отгрузки со склада в Москве с 20.10.2026. В данной поставке представлены следующие компоненты: Полупроводники и диоды KLS: Диоды BAV99 более 1 5 млн шт. RS1M транзисторы BC817-40 защитные диоды SMBJ36CA SMCJ33A диоды.. 20-10-2026

Микроконтроллеры для оптических модулей от GigaDevice: igaDevice представила две серии микроконтроллеров для управления оптическими модулями: GD32E512 с тактовой частотой до 120 МГц и GD32E252 для низкоскоростных и промышленных применений. 19-10-2026

eMMC Cruetech: стабильные поставки и запас компонентов в условиях нестабильного рынка: Cruetech предлагает eMMC ёмкостью от 4 до 64 ГБ на базе NAND Flash памяти с ячейками MLC… 16-10-2026

Снижение цен на промышленные столы и тумбочки Актаком: На 15% снижены цены на большинство моделей промышленных столов Актаком со стандарной и антистатической ESD столешницей всех модификаций а также тумбочки Актаком. 15-10-2026

Фемтосекундные лазеры с длиной волны 1030 и 515 нм и мощностью до 20 Вт от JPT: Компания JPT представила фемтосекундные лазеры со средней выходной мощностью до 20 Вт длиной волны 1030 и 515 нм и пассивным воздушным охлаждением: Jetlit 20 IR и Jetlit… 14-10-2026

Making a Five-Segment Display with Platinum-Titanium Cathodes: Before the advent of effective semiconductor LEDs many display types existed to display things like numbers and other characters. The Nixie tube is a well-known one along with VFDs and read… 22-10-2026

Carbon Capture Scratching The Surface: According to the Global Status of CCS Carbon Capture and Storage report there are currently 132 commercial CCS projects in operation around the world. Together these facilities are capable of The post Carbon Capture Scratching The Surface appeared first on Electronics Weekly… 22-10-2026

Lower-Cost IMUs Could Expand Optical Image Stabilization Across Smartphones: Advances in MEMS-based motion sensors could make optical image stabilization more affordable across a wider range of mobile devices. The post Lower-Cost IMUs Could Expand Optical Image Stabilization Across Smartphones appeared first on EDN Asia… 22-10-2026

Every Type of Current Sensor Explained: Measuring electric currents is an essential element of many electrical systems but doing so in a way that is as nonintrusive as possible is not an easy problem to solve. read… 22-10-2026

Navitas unveils UHV SiC power module for energy and grid infrastructure: Gallium nitride GaN and silicon carbide SiC power semiconductor firm Navitas Semiconductor Corp of Torrance CA USA has announced an ultra-high-voltage UHV SiC power module family for advanced energy and grid infrastructure... 21-10-2026

Sega Genesis Controllers on the Philips CD-i: The Philips CD-i was not popular upon its launch in 1991 and is barely acknowledged today. In the opinion of MattKC it had a particularly poor selection of controllers too read… 21-10-2026

Infineon collaborates with NVIDIA on GaN-based power conversion systems for 800VDC AI data centers: Infineon Technologies AG of Munich Germany is advancing its collaboration with NVIDIA on 800V direct current VDC power architectures for AI data centers. Timed to coincide with NVIDIA s GTC Berlin developer conference on 20 22 October the announcement centers on the high-voltage intermediate bus converter IBC one of the most critical and demanding conversion stages in the power delivery… 21-10-2026

Photon Bridge raises 10m to tackle AI s emerging laser bottleneck: Photonic integration firm Photon Bridge of Eindhoven The Netherlands has raised 10m to tackle the emerging bottleneck in AI infrastructure: producing the millions of lasers that will be needed to connect increasingly large clusters of AI processors... 21-10-2026

When GPS Isn t Enough: Building a Second Layer of Positioning: GPS jamming is rising. Learn how 4G 5G and NTN positioning give mission-critical devices a trusted fallback when GNSS fails. The post When GPS Isn t Enough: Building a Second Layer of Positioning appeared first on EE Times… 21-10-2026

Altera extends Agilex FPGAs to defense systems: Defense-grade Agilex FPGAs and SoC FPGAs from Altera operate reliably in harsh environments across a temperature range of -55 C to 125 C. The post Altera extends Agilex FPGAs to defense systems appeared first on… 21-10-2026

MCUs accelerate multimodal edge AI: The Synaptics Astra SR200 series of xMCUs runs multimodal AI workloads without the memory and compute limitations of conventional MCUs. The post MCUs accelerate multimodal edge AI appeared first on… 21-10-2026

Rad-tolerant GaN converter powers space electronics: Microchip s POL-05-20S-T GaN converter delivers up to 20 A to power FPGAs MCUs and other processing-intensive digital loads in space. The post Rad-tolerant GaN converter powers space electronics appeared first on… 21-10-2026

Processor IP brings generative AI to edge devices: BrainChip s Sequora processor IP core runs generative AI and large language models LLMs directly on battery-powered edge devices. The post Processor IP brings generative AI to edge devices appeared first on… 21-10-2026

AMD defines rack-scale infrastructure for agentic AI: AMD Helion is a rack-scale reference design for agentic AI infrastructure combining open-source hardware and software. The post AMD defines rack-scale infrastructure for agentic AI appeared first on… 21-10-2026

Knitting Yarn and Filament with FilaLoom: We don t generally think of 3D printing and knitting in the same sentence. One uses threads and fine motor control while the other requires great knowledge of pressing buttons and read… 21-10-2026

Building a Simple Internet Radio: Broadcast radio isn t as popular as it once was its popularity suffering in turn due to technologies like MP3 players and music streaming services. If you don t fancy either of read… 21-10-2026

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