Caxapa

Модули и отладочные платы на базе RF-SoC радиочастотных систем на кристалле AMD-Xilinx под брендом Cruetech: Макро Групп предлагает модули для применения в готовых устройствах и отладочные наборы для разработки на ПЛИС семейства RF-SoC радиочастотных систем на кристалле от AMD-Xilinx от бренда… 26-02-2026

Профессиональные монтажные паяльные станции Актаком: Предлагаем с короткими сроками поставки широкий ассортимент профессиональных монтажных паяльных станций Актаком различных типов. 26-02-2026

Микроконтроллеры GigaDevice на Arm Cortex-M7 750 МГц с расширенными интерфейсами и EtherCAT: Компания GigaDevice объявила о расширении линейки высокопроизводительных микроконтроллеров представив серии устройств на базе ядра Arm Cortex -M7 с тактовой частотой до 750 МГц серии GD32H78E/77E и GD32H789/779. 25-02-2026

Промышленные столы Актаком АРМ-4хх0 прошли важные испытания на прочность: По результатам испытаний проведенных сертифицированной лабораторией подтверждена способность промышленных столов Актаком АРМ-4хх0 АРМ-4хх0-9 выдерживать вертикальную нагрузку до… 24-02-2026

Разъёмы Y50 по стандартам GJB598A-96 GJB101A-97 для ответственных применений: Теллур Электроникс начала поставки цилиндрических соединителей серии Y50 соответствующих китайским военным стандартам GJB598A-96 GJB101A-97 . Разъемам характерны быстрое соединение байонет 1/4 оборота малые вес и размеры высокая плотность контактов значительная устойчивость к вибрации к солевому туману и влаге. Выводы разъёмов предназначены под пайку. Серия Y50 имеет следующие варианты: 19-02-2026

Фотодиодные усиленные приёмники PDA-серии от Thorlabs: Компания Thorlabs предлагает линейку фотодиодных усиленных приёмников PDA-серии представляющих собой готовое решение для регистрации оптического излучения в лабораторных и R D-приложениях. 19-02-2026

Комбинированные осциллографы Актаком 7 в 1 доступны к поставке: Доступны к быстрой поставке двух и четырехканальные модели комбинированных осциллографов Актаком 7 в 1 с полосой пропускания 350 и 500 МГц. Приборы включены в Госреестр СИ РФ за номером… 18-02-2026

SambaNova Abandons Intel Acquisition Raises Funding Instead: AI chip startup launches new chip for agentic AI inference at scale. The post SambaNova Abandons Intel Acquisition Raises Funding Instead appeared first on EE Times… 26-02-2026

Jumping the Jeep: An alternative cost-effective solar cell example app: A solar charging kit purchased after further promotional enticement enables keeping a remotely located vehicle battery topped off. The post Jumping the Jeep: An alternative cost-effective solar cell example app appeared first on… 26-02-2026

Power Tips 150: Overcoming high-voltage monitoring challenges in gigawatt-scale data centers: Addressing reliable accurate and fast-acting voltage supervision that enables the reliable deployment of next-generation DC architectures. The post Power Tips 150: Overcoming high-voltage monitoring challenges in gigawatt-scale data centers appeared first on… 26-02-2026

Easily Replaceable USB-C Port Spawned By EU Laws: The USB-C port has become a defacto connectivity standard for modern devices largely supplanting the ugly mess of barrel jacks and micro USB connectors that once cursed us. While their read… 26-02-2026

Portsmouth Uni SARsatX developing Earth Observation mission: The University of Portsmouth is partnering with Saudi space-tech company SARsatX. They will be developing the concept for an Earth observation satellite mission aimed at supporting climate science and environmental ... The post Portsmouth Uni SARsatX developing Earth Observation mission appeared first on Electronics Weekly… 26-02-2026

Variable-reluctance sensors: From fundamentals to speed sensing: Their ability to deliver precise motion feedback without external excitation makes them a cost-effective choice for speed and position sensing. The post Variable reluctance sensors: From fundamentals to speed sensing appeared first on… 26-02-2026

AutomationDirect adds Penn-Union power connectors: AutomationDirect now offers Penn-Union split bolt connectors power bars service post connectors and more. Split bolts deliver a secure long lasting connection for two conductors in a wide range of power distribution applications. With options engineered to handle multiple wire gauges and material combinations including CU CU CU AL and AL AL they offer the flexibility installers need… 26-02-2026

EW BrightSparks 2025 profile: Harry Hale Leonardo: Now in its eighth year the EW BrightSparks awards see Electronics Weekly celebrate some of the brightest and most talented young engineers in the UK today. In the next in our ... The post EW BrightSparks 2025 profile: Harry Hale Leonardo appeared first on Electronics Weekly… 26-02-2026

What caught your eye Neuromorphic processing London robotaxis TeenTech: The choices cover neuromorphic processing that distinguishes human and non-human movement Wayve raising funds to launch robotaxis in London and TeenTech being this year s charity partner for our Women Leaders in Electronics Awards. The post What caught your eye Neuromorphic processing London robotaxis TeenTech appeared first on Electronics Weekly… 26-02-2026

CHIIPS 27 - Power semiconductors from Alex Lidow of EPC: Don t miss the latest episode of the excellent Electronics Weekly podcast CHIIPS. It features Alex Lidow CEO of EPC Efficient Power Conversion . CHIIPS is brought to you by our editor ... The post CHIIPS 27 Power semiconductors from Alex Lidow of EPC appeared first on Electronics Weekly… 26-02-2026

The Engineering of a Jimi Hendrix Performance: The guitarist Jimi Hendrix had a unique sound which has influenced countless musicians over the decades. He achieved it through mastery not only of his instrument but of the complex read… 26-02-2026

Exhibitions: TDK presents embedded solutions for next-generation applications at embedded world 2026: TDK Corporation announces its participation in embedded world 2026 held from March 10 to 12 in Nuremberg Germany. At booth 505 in hall 1 TDK will showcase a wide range of embedded solutions designed to meet evolving application demands. Visitors can engage directly with TDK experts to learn more about current technologies and system-level approaches. 26-02-2026

How IP Subsystems For Chiplets Will Unlock Your Next Wave Of Innovation: How IP reuse is changing to accommodate the requirements of multi-die design. The post How IP Subsystems For Chiplets Will Unlock Your Next Wave Of Innovation appeared first on Semiconductor Engineering… 26-02-2026

AI Energy Gap And Chiplets: Why Data Movement Matters: Making AI chiplets truly work efficiently demands clarity at the architectural and semantic layers. The post AI Energy Gap And Chiplets: Why Data Movement Matters appeared first on Semiconductor Engineering… 26-02-2026

AI Starting To Simplify Design Of Programmable Logic: Engineering specialization is still required but time to market will shrink for FPGAs and DSPs. The post AI Starting To Simplify Design Of Programmable Logic appeared first on Semiconductor Engineering… 26-02-2026

An Integrated Workflow For Circuit Design Simulation And Functional Safety Analysis: The process of creating separate design artifacts in different tools for specific purposes can be time-consuming and error-prone. The post An Integrated Workflow For Circuit Design Simulation And Functional Safety Analysis appeared first on Semiconductor Engineering… 26-02-2026

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