Caxapa

Александр Иванович Шокин, 1909 год

32-битные микроконтроллеры Arm Cortex-M3 до 96 МГц от Geehy на складе Макро Групп: На складе Макро Групп доступны 32-битные микроконтроллеры Geehy на ядре Arm Cortex-M3 с тактовой частотой до 96 МГц 64 КБ Flash и 20 КБ SRAM APM32F103C8T6. 26-10-2026

Новое поступление на склад РУ Электроникс: компоненты RUICHI и аналоги мировых брендов: РУ Электроникс пополняет склад электронными компонентами и электротехникой ожидается более 700 позиций комплектующих. Часть позиций уже доступна на складе остальные ожидаются в ближайшее время. Следить за актуальным статусом можно в файле catalog - arrivals . xlsx . В поступлении - продукция собственного бренда RUICHI и доступные аналоги западных производителей. Поможем подобрать электронику… 23-10-2026

Снижение цен на монтажные паяльные станции Актаком АТР-1107 и АТР-1109: Информируем о снижении цен на 20% на самые популярные паяльные станции Актаком с керамическим нагревателем АТР-1107 и АТР-1109. 23-10-2026

Изменение компонентной базы шести оптических трансиверов APAC Opto: APAC Opto переводит шесть моделей оптических трансиверов на микросхему Semtech GN25L95 которая выполняет функции драйвера лазера и усилителя приёмника. 21-10-2026

1700 В 200 А 13 мОм паразитная индуктивность 20 нГн: трехфазный SiC MOSFET-модуль от AMG POWER: AMG POWER представил трехфазный SiC MOSFET-модуль на 1700 В и 200 А с сопротивлением сток-исток в открытом состоянии 13 мОм и паразитной индуктивностью 20 нГн A3G200N1700MEK6F. 20-10-2026

1700 В 200 А 13 мОм паразитная индуктивность 20 нГн: трехфазный SiC MOSFET-модуль от AMG POWER: AMG POWER представил трехфазный SiC MOSFET-модуль на 1700 В и 200 А с сопротивлением сток-исток в открытом состоянии 13 мОм и паразитной индуктивностью 20 нГн A3G200N1700MEK6F. 20-10-2026

20.10.2026: Новое поступление электронных компонентов KLS: Рады сообщить о поступлении на склад новой партии электронных компонентов производства KLS ведущего китайского производителя электронных компонентов. Продукция доступна для отгрузки со склада в Москве с 20.10.2026. В данной поставке представлены следующие компоненты: Полупроводники и диоды KLS: Диоды BAV99 более 1 5 млн шт. RS1M транзисторы BC817-40 защитные диоды SMBJ36CA SMCJ33A диоды.. 20-10-2026

Микроконтроллеры для оптических модулей от GigaDevice: igaDevice представила две серии микроконтроллеров для управления оптическими модулями: GD32E512 с тактовой частотой до 120 МГц и GD32E252 для низкоскоростных и промышленных применений. 19-10-2026

High-Voltage Contactors: TDK launches 1000 V and 1500 V contactors for xEVs DC fast-charging and AI data center infrastructure: TDK Corporation has introduced the HVC28 and HVC29 series of gas-filled high-voltage DC contactors with optional mechanical auxiliary contact. Both series are available with continuous current ratings of 300 A 400 A 500 A and… 28-10-2026

SLAM Navigation For an Arduino Powered Car: There are plenty of robot projects out there that are really just a small remote control platform of some sort. We often like to think of robots of having some read… 28-10-2026

Introducing Build-A-Chip-Bench: From Workload Specification to GDS: Evaluate AI agents from workload specification through GDS layout using open-source tools and an open-source PDK to assess their ability to complete the chip-design workflow. The post Introducing Build-A-Chip-Bench: From Workload Specification to GDS appeared first on Semiconductor Engineering… 28-10-2026

Foundations of Power Management in the Age of AI: Make every layer of your hardware PDN-aware and reach your maximum compute density. The post Foundations of Power Management in the Age of AI appeared first on Semiconductor Engineering… 28-10-2026

Using AI for Analog Design: The growing role of AI in analog and mixed-signal design where complexity is rising schedules are tightening and the cost of mistakes is higher than ever. The post Using AI for Analog Design appeared first on Semiconductor Engineering… 28-10-2026

Foundation IP For The AI Era: Why Execution Saves You Millions On HPC And Edge AI SoCs: How a single integrated Foundation IP platform reduces re-spin risk and integration delays and helps lower TCO. The post Foundation IP For The AI Era: Why Execution Saves You Millions On HPC And Edge AI SoCs appeared first on Semiconductor Engineering… 28-10-2026

Planning Your AI Design Journey In RF EDA: Agentic solutions for RF design. The post Planning Your AI Design Journey In RF EDA appeared first on Semiconductor Engineering… 28-10-2026

How Much Can Semiconductor Models Hide: Advanced packaging requires models to cross company boundaries without exposing proprietary processes but hiding too much can make the prediction break down. The post How Much Can Semiconductor Models Hide appeared first on Semiconductor Engineering… 28-10-2026

Blog Review: Oct. 28: STCO for heterogeneous design physical AI interactions signing off AI-generated designs workload profile analysis. The post Blog Review: Oct. 28 appeared first on Semiconductor Engineering… 28-10-2026

Artificial Skin Gives Robotic Fingers a Sense of Touch: Robotic fingers can now handle thin solder wire and adjust their grip using artificial skin. It can process touch signals in about 23 milliseconds. Researchers at Southern University of Science and Technology in China and collaborating institutions have developed an artificial skin system for robotic fingers. The artificial skin allows robotic hands to sense… 28-10-2026

Anode-Free Lithium Battery Reaches 467Wh/kg: Researchers have developed a new lithium battery that reaches 467Wh/kg without a conventional graphite anode. Researchers at the Hong Kong University of Science and Technology HKUST have developed a lithium battery that does away with the anode one of the two main electrodes in a conventional cell. The prototype achieved a specific energy… 28-10-2026

Anduril and Qualcomm hook up for ruggedised laptop: Yesterday Anduril and Qualcomm said they had developed a prototype of a ruggedised laptop assembled in the US with 90% of its components sourced in the US. They call it The post Anduril and Qualcomm hook up for ruggedised laptop appeared first on Electronics Weekly… 28-10-2026

Lam and Imec pursue 3-D integration: Lam and imec are collaborating to accelerate manufacturing readiness for 3D integration technologies supporting advanced packaging and next-generation memory. By bringing together Lam s capabilities in deposition and etch with imec s The post Lam and Imec pursue 3-D integration appeared first on Electronics Weekly… 28-10-2026

Japan argues Emissions vs Net Zero: Japan like the UK is embroiled in the net zero versus economic reality argument. Prime Minister Sanae Takaichi is for trimming subsidies on EVs funding growth investments and cutting The post Japan argues Emissions vs Net Zero appeared first on Electronics Weekly… 28-10-2026

Infineon to put 1.1bn into GaN fab: Infineon intends to build the first high-volume 300mm GaN fab by investing around 1.1 billion in its llVillach site by 2034. The EU is contributing 319 million towards the cost. The post Infineon to put 1.1bn into GaN fab appeared first on Electronics Weekly… 28-10-2026

Can an Implantable Device Prevent Brain Tumour Recurrence: A battery-powered implantable device combines ultrasound and controlled drug release to help deliver drugs deeper into brain tissue. Massachusetts Institute of Technology MIT researchers have developed an implantable drug-delivery device that could help prevent the recurrence of glioblastoma an aggressive type of tumour. The device consists of a reservoir that can release drugs over… 28-10-2026

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