Моя конференция

Приглашаем на выставку ЭкспоЭлектроника-2026

Приглашаем посетить наш стенд компании Макро Групп на выставке ЭкспоЭлектроника-2026… 25-03-2026

Многоканальные паяльные станции Актаком доступны к поставке

Информируем о доступности поставки с короткими сроками широкого ассортимента многоканальных паяльных станций - ремонтных комплексов Актаком различного функционального назначения. 24-03-2026

Высокомощные разъёмы стандарта OCP M-CRPS от Oupiin

Компания Oupiin представила высокомощных разъёмов соответствующие стандарту OCP M-CRPS  серию… 23-03-2026

Преобразователи уровня К5017ПУ от АО НЗПП Восток

Серия К5017ПУ разработанная и производимая АО НЗПП Восток представляет собой линейку современных двунаправленных преобразователей логических уровней предназначенных для согласования цифровых сигналов между микросхемами и устройствами работающими при разных напряжениях. Микросхемы позволяют безопасно и эффективно устанавливать соединения между цифровыми устройствами что критически важно… 20-03-2026

Мотореле A-MEC

A-MEC представил мотореле с возможностью переключения тока и напряжения 100 А/250 В AC MR02-100… 20-03-2026

Приглашаем на выставку ExpoElectronica 2026

Рады сообщить что компания РУ Электроникс станет участником международной выставки электроники ExpoElectronica 2026 . Ждем вас с 14 по 16 апреля в Москве  на крупнейшем отраслевом событии в России и ЕАЭС чтобы обсудить новинки текущие проекты и перспективы сотрудничества. Выставка пройдет в Москве в МВЦ Крокус Экспо . Получить билет на выставку. Что ждет вас на выставке ExpoElectronica … 19-03-2026

SDR модули CR-P401D и CR-P501D от Cruetech

Компания Макро Групп предлагает SDR модули от бренда Cruetech CR-P401D… 18-03-2026

SDR модули CR-P401D и CR-P501D от Cruetech

Компания Макро Групп предлагает SDR модули на базе СнК Zynq MP-SOC от бренда Cruetech CR-P401D… 18-03-2026

Lingong Group talks about the future of mobile machinery design

At this year s CONEXPO-CON/AGG show in Las Vegas Lingong Group unveiled an expanded construction equipment portfolio and a new global service platform to better support customers across North America Europe and other key markets. The group s core subsidiaries Shandong Lingong Construction Machinery SDLG and Lingong Heavy Machinery LGMG introduced new product lines such as loaders … 25-03-2026

1MHz 555 VFC

A single resistor corrects LMC555 internal delays enabling a linear 1 MHz voltage-to-frequency converter with minimal components. The post 1MHz 555 VFC appeared first on… 25-03-2026

CHIIPS 29 - AI in orbit from Dr Rajan Bedi of Spacechips

Don t miss the latest episode of the excellent Electronics Weekly podcast CHIIPS. It features Dr Rajan Bedi CEO and founder of of Spacechips CHIIPS is brought to you by our ... The post CHIIPS 29 AI in orbit from Dr Rajan Bedi of Spacechips appeared first on Electronics Weekly… 25-03-2026

Solar Energy Harvesting Circuit

Summary: A low-light solar energy harvesting system using the LTC3105 with built-in MPPT can efficiently extract power from indoor ambient light as low as a few lux start from voltages as low as 250 mV and store energy in a supercapacitor to enable battery-less IoT devices. By continuously operating at the PV cell s maximum… 25-03-2026

Electric Motorcycles Don t Have To Be Security Nightmares But This One Was

Once upon a time they told us we wouldn t download a car and they were wrong. Later Zero Motorcycles stated in their FAQ that you cannot hack an electric motorcycle read… 25-03-2026

Infineon partners with Zenergize on power electronics for India s energy transition

At the Bharat Electricity Summit BES 2026 in Yashobhoomi New Delhi 19 21 March Infineon Technologies AG of Munich Germany announced a strategic technology partnership with Zenergize an emerging Indian company designing and manufacturing AI-integrated power electronics hardware for the solar EV charging and renewable energy sectors. Infineon has had a presence in India for nearly… 25-03-2026

Chiplets: 8 best practices for engineering multi-die designs

Multi-die designs introduce new engineering complexities and design considerations spanning packaging verification and thermal dynamics. The post Chiplets: 8 best practices for engineering multi-die designs appeared first on… 25-03-2026

RANSemi wins Apeiroon baseband design-in

RANSemi Limited the British semiconductor innovator pioneering Open RAN baseband SoCcplatforms for 4G and 5G networks today announced that its RNS802 5G RAN baseband SoC is being used to power mission-critical ... The post RANSemi wins Apeiroon baseband design-in appeared first on Electronics Weekly… 25-03-2026

Embedded World Video: How Octavo SiP accelerates embedded development

At Embedded World 2026 we caught up with Greg Sheridan Vice President of Strategy Product at Octavo Systems as part of our promotional coverage for the event. He asks: ... The post Embedded World Video: How Octavo SiP accelerates embedded development appeared first on Electronics Weekly… 25-03-2026

Build Your Own IR Audio Communication System at Home

Infrared Audio Communication is a method of transmitting sound wirelessly using pulses of invisible light rather than radio waves. It works by modulating the intensity of an IR LED to match the fluctuations of an audio signal. At the other end a phototransistor or a IR light sensing diode captures the flickering light… 25-03-2026

Piezo Actuators : Silver price hikes Don t worry TDK has the answer

The recent hike in precious metal prices is putting commercial pressure on conventional multilayer piezo designs that use silver. In addition to increasing costs silver is the primary cause of failure when moisture is present. By using copper instead of silver TDK offers a compelling solution to both challenges. 25-03-2026

SiC Gate Driver Reference Design

A 100 kW-class inverter reference platform that helps design engineers accelerate development of high-efficiency SiC-based traction and motor drive systems. For design engineers working on next-generation power electronics especially in electric vehicles EVs and industrial drive systems validated reference designs play a critical role in reducing development risk and accelerating time-to-marke 25-03-2026

What Policymakers Must Fix in Europe s Chips Act 2.0

As Brussels prepares the next phase of its semiconductor push the real challenge may lie less in technological choices than in fixing the policy machinery itself. The post What Policymakers Must Fix in Europe s Chips Act 2.0 appeared first on EE Times… 25-03-2026

Fault-tolerant Computation Method For Quantum Computers

Something unexpected is changing in quantum computing as fault-tolerant systems begin handling complex chemical calculations once thought far beyond practical reach Fujitsu and the University of Osaka have developed a new set of technologies aimed at accelerating the real-world use of quantum computers in chemistry and materials science. By combining the latest version… 25-03-2026

Processor with integrated memory for vehicle displays

One package combines processor and memory for vehicle displays and control reduces design steps and supports dashboards chargers and panels. Microchip s SAM9X75D5M System-in-Package SiP targets automotive and e-mobility HMI designs. It integrates an Arm926EJ-S processor with 512 Mbit DDR2 SDRAM in one package supports displays up to 10 inches at XGA resolution and… 25-03-2026

You Can Now Run MS-DOS Applications on the Apple IIe

After a lot of debugging Seth Kushniryk has managed to get the last issuess shaken out of his port of MS-DOS 2.0 to the Apple II and has released the read… 25-03-2026