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Решения для розничной торговли от AUO

Компания Теллур Электроникс предлагает к поставке дисплеи производителя AUO одного из ведущих разработчиков современных экранных решений для различных отраслей включая ритейл. Компания AUO предлагает экологичные и инновационные решения для интеллектуальной розничной торговли которые обеспечивают измеримые результаты: повышение вовлеченности клиентов автоматизацию сервисов и оптимизацию рентаб 06-05-2026

16-канальный разветвитель мощности 0 5-6 ГГц 30 Вт от Freflex

Высокопроизводительный 16-канальный пассивный разветвитель мощности работающий в диапазоне 0 5-6 ГГц представляет собой новейшее решение для многоканального распределения ВЧ/СВЧ-сигналов. 06-05-2026

Кастомизированный шлейф для подключения к OrangePi 5

Кастомизированный шлейф который позволяет подключить наши модули DS-CIMX напрямую к платформе OrangePi… 05-05-2026

SDR модуль CR-P151Q от Cruetech

SDR модуль на СнК AMD XCZU15EG-2FFVB1156I - CR-P151Q под брендом… 04-05-2026

Совместимость модуля DS-RK3568 от Диасом с российской операционный системой РЕД ОС

Подтвердили совместимость DS-RK3568 с операционной системой РЕД… 28-04-2026

Модули широкополосных источников света от Box Optronics

Компания Box Optronics запустила серийные поставки модулей широкополосных источников света BSLD-840-7SM-FA-M. 28-04-2026

Выгодное предложение Cнижение цен на импульсные источники питания Актаком

Сообщаем о значительном снижении цен на популярные модели импульсных источников питания Актаком APS-5310 30 В/10 А и APS-3020 30 В/20… 27-04-2026

Industrial AI: How Factories Learn to Live With Uncertainty

Industrial AI is moving beyond controlled environments with factories deploying systems designed to manage operational uncertainty. The post Industrial AI: How Factories Learn to Live With Uncertainty appeared first on EE Times… 07-05-2026

32Gbps ReDriver Targets Smart Cockpits

New four-channel automotive ReDriver improves 32Gbps signal integrity for AI-driven cockpit platforms supporting PCIe 5.0 SAS4 and CXL while reducing jitter power consumption and PCB design complexity. A new automotive-grade four-channel linear ReDriver by Diode Incorporated has been launched to address growing signal-integrity challenges in next-generation smart cockpit platforms integrating 07-05-2026

This Az-El Mount Is Worth Following

Communication with satellites often involves the use of high-gain directional antennas coupled with careful positioning to find and track the target. With a geostationary satellite the mount is either fixed read… 07-05-2026

AI Helps Robots Learn Faster

Researchers have developed an AI training method that enables robots to transfer skills learned in simulation into real-world tasks more efficiently reducing dependence on costly physical training data. Researchers  at Aston University have developed a new AI-based training framework that allows robots to transfer skills learned in laboratory simulations into real-world environments with… 07-05-2026

Algorithm Designs RF Chips That Look Like QR Codes 

An algorithm that can design RF chips in days instead of months. The resulting layouts look like QR codes and outperform conventional approaches.  Researchers at the USC Viterbi School of Engineering have developed an algorithmic framework for designing radio frequency integrated circuits RFICs enabling the discovery of unconventional chip layouts that traditional design approaches… 07-05-2026

Dual Switches for High-Bandwidth Signal Routing

Dual high-speed switches route PCIe 6.0 and USB4 v2.0 signals delivering up to 34 GHz bandwidth while enduring extreme industrial temperatures. Toshiba has introduced the TDS5C212MX and TDS5B212MX new 2:1 multiplexer and 1:2 demultiplexer switches designed for next generation high speed interfaces including PCIe 6.0 and USB4 Version 2.0. The devices are aimed at applications 07-05-2026

Geometry Solves the Thick Battery Speed Trap 

A 3D printed interlocking electrode kills dead zones. More storage faster charging and 7 500 cycles later without changing the material itself.  A research team led by engineers and scientists at Lawrence Livermore National Laboratory LLNL has developed a 3D printed electrode design aimed at improving electrochemical energy storage devices such as rechargeable batteries and supercapacitors. 07-05-2026

Solving AI s Hidden Receiver Validation Crisis

A new receiver test solution automates the impossible calibration at 128 GT/s. What engineers couldn t see before is now within reach.  Keysight Technologies has introduced a new PCIe 7.0 Receiver Test application expanding its validation portfolio to support end-to-end transmitter and receiver testing for next-generation compute AI and data center applications. The solution addresses… 07-05-2026

The Emergence Of Electronics Digital Twins For Software-Defined Vehicles

Why it s no longer sufficient to simulate a physical vehicle or subsystem. The post The Emergence Of Electronics Digital Twins For Software-Defined Vehicles appeared first on Semiconductor Engineering… 07-05-2026

Securing Chiplet-Based Platforms: Distributed Trust With Centralized Authority

A security model where every chiplet can prove identity boot correctly and communicate securely without becoming the weak link. The post Securing Chiplet-Based Platforms: Distributed Trust With Centralized Authority appeared first on Semiconductor Engineering… 07-05-2026

Powering AI At Scale: Why 3D-ICs Demand A New Approach To Power Integrity

Connectivity density and power delivery complexity have made power integrity one of the most critical constraints in modern system design. The post Powering AI At Scale: Why 3D-ICs Demand A New Approach To Power Integrity appeared first on Semiconductor Engineering… 07-05-2026

How OCP S.O.L.I.D. Completes The Data Center Security Picture

A framework that establishes concrete device-specific security requirements upfront and verifies them at the end. The post How OCP S.O.L.I.D. Completes The Data Center Security Picture appeared first on Semiconductor Engineering… 07-05-2026

Building AI Without Guardrails

The semiconductor ecosystem is wrestling with fragmented standards IP exposure and the urgent need for runtime assurance. The post Building AI Without Guardrails appeared first on Semiconductor Engineering… 07-05-2026

2.5D 3D 3.5D

Balancing performance manufacturability cost and thermal efficiency in ways neither traditional planar designs nor purely vertical stacks can. The post 2.5D 3D 3.5D appeared first on Semiconductor Engineering… 07-05-2026

What Is Power Usage Effectiveness PUE In Data Centers

A common metric overlooks the energy wasted by inefficient server AC/DC power conversion. The post What Is Power Usage Effectiveness PUE In Data Centers appeared first on Semiconductor Engineering… 07-05-2026

Beyond the Clinic: A Blueprint For Developing Reliable Edge AI-Enabled Medical Devices

Developing AI-guided patient-operated home ultrasound probes that can produce a reliable medical image. The post Beyond the Clinic: A Blueprint For Developing Reliable Edge AI-Enabled Medical Devices appeared first on Semiconductor Engineering… 07-05-2026