Программируемая логика и ЦОС

Промышленные столы Актаком АРМ-4х1х с антистатической столешницей. Скидка 15%

Информируем о продлении акции на промышленные столы АКТАКОМ АРМ-4х1х с антистатической ESD-столешницей в рамках которой действует скидка 15% от розничной цены. Новый срок действия - до 01 июня 2026… 16-04-2026

Автомобильный дискретный IGBT на 1200 В от Sunco

Компания Sunco производитель силовой электроники анонсировала новое поколение дискретных автомобильных IGBT-транзисторов напряжением 1200 В в корпусе… 15-04-2026

Аналоговые и mixed-signal ИС для промышленной автомобильной и потребительской электроники от NOVOSENSE Microelectronics

Компания Макро Групп начала сотрудничество с производителем высоконадёжных аналоговых и mixed-signal микросхем для промышленной автомобильной и потребительской электроники NOVOSENSE Microelectronics. 13-04-2026

Развитие направления гражданских БПЛА: решения от Теллур Электроникс

Компания Теллур Электроникс приглашает ознакомиться с новой специализированной страницей посвящённой решениям для разработки и производства гражданских беспилотных летательных аппаратов. В условиях стремительного роста рынка БПЛА и задач импортозамещения мы системно расширяем портфель электронных компонентов и модулей востребованных в таких областях как: мониторинг и безопасность сельское… 13-04-2026

Высоковольтный тестер сопротивления изоляции Актаком АММ-2093

Возобновлены продажи высоковольтного тестера сопротивления изоляции модели АММ-2093 предназначенного для проведения испытаний стойкости изоляции напряжением до 5/6 кВ AC/DC и измерения сопротивления изоляции до… 10-04-2026

Интеллектуальные ИС для дымовых газовых и комбинированных датчиков безопасности от 3Think. Вебинар

Компания Макро Групп приглашает на технический вебинар посвящённый специализированным решениям в области систем безопасности на базе интеллектуальных микросхем компании… 10-04-2026

Приглашаем посетить наш стенд на 31-ой Международной выставке Securika Moscow

Компания Макро ЕМС приглашает посетить 31-ую Международную выставку технических средств охраны и оборудования для обеспечения безопасности и противопожарной защиты Securika Moscow 2026 в Москве. 09-04-2026

Qbit Enables India s First Open-Box Quantum Testbeds in Amaravati

From closed labs to open testbeds two indigenous quantum systems quietly shift access hinting at a deeper transformation in how advanced computing evolves. India s quantum hardware ambitions took a step forward with the commissioning of two indigenously developed superconducting quantum systems built through a collaboration of startups and research institutions and deployed as open-access… 16-04-2026

Tuning Superconductivity Through the Material s Environment

A small environmental tweak can disrupt conventional behaviour hinting that superconductivity may depend less on materials themselves and more on their surroundings. The Ohio State University researchers have reported a new approach to controlling superconductivity by tuning the surrounding environment of a material offering fresh insight into one of physics most complex phenomena. Published… 16-04-2026

When Surveillance Moves Towards Native Interoperability

By eliminating middleware a new integration approach points toward surveillance systems that are easier to scale manage and adapt over time. Matrix has announced native integration of its network cameras with Milestone Systems XProtect video management software enabling direct interoperability within open surveillance architectures. The integration has been officially verified and listed… 16-04-2026

Violet Laser Targets Semiconductor Packaging Needs

A small change in wavelength and power could influence how future semiconductor layers are formed reducing constraints tied to legacy photolithography systems.  Nuvoton Technology has introduced a high-power violet laser diode designed to support maskless lithography in advanced semiconductor packaging. Operating at a wavelength of 402 nm and delivering an optical output of… 16-04-2026

Quinas completes Innovate UK project advancing ULTRARAM for AI and neuromorphic computing

Quinas Technology Ltd of London UK which was spun off from Lancaster University in early 2023 has completed a project funded by Innovate UK which provides funding and support for business innovation as part of UK Research and Innovation that explored the application of its proprietary ULTRARAM technology to neuromorphic computing... 16-04-2026

Good Support Accelerates Time to Market: The proper component alone is rarely enough

Norvento Enerx a needed more than just a suitable DC link capacitor to fit a hermetically sealed 8-megawatt inverter into a standard 20-foot container. The developers at the Spanish renewable energy specialist needed certainty that the design would operate stably under all operating conditions. 16-04-2026

Robot Bird Decoys Work for Good

Usually you think of bird decoys as being a tool to lure birds to an untimely encounter with a hunter. However Interesting Engineering has a story about robotic bird decoys read… 16-04-2026

India s Electronics Push Shifts to Design but Ownership Gap Remains

India eyes tech supremacy by shifting electronics focus from manufacturing to design ownership. The post India s Electronics Push Shifts to Design but Ownership Gap Remains appeared first on EE Times… 16-04-2026

Panel-Level Packaging s Second Wave Meets Engineering Reality

The cost case is strengthening but glass warpage and bonding yield stand in the way. The post Panel-Level Packaging s Second Wave Meets Engineering Reality appeared first on Semiconductor Engineering… 16-04-2026

Chiplet Standards Aim For Plug-n-Play

They re necessary although insufficient for a marketplace. The post Chiplet Standards Aim For Plug-n-Play appeared first on Semiconductor Engineering… 16-04-2026

Silicon Photonics Lights The Way To More Efficient Data Centers

Optical is the future but getting there is harder than it looks. The post Silicon Photonics Lights The Way To More Efficient Data Centers appeared first on Semiconductor Engineering… 16-04-2026

eBeam Initiative At SPIE ALP 2026: Continuing Progress On Curvilinear EUV And Data Challenges

Advances in GPU computing and multi-beam mask writing are removing constraints to enable entirely curvilinear masks. The post eBeam Initiative At SPIE ALP 2026: Continuing Progress On Curvilinear EUV And Data Challenges appeared first on Semiconductor Engineering… 16-04-2026

Breakthrough Thin GaN Chiplet Technology

Combining GaN transistors with silicon-based digital circuits enables complex computing functions built directly into power chiplets. The post Breakthrough Thin GaN Chiplet Technology appeared first on Semiconductor Engineering… 16-04-2026

Unraveling DRAM SAQP Process Complexity With Monte Carlo Virtual Fabrication

Small variations in mandrel and spacer dimensions can impact DRAM performance and yield. The post Unraveling DRAM SAQP Process Complexity With Monte Carlo Virtual Fabrication appeared first on Semiconductor Engineering… 16-04-2026

Meeting High-Frequency And Power Density Challenges With Flip Chip MLF Packaging

Optimized signal paths lower parasitics and enhanced board-level thermal performance. The post Meeting High-Frequency And Power Density Challenges With Flip Chip MLF Packaging appeared first on Semiconductor Engineering… 16-04-2026

Automate And Speed Up TCAD Calibration With Expert Modules And ML Calibration Accelerator

Fine-tuning TCAD parameters with real-world feedback from test wafers is essential for quantitatively accurate and predictive results. The post Automate And Speed Up TCAD Calibration With Expert Modules And ML Calibration Accelerator appeared first on Semiconductor Engineering… 16-04-2026