ВходНаше всё Теги codebook 无线电组件 Поиск Опросы Закон Вторник
31 марта
60 59 58 57 56 55 54 53 52 51
Новая тема
Рене Декарт Рене Декарт, 1596 год
Корней Чуковский Корней Чуковский, 1882 год
Эйфелева башня Эйфелева башня, 1889 год
Расширение ассортимента: компактные блоки питания HDR-12 на складе Расширение ассортимента: компактные блоки питания HDR-12 на складе
Линейка блоков питания на DIN-рейку RUICHI пополнилась четырьмя моделями серии HDR-12: HDR-24-12 HDR-30-12 HDR-48-12 HDR-60-12. Все новинки выполнены в узком пластиковом корпусе с пассивным охлаждением что позволяет эффективно использовать место в щитах с высокой плотностью монтажа включая герметичные боксы. Новые блоки питания ориентированы на использование в системах промышленной автоматиза 27-03-2026
Скидка 15% на имульсные тестеры обмоток Актаком АМ-3085 и АМ-3083 Скидка 15% на имульсные тестеры обмоток Актаком АМ-3085 и АМ-3083
Спешим сообщить о расширение акции на высоковольтные тестеры обмоток Актаком. Только до 1 мая 2026 года со скидкой 15% можно приобрести не только АМ-3085 но и его младшего собрата -АМ-3083. 27-03-2026
Высокотемпературные оптические трансиверы Cruetech
Оптические трансиверы российской торговой марки Cruetech серии DTABTP9 созданы для применения в приложениях с высокими температурными нагрузками. 27-03-2026
SiC MOSFET на 1200 В 75 А 30 мОм в корпусе TOLT с верхним отводом тепла от AMG Power
AMG Power анонсировал производства карбид-кремниевых МОП-транзисторов транзисторов на 1200 В с сопротивлением 30 мОм в корпусе TOLT с отводом тепла через верхнюю поверхность. 26-03-2026
Приглашаем на выставку ЭкспоЭлектроника-2026
Приглашаем посетить наш стенд компании Макро Групп на выставке ЭкспоЭлектроника-2026… 25-03-2026
Многоканальные паяльные станции Актаком доступны к поставке Многоканальные паяльные станции Актаком доступны к поставке
Информируем о доступности поставки с короткими сроками широкого ассортимента многоканальных паяльных станций - ремонтных комплексов Актаком различного функционального назначения. 24-03-2026
Высокомощные разъёмы стандарта OCP M-CRPS от Oupiin
Компания Oupiin представила высокомощных разъёмов соответствующие стандарту OCP M-CRPS  серию… 23-03-2026
Преобразователи уровня К5017ПУ от АО  НЗПП Восток Преобразователи уровня К5017ПУ от АО НЗПП Восток
Серия К5017ПУ разработанная и производимая АО НЗПП Восток представляет собой линейку современных двунаправленных преобразователей логических уровней предназначенных для согласования цифровых сигналов между микросхемами и устройствами работающими при разных напряжениях. Микросхемы позволяют безопасно и эффективно устанавливать соединения между цифровыми устройствами что критически важно… 20-03-2026
Packaging Method Enables Photonic Chips in Extreme Conditions Packaging Method Enables Photonic Chips in Extreme Conditions
A packaging method helps photonic chips work in heat cold vacuum and radiation enabling use in space quantum systems and industrial environments. A new packaging method now allows photonic chips to operate in extreme environments such as high heat radiation vacuum and very low temperatures. This work from the National Institute of Standards… 31-03-2026
Noise-free Phonon Lasers for Next-Gen Quantum Compasses
A mysterious phonon laser breakthrough that could quietly transform navigation sensing and future technologies in unexpected ways. Scientists in the United States have developed a new type of phonon laser that significantly reduces noise opening the door to advanced technologies such as quantum compasses and next-generation microchips. The research was carried out by teams… 31-03-2026
Turning Body Heat into Electricity for Battery-Free Devices Turning Body Heat into Electricity for Battery-Free Devices
What if body heat could power devices A material turns heat into electricity opening the door to wearables and sensors that run without batteries. Researchers at Queensland University of Technology QUT have developed a soft hydrogel that converts body heat into electricity showing potential to power wearable devices without batteries. A 10 mm square… 31-03-2026
Chip-scale Optical Wireless System  Redefines Ultra Fast Connectivity
This Optical Wireless System can reach 362 Gbps with low energy consumption making future wireless communication more efficient. A team of researchers at the University of Cambridge Li-Fi Research and Development Centre has developed a chip-scale optical wireless communication system capable of delivering extremely high data speeds while consuming less energy than traditional wireless technologie 31-03-2026
AutomationDirect adds Datalogic vision sensor models
AutomationDirect now offers additional models in the Datalogic Smart-VS vision sensor family. The Smart-VS Plus sensor includes Ethernet communication and multiple I/O points and supports up to three object classifications for applications such as Good/No Good/No Object testing. The Smart-VS Plus imager supports up to 20 stored images and has an operating range of 50 The post AutomationDirect… 31-03-2026
PDP-11 Lives in Literal Computer Desk Once More PDP-11 Lives in Literal Computer Desk Once More
When you think of iconic parings your brain probably goes more to cookies and milk than DEC and Ikea but after watching Dave s latest on Usagi Electric where he puts read… 31-03-2026
Simulations of Silicon Spin Qubits Based on a GAAFET Teikyo U. Riken
A new technical paper Device/circuit simulations of silicon spin qubits based on a gate-all-around transistor was published by Teikyo University and RIKEN. Abstract We theoretically investigated the readout process of a spin qubit structure based on a gate-all-around GAA transistor. Our study focuses on a logical qubit composed of two physical qubits. Different spin configurations… 31-03-2026
See The Computers That Powered The Voyager Space Program See The Computers That Powered The Voyager Space Program
Have you ever wanted to see the computers behind the first and for now only man-made objects to leave the heliosphere Gary Friedman shows us with an archived tour of read… 31-03-2026
Accelerating corporate ai investment returns
AI investments across industries struggle to pay off. Record spending on artificial intelligence has yet to translate into record earnings impact. Global enterprise budgets for AI are surging past three hundred billion dollars generative models command attention and board agendas are crowded… 31-03-2026
A Week In The City In January 1961
Following the successful completion of the merger arrangements shares of Pye and E. K.Cole have been withdrawn from the lists and the shares of the new joint company British Electronic ... The post A Week In The City In January 1961 appeared first on Electronics Weekly… 31-03-2026
This Front Panel Makes Its Own Clean-Edged Drill Guides This Front Panel Makes Its Own Clean-Edged Drill Guides
We haven t seen an instrument panel quite like bluesyann s which was made by curing UV resin directly onto plywood with the help of a 3D printer and a bit of read… 31-03-2026
Retro Open Source Camera Straight from the  90s Retro Open Source Camera Straight from the 90s
In our modern society we have started to take the humble camera for granted. Perhaps because of this trendy standalone cameras have started to take off. Unfortunately most of the read… 30-03-2026
TeraFab: What If It Is Done Differently
Musk unveils TeraFab aiming to disrupt chipmaking with AI-driven human-free fabs. The post TeraFab: What If It Is Done Differently appeared first on EE Times… 30-03-2026
Recreating One of the First Hackintoshes Recreating One of the First Hackintoshes
Apple s Intel era was a boon for many especially for software developers who were able to bring their software to the platform much more easily than in the PowerPC era. read… 30-03-2026
500 Blind Stick Without Code 500 Blind Stick Without Code
The Blind Stick is a low-cost assistive device designed to help visually impaired individuals detect obstacles and navigate safely. It uses an infrared IR sensor module to identify objects in front of the user and instantly triggers a buzzer for real-time audio alerts. The system is powered by a 9V battery with an LM7805… 30-03-2026
MoU signed to discuss integrating Toshiba Electronic Devices Storage s semiconductor business ROHM s semiconductor business and Mitsubishi Electric s power device business
Toshiba Corp of Kawasaki Japan has signed a memorandum of understanding MoU to start discussions regarding a business integration of the semiconductor business of its subsidiary Toshiba Electronic Devices Storage Corp TDSC the semiconductor business of ROHM Co Ltd and the power device business of Mitsubishi Electric Corp. The MoU was signed with Japan Industrial Partners Inc JIP … 30-03-2026