Схемы, платы, компоненты

Выставка ЭКСПОЭЛЕКТРОНИКА 2026 в Крокус Экспо 14-16 Апреля 2026

Компания РАДИОТЕХ примет участие в 28-й Международной выставке электроники ExpoElectronica 2026 которая пройдёт с 14 по 16 апреля 2026 года в Московском выставочном центре Крокус Экспо Павильон 3 . На стенде компании посетители выставки смогут: - Ознакомиться с новинками поставляемой продукции - Получить консультации технических специалистов по подбору компонентов для различных... 16-02-2026

Процессор для AIoT применения от Rockchip

Процессор для AIoT RK3562 от Rockchip получил награду Продукт с выдающимися рыночными показателями… 16-02-2026

Дешевле до 50% Монтажные наконечники для паяльных станций Актаком

Снижаем цены до 50% на самые популярные модели наконечников и наконечников-картриджей применяемых в монтажных паяльных станциях Актаком. 13-02-2026

Процессорные модули Jetson NVIDIA в каталоге Макро Групп

Макро Групп анонсирует начало поставок процессорных модулей NVIDIA… 12-02-2026

Популярные модели токовых клещей Актаком серии АТК

Предлагаем уникальные модели токовых клещей Актаком серии АТК которые долгие годы пользуются повышенной популярностью у профессионалов в области энергетики. Готовы к поставке токоизмерительные клещи -ваттметр АТК-2200 до 1200 кВт универсальная модель АТК-2250 до 2500 А микротоковые клещи АТК-2001 а также токовые клещи с гибким магнитопроводом АТК-2011 и АТК-2012 10-02-2026

Приглашаем посетить наш стенд на ТБ Форум-2026

Компания Макро ЕМС приглашает посетить выставку в рамках международного форума Технологии и безопасность 2026 в Москве. 10-02-2026

Неохлаждаемый инфракрасный модуль с разрешением 1280 1024 от InfiRay

Компания InfiRay анонсировала компактный неохлаждаемый инфракрасный модуль с разрешением 1280 1024 предназначенный для интеграции в современные оптико-электронные системы … 05-02-2026

Наконечники для термофенов паяльных станций Актаком дешевле до 69%

До 69% снижены цены на практически всю номенклатуру сопел для пайки горячим воздухом термофенов паяльных станций и ремонтных центров с термовоздушных каналом 04-02-2026

Corporate: Powering Next-Gen Mobility: TDK Announces Title Partner of ABB FIA Formula E World Championship - Tokyo E-Prix Night Race

TDK Corporation will serve as the title partner of the Formula E Tokyo E-Prix hereinafter Tokyo E Prix to be held as a night race in Tokyo on July 25 and 26. This edition of the race will be held under the title 2026 TDK Tokyo E-Prix… 17-02-2026

Secure Vision Chip For CCTV

A vision chip runs on-device video analytics with edge AI and hardware security reducing cloud use in CCTV systems. Here is what it brings. Mindgrove Technologies plans to release its V2600 system-on-chip in late 2026 for CCTV and surveillance systems that require built-in security and on-device processing. The chip is designed to run video… 17-02-2026

HBF challenges HBM

High Bandwidth Flash HBF using stacked DRAM and NAND die in the same package is seen as a challenger to HBM particularly for inference. Used with the Blackwell B200 HBF ... The post HBF challenges HBM appeared first on Electronics Weekly… 17-02-2026

GM battery cell charges from 10-70% in 5.6 mins

GM has developed an ultra-fast charge battery cell the GM XFC Cell which claims to charge from 10% to 70% in roughly 5.6 minutes The cell uses a lithium iron ... The post GM battery cell charges from 10-70% in 5.6 mins appeared first on Electronics Weekly… 17-02-2026

Fraunhofer adds 10G TSN IP core

The Fraunhofer Institute for Photonic Microsystems IPMS has developed a 10G TSN endpoint Ethernet IP Core enabling deterministic real-time communication at data rates of up to 10 Gbit/s. The core ... The post Fraunhofer adds 10G TSN IP core appeared first on Electronics Weekly… 17-02-2026

Infineon and BMW define Neue Klasse platform

Infineon and BMW have collaborated on BMW s Neue Klasse SDV architecture incorporated in it automotive electrification platform debuted in the iX3 model pictured . We are proud to collaborate with BMW ... The post Infineon and BMW define Neue Klasse platform appeared first on Electronics Weekly… 17-02-2026

High-side driver powers through disturbances

With 4V minimum operating voltage ST s VNQ9050LAJ 4-channel automotive high-side driver powers through disturbances including extreme cold cranking operation down to 2.7V. This resilience when exposed to severe transients meets ... The post High-side driver powers through disturbances appeared first on Electronics Weekly… 17-02-2026

Performing an Autopsy on 15 Dead Battle Born LFP Batteries

Because size matters when it comes to statistics Will Prowse decided to not just bank on his handful of failed Battle Born LFP batteries when it came to documenting their read… 17-02-2026

Next-Level Mobile Photography Starts Here

A 200MP sensor with 0.5µm pixels targets zoom cameras supports fast processing and low-light capture. How does pixel size affect performance Samsung has launched a new 200MP image sensor called ISOCELL HP5. It is the first sensor to use 0.5µm pixels. The company plans to use it in upcoming smartphones. The HP5 is mainly… 17-02-2026

120 kW Grid-Tied Inverter Test Platform 

The high-capacity automated system strengthens North India s access to advanced standards-compliant solar inverter validation infrastructure. India s rapidly expanding solar market has gained a significant boost with the introduction of a 120 kW grid-tied inverter GTI test system by Exeliq Tech Solutions designed to meet rising compliance safety and performance validation demands. The… 17-02-2026

Edge AI Platform With Real-Time Intelligence

The new edge-first system integrates industrial AI software with GPU-accelerated infrastructure to reduce latency protect data and fast-track adoption across manufacturing clusters. India s push to embed artificial intelligence into factories and critical infrastructure is getting a new edge-focused boost with the launch of YodaEdge a pre-integrated platform designed to run AI workloads… 17-02-2026

AI Chips Optimize Yeast Protein Coding

MIT s AI system boosts precision protein drug production cutting development costs by learning the language of genetic sequences. In a move that signals deeper convergence between artificial intelligence and bio-manufacturing electronics researchers at the Massachusetts Institute of Technology MIT have developed an advanced large language model-based tool that could significantly reduce… 17-02-2026

A Lidar That Sees Motion In 4D

This 4D LiDAR sensor sees all around tracks speed and distance together and helps machines move safely in tight spaces. Let us find out more Aeva has introduced Omni a short-range 4D LiDAR sensor for physical AI systems that need awareness in close spaces. Omni provides a 360-degree horizontal and 90-degree vertical field… 17-02-2026

Ultra-Compact Radar Chip Advances 6G

0.24 mm low-power FMCW design targets 6G sensing-communication convergence in edge electronics. Tokyo scientists have unveiled a tiny radar-on-chip prototype that could reshape future wireless hardware for beyond-5G and 6G ecosystems marrying sensing with communications in a power-lean design.  Developed at Japan s Institute of Science Tokyo the new chip packs a high-precision Frequency-Modulat 17-02-2026

New Class Of Semiconductors Made Of Germanium-Tin Alloy University of Edinburgh et al.

A new technical paper High Pressure and Compositionally Directed Route to a Hexagonal GeSn Alloy Class was published by researchers at the University of Edinburgh GFZ Helmholtz Centre for Geosciences the University of Lille Grenoble Alpes University the University of Bayreuth and the European Synchrotron facility. Abstract Despite their electronic dominance cubic diamond structured… 17-02-2026

What the FDA s 2026 Wellness Device Update Means for Wearables

With more and more sensors being crammed into the consumer devices that many of us wear every day the question of where medical devices begin and end and how they read… 17-02-2026