Схемы, платы, компоненты

Аналоговые и mixed-signal ИС для промышленной автомобильной и потребительской электроники от NOVOSENSE Microelectronics

Компания Макро Групп начала сотрудничество с производителем высоконадёжных аналоговых и mixed-signal микросхем для промышленной автомобильной и потребительской электроники NOVOSENSE Microelectronics. 13-04-2026

Развитие направления гражданских БПЛА: решения от Теллур Электроникс

Компания Теллур Электроникс приглашает ознакомиться с новой специализированной страницей посвящённой решениям для разработки и производства гражданских беспилотных летательных аппаратов. В условиях стремительного роста рынка БПЛА и задач импортозамещения мы системно расширяем портфель электронных компонентов и модулей востребованных в таких областях как: мониторинг и безопасность сельское… 13-04-2026

Высоковольтный тестер сопротивления изоляции Актаком АММ-2093

Возобновлены продажи высоковольтного тестера сопротивления изоляции модели АММ-2093 предназначенного для проведения испытаний стойкости изоляции напряжением до 5/6 кВ AC/DC и измерения сопротивления изоляции до… 10-04-2026

Интеллектуальные ИС для дымовых газовых и комбинированных датчиков безопасности от 3Think. Вебинар

Компания Макро Групп приглашает на технический вебинар посвящённый специализированным решениям в области систем безопасности на базе интеллектуальных микросхем компании… 10-04-2026

Приглашаем посетить наш стенд на 31-ой Международной выставке Securika Moscow

Компания Макро ЕМС приглашает посетить 31-ую Международную выставку технических средств охраны и оборудования для обеспечения безопасности и противопожарной защиты Securika Moscow 2026 в Москве. 09-04-2026

Модуль камеры DS-CAR0234-22 на базе сенсора ON Semi

Запустили серийное производство модуля камеры DS-CAR0234-22 на базе сенсора… 07-04-2026

Разъёмы JCDw аналоги ОНП-ЖИ СНП339

Теллур Электроникс предлагает малогабаритные низкочастотные прямоугольные соединители JCDw. Разъёмы соответствуют стандарту GJB2446A MIL-C-83513 предназначены для внутреннего монтажа и являются аналогом российских серий ОНП-ЖИ и СНП339. th td padding: 5px Аналог JCDw Российский артикул ОНП-ЖИ / СНП339 JCDw-21TJ-N1 ОНП-ЖИ-8-21/46х8-В38-1 / СНП339-21ВП118-1 JCDw-21ZK-N1Q ОНП-ЖИ-8-21/46х8-Р2 07-04-2026

Same Sky IP rated USB Type C connectors include UV-glued O-rings

Same Sky Interconnect Group is announcing the expansion of its USB Type C connectors line with a range of new IP rated models.   Its UJ family now has waterproof ... The post Same Sky IP rated USB Type C connectors include UV-glued O-rings appeared first on Electronics Weekly… 14-04-2026

FPGA Developer Intern At Vicharak In Surat

APPLY HERE ON LINKEDIN Location: Surat Company: Vicharak What You Will Learn What You Will Work On Preferred… 14-04-2026

Get the Gadget Master newsletter

Ensure you receive the latest and greatest Gadget Master posts hot and fresh straight into your inbox The post Get the Gadget Master newsletter appeared first on Electronics Weekly… 14-04-2026

Amphenol expands liquid-cooling connector range

Amphenol Industrial Operations has expanded its quick disconnect liquid-cooling connector series to meet the thermal and operational needs of large-scale AI datacentres high-performance computing environments energy storage systems and electric ... The post Amphenol expands liquid-cooling connector range appeared first on Electronics Weekly… 14-04-2026

Navitas appoints Gregory M. Fischer as independent director

Gallium nitride GaN power IC and silicon carbide SiC technology firm Navitas Semiconductor Corp of Torrance CA USA has appointed semiconductor veteran Gregory M. Fischer to its board serving on the Compensation and Executive Steering committees. He will stand for reelection in 2027 as a Class III director... 14-04-2026

BharatAI 2026 Announced: 3-Day AI Conference Expo in Bengaluru from May 13-15

AI Benefits Bharat. That s the mission for BharatAI. This unique conference-plus-expo aims to accelerate the use of AI across Bharat. Hence the event is designed to connect creators of AI with customers system integrators and investors who are seeking to explore the power of AI. BharatAI features a 3-day conference  investor meet  B2B expo and hands-on workshops to build… 14-04-2026

How system-level validation compresses schedule risk in device design

Component-level validation is crucial in bridging design and manufacturing in flagship device launches. The post How system-level validation compresses schedule risk in device design appeared first on… 14-04-2026

Audio Reactive LED Strips Are Hard

Back in 2017 Hackaday featured an audio reactive LED strip project from Scott Lawson that has over the years become an extremely popular choice for the party animals among us. read… 14-04-2026

BSC Spinoff to Secure Chips for Critical Infrastructure 

BSC and UPC launch a spin-off creating auditable processor architecture for European critical infrastructure. The post BSC Spinoff to Secure Chips for Critical Infrastructure  appeared first on EE Times… 14-04-2026

CEA-Leti CEA-List and PSMC collaborate to integrate RISC-V and micro-LED silicon photonics into 3D stacking and interposer

To deliver solutions for next-generation artificial intelligence AI systems a strategic collaboration has been announced that will leverage the RISC-V design expertise of smart digital system specialist CEA-List and the silicon photonics expertise of micro/nanotechnology R D center CEA-Leti of Grenoble France to introduce high-bandwidth communication and high-efficiency computing technologies 14-04-2026

The Smart Advantage: How Artificial Intelligence Is Transforming Inspection And Metrology In Semiconductor Manufacturing

Deep learning enables systems to detect and flag issues that could otherwise be misread or missed entirely. The post The Smart Advantage: How Artificial Intelligence Is Transforming Inspection And Metrology In Semiconductor Manufacturing appeared first on Semiconductor Engineering… 14-04-2026

Heterogeneous NPU Data Movement: What The Execution Flow Shows

A concrete example of how architectural boundaries influence system behavior. The post Heterogeneous NPU Data Movement: What The Execution Flow Shows appeared first on Semiconductor Engineering… 14-04-2026

Research Bits: Apr. 14

Memristors: Authentication for edge devices ultra-high temperature operation DNA plus perovskites. The post Research Bits: Apr. 14 appeared first on Semiconductor Engineering… 14-04-2026

Chip Industry Technical Paper Roundup: Apr. 14

Silicon spin qubits based on GAA causal AI for AMS design wide-bandgap automotive reliability agentic HLS co-packaged optics constraint programming for semiconductor manufacturing automated security assertions with LLMs. The post Chip Industry Technical Paper Roundup: Apr. 14 appeared first on Semiconductor Engineering… 14-04-2026

Humidity Sensor Combines Sensing and Processing

A neuromorphic sensor can detect humidity process signals and store data in one device. It uses less energy and can be used in edge computing wearables and monitoring systems. A humidity-responsive neuromorphic sensor has been developed that can sense process and store information within a single device. By combining these functions it reduces energy… 14-04-2026

Compact connector for high frequency panels

A connector helps fit more connections on panels supports signals and simplifies setup making it useful for system design and signal routing. Amphenol RF has added an HD-BNC bulkhead connector to its coaxial connector range. It is built for panel mounting allowing the connector to be fixed securely in place. Its high-density design lets… 14-04-2026