Схемы, платы, компоненты

Скидка 15% на имульсные тестеры обмоток Актаком АМ-3085 и АМ-3083

Акция на импульсные высоковольтные тестеры обмоток Актаком продлена До 1 июня 2026 года со скидкой 15% можно приобрести не только АМ-3085 но и его младшего собрата -АМ-3083. 22-04-2026

Итоги выставки ExpoElectronica 2026: ключевые тренды и новинки РУ Электроникс

Компания  РУ Электроникс приняла участие в 28-й международной выставке ExpoElectronica 2026 которая традиционно является ключевым отраслевым событием в сфере электронной промышленности. В рамках масштабной экспозиции был представлен широкий спектр линеек электронных компонентов RUICH I включая разъёмы дисплеи устройства коммутации клеммники конденсаторы тиристоры и многие другие.… 21-04-2026

Итоги выставки ExpoElectronica 2026

Компания Теллур Электроникс приняла участие в международной выставке ExpoElectronica 2026 которая традиционно является одной из ключевых площадок для демонстрации достижений в области электронной промышленности. В рамках мероприятия наша команда представила актуальные решения и продукцию по направлениям электромеханики микроэлектроники СВЧ датчиков дисплеев и отечественной элементной базы.… 21-04-2026

SDR модули CR-P047/CR-P047P от Cruetech

Макро Групп предлагает SDR модули CR-P047 и CR-P047P под брендом… 20-04-2026

Промышленные eMMC NAND и DDR ИС и модули от Cruetech для встраиваемых систем

Cruetech продолжает укреплять своё предложение высоконадежной памяти для промышленных и коммерческих встраиваемых решений. 17-04-2026

Промышленные eMMC NAND и DDR ИС и модули от Cruetech для встраиваемых систем

Cruetech продолжает укреплять своё предложение высоконадежной памяти для промышленных и коммерческих встраиваемых решений. 17-04-2026

Промышленные столы Актаком АРМ-4х1х с антистатической столешницей. Скидка 15%

Информируем о продлении акции на промышленные столы АКТАКОМ АРМ-4х1х с антистатической ESD-столешницей в рамках которой действует скидка 15% от розничной цены. Новый срок действия - до 01 июня 2026… 16-04-2026

The ASIC design remake in the AI era

ASICs are increasingly becoming modular and disaggregated with a shift toward system-specific designs. The post The ASIC design remake in the AI era appeared first on… 23-04-2026

Dual-axis motor drive on a single MCU design

Dual-axis motor control delivers response speeds and precision from a single controller using control techniques. TIDM-02007 a reference design from Texas Instruments TI demonstrates a dual-axis motor drive on a single C2000 controller that achieves high bandwidth low latency and precise control using Fast Current Loop FCL and Software Frequency Response Analyzer SFRA technologies.… 23-04-2026

SiC Chips Could Make EVs More Efficient

Silicon carbide chips promise performance energy loss reduction and electric vehicle range with production scaling as demand for EV technology rises. Bosch has started shipping samples of its third-generation silicon carbide SiC chips to automakers worldwide paving the way for more efficient electric vehicles EVs in the near future. The new chips are expected… 23-04-2026

AI tools step into chip design to cut complexity

New EDA approach uses generative and agentic AI to speed semiconductor and PCB development Artificial intelligence is moving deeper into semiconductor design with a new electronic design automation EDA solution aiming to simplify chip development while accelerating time-to-market. The latest system by Agileo Automation integrates generative and agentic AI directly into chip and… 23-04-2026

TSMC introduces A13 node says no need for high-NA through 2029

TSMC has no plans to buy ASML s most advanced litho tool the 350 million high-NA EUV machine according to deputy co-COO Kevin Zhang speaking at TSMC s 2026 Technology Symposium. ... The post TSMC introduces A13 node says no need for high-NA through 2029 appeared first on Electronics Weekly… 23-04-2026

Deutsche Telekom and T-Mobile talking about a merger

Deutsche Telekom /DT is talking to T-Mobile about a merger reports Reuters. A merger would create a company with a market cap of around 360 billion with 200 million mobile ... The post Deutsche Telekom and T-Mobile talking about a merger appeared first on Electronics Weekly… 23-04-2026

Bolt GPU to cut compute cost 17x

Bolt Graphics has taped-out the test chip for its Zeus GPU which aims to cut the cost of  HPC  and rendering workloads by up to 17 times. Volume production is ... The post Bolt GPU to cut compute cost 17x appeared first on Electronics Weekly… 23-04-2026

Uber gets smart sexy and speedy in Japan

Uber is hooking up with with Sony s S.Ride taxi-hailing app in Japan which will allow anyone with the Uber app to use it to call a cab. The service starts ... The post Uber gets smart sexy and speedy in Japan appeared first on Electronics Weekly… 23-04-2026

MIPS and Arteris hook up for interconnectivity in customisable SoCs

MIPS  which was bought by Globalfoundries last year  has selected Arteris FlexGen smart NoC IP and Magillem SoC integration automation software to help develop domain-specific SoCs. MIPS will integrate Arteris ... The post MIPS and Arteris hook up for interconnectivity in customisable SoCs appeared first on Electronics Weekly… 23-04-2026

MCUs Integrate Programmable Logic Hardware

New microcontrollers embed CPLD-like logic blocks enabling deterministic timing lower latency and reduced system cost for industrial automotive and motor-control applications. A new class of microcontrollers from Microchip Technology aims to simplify timing-critical embedded system design by integrating programmable logic directly into the MCU reducing the need for separate components.… 23-04-2026

Compact Rectifiers for Power Systems

Ultrafast rectifiers handle higher current and are used in automotive industrial and consumer electronics for power applications across a wide temperature range. Vishay Intertechnology has released 16 new 200 V FRED Pt ultrafast rectifiers in a compact DFN6546A package aimed at improving efficiency and saving board space in automotive industrial and consumer power systems.… 23-04-2026

New Materials Enhance Silicon Photonics

Hybrid material integration enhances silicon photonics performance enabling faster energy-efficient data links for AI-driven data centres and next-generation optical interconnects. Silicon photonics has gained a significant technological boost through the integration of new materials potentially transforming high-speed data communication systems. The advance centres on heterogeneous… 23-04-2026

Making RAM at Home in Your Own Semiconductor Fab

There s little point in setting up your own shed-based clean room for semiconductor purposes if you don t try to do something practical with it. Something like responding to the RAMpocalypse read… 23-04-2026

Laser Paper Circuits Advancements

Laser-written channels transform ordinary parchment into low-cost eco-friendly electronic circuits enabling disposable sensors and diagnostics without silicon while advancing paper-based electronics manufacturing. Researchers at Binghamton University have demonstrated a new way to fabricate electronic circuits directly on everyday parchment paper potentially reshaping low-cost electronics… 23-04-2026

AI That Helps Design Computer Chips

An AI system coordinates chip 3D IC and PCB design workflows connecting engineering tools to automate planning verification and manufacturing sign-off. Siemens has introduced the Fuse EDA AI Agent system an autonomous AI orchestration layer that coordinates semiconductor 3D IC and PCB design workflows across design verification physical implementation and manufacturing sign-off. It… 23-04-2026

DigiKey and Microchip to Host Webinar on Programming Embedded Systems

The free webinar will introduce two ways of programming hardware. The post DigiKey and Microchip to Host Webinar on Programming Embedded Systems appeared first on EDN Asia… 23-04-2026