Схемы, платы, компоненты

Перестраиваемый волоконно-оптический фильтр с диапазоном перестройки до 80 нм от FIBERT

Компания FIBERT представила перестраиваемый волоконно-оптический фильтр с диапазоном перестройки длины волны до 80 нм разрешением от 0 02 нм и вносимыми потерями от 2 5 дБ серия FBRT-SMTOF. 09-11-2026

IGBT-модуль 1200 В 50 А с низкими потерями переключения для сварочных инверторов от AMG Power

AMG Power начала серийные поставки IGBT-модуля 1200 В 50 А при температуре корпуса 80 C с низкими потерями переключения и встроенным быстрым обратным диодом FWD Free Wheeling Diode AMG50G1200BME2. 06-11-2026

Микроконтроллер реального времени на ядре Arm Cortex-M52 для силовой электроники от Geehy

Geehy Semiconductor представила серию экономичных высокопроизводительных микроконтроллеров реального времени MCU/DSP на базе платформы G32R5 … 05-11-2026

Новый каталог оптических трансиверов Cruetech: 3000 моделей от DC до 800 Гбит/с

Опубликован новый каталог оптических трансиверов Cruetech на 2026 год более 3000 моделей в 40 форм-факторах и исполнениях. 02-11-2026

Новый каталог оптических трансиверов Cruetech: 3000 моделей от DC до 800 Гбит/с

Макро Групп подготовила каталог оптических трансиверов бренда Cruetech на 2026 год более 3000 моделей в 40 форм-факторах и исполнениях. 02-11-2026

Компания KLS представила новую линейку SMD-пьезоизлучателей серии KLS3-SMT

В ассортименте производителя KLS Electronic представлены новые SMD-пьезоизлучатели SMD Piezo Buzzers серии KLS3-SMT. В линейке представлены как активные так и пассивные типы излучателей что позволяет подобрать решение с учётом особенностей схемотехники требований к звуковому сигналу и конструктивных особенностей оборудования. SMD-исполнение позволяет автоматизировать процесс монтажа исключая 02-11-2026

Аналоговые источники питания Актаком серии APS - в Госреестре СИ РФ до 2031 года

Приказом Росстандарта 2079 от 14 октября 2026 г. продлены сроки действия утвержденных типов средств измерений на источники питания Актаком APS-1333 APS-1335 APS-1338 APS-2234 APS-2236 APS-3333 APS-3335 зарегистрированных в Госреестре СИ под номером… 30-10-2026

200G QSFP56 трансиверы DAC и AOC от Cruetech: экономически эффективное масштабирование сетевой инфраструктуры ЦОД

Российский бренд Cruetech расширяет линейку поставляемых оптических компонентов и представляет высокопроизводительные решения 200G в форм-факторе QSFP56 с интерфейсом… 28-10-2026

Reducing Lithography Learning Cycles To Accelerate FOPLP Ramps

How yield prediction technology can reduce trial-and-error in advanced packaging lithography. The post Reducing Lithography Learning Cycles To Accelerate FOPLP Ramps appeared first on Semiconductor Engineering… 10-11-2026

Test Struggles To Keep Pace With AI

Rapidly changing workloads more test insertions and fragmented data complicate chip testing. The post Test Struggles To Keep Pace With AI appeared first on Semiconductor Engineering… 10-11-2026

Which Passing Chips Need More Testing

Manufacturers are using test data and predictive models to identify marginal chips and determine when additional screening is justified. The post Which Passing Chips Need More Testing appeared first on Semiconductor Engineering… 10-11-2026

AI s Efficiency Challenge For The Semiconductor Industry

AI is reshaping the tools data and collaboration models used to design manufacture and test silicon. The post AI s Efficiency Challenge For The Semiconductor Industry appeared first on Semiconductor Engineering… 10-11-2026

The Definitive AFM Modes Handbook: 2026 Edition

A comprehensive guide to expanding materials research capabilities. The post The Definitive AFM Modes Handbook: 2026 Edition appeared first on Semiconductor Engineering… 10-11-2026

Streaming Scan Network Test Over PCIe

Changing test strategies put a premium on how closely the design ecosystem and the test ecosystem line up. The post Streaming Scan Network Test Over PCIe appeared first on Semiconductor Engineering… 10-11-2026

Shrinking Hybrid Bonding Pitches Push Inspection Limits

Existing inspection tools struggle to capture defects especially those hidden at the bond interface. The post Shrinking Hybrid Bonding Pitches Push Inspection Limits appeared first on Semiconductor Engineering… 10-11-2026

Overcoming Silicon Photonics Process Control Challenges in the AI Era

How connected inspection metrology and software can help manufacturers move SiPh and CPO toward high-volume production. The post Overcoming Silicon Photonics Process Control Challenges in the AI Era appeared first on Semiconductor Engineering… 10-11-2026

Delays reported at Rapidus

Rapidus Japan s state-backed effort to make 2nm chips has failed to make a functioning 2nm SRAM reports Bloomberg. The failure puts in question its targets of entering 2nm mass production The post Delays reported at Rapidus appeared first on Electronics Weekly… 10-11-2026

MEMS Sensors: TDK and Microchip Technology partner to enable sensor networks for robotics

TDK Corporation and Microchip Technology Inc. are demonstrating a distributed sensor-node platform for next-generation robotic systems at electronica Munich this week TDK booth B5.520 . The new platform combines sensing technology from InvenSense a TDK group company with Microchip s dsPIC33A Digital Signal Controller DSC and LAN8651/LAN8679 based 10BASE-T1S single-pair Ethernet connectivity 10-11-2026

Gallium Oxide wafers in early production

Gallium oxide Ga O is moving into early production mode. The  ultra-wide bandgap material with a bandgap around 4.7 to 4.9 eV nearly fifty percent wider than SiC is The post Gallium Oxide wafers in early production appeared first on Electronics Weekly… 10-11-2026

Ardian Semi raises 1bn

A private equity company dedicated to making investments in the semiconductor supply chain has raised 1 billion The company   Ardian Semiconductor is part of the French private equity company Ardian. The post Ardian Semi raises 1bn appeared first on Electronics Weekly… 10-11-2026

Infineon first to fab SiC on 300mm wafers

Infineon is processing 300mm SiC wafers into functional power devices at its fab in Villach Austria. Infineon used  existing silicon Si manufacturing equipment. The larger wafer diameter offers 2.3 times The post Infineon first to fab SiC on 300mm wafers appeared first on Electronics Weekly… 10-11-2026

Electronica: Weebit Matrix prototypes IMC algorithms

Weebit Nano a developer and licensor of advanced technologies has launched the Weebit Matrix In-Memory Compute IMC Research Program designed to accelerate exploration of next-generation computing architectures. The program provides The post Electronica: Weebit Matrix prototypes IMC algorithms appeared first on Electronics Weekly… 10-11-2026

Electronica: Development platform for humanoid robots

At electronica 2026 Inova Semiconductors is showcasing a development platform for humanoid robots built on Inova s APXpress high-speed networking technology and low-power Lattice CertusPro and Lattice CrossLink NX FPGAs. DLR s The post Electronica: Development platform for humanoid robots appeared first on Electronics Weekly… 10-11-2026

Robotic Car Charger Locks On With Suction

Not only does Mew463 s robotic car charger take care of plugging in his vehicle for him it has some really clever features that are great to see in action. We ve read… 10-11-2026