Caxapa

День памяти подводников

.ru, 1994 год

Модуль камеры DS-CAR0234-22 на базе сенсора ON Semi: Запустили серийное производство модуля камеры DS-CAR0234-22 на базе сенсора… 07-04-2026

Разъёмы JCDw аналоги ОНП-ЖИ СНП339: Теллур Электроникс предлагает малогабаритные низкочастотные прямоугольные соединители JCDw. Разъёмы соответствуют стандарту GJB2446A MIL-C-83513 предназначены для внутреннего монтажа и являются аналогом российских серий ОНП-ЖИ и СНП339. th td padding: 5px Аналог JCDw Российский артикул ОНП-ЖИ / СНП339 JCDw-21TJ-N1 ОНП-ЖИ-8-21/46х8-В38-1 / СНП339-21ВП118-1 JCDw-21ZK-N1Q ОНП-ЖИ-8-21/46х8-Р2 07-04-2026

SiC MOSFET на 1200 В 75 А 30 мОм в корпусе TOLT с верхним отводом тепла от AMG Power: AMG Power анонсировал начало массового производства карбид-кремниевых МОП-транзисторов транзисторов на 1200 В с сопротивлением 30 мОм в инновационном корпусе TOLT с конструкцией обеспечивающей отвод тепла через верхнюю поверхность. 06-04-2026

Цифровые осциллографы Актаком ADS-2000 доступны к поставке: С короткими сроками поставки можно приобрести цифровые осциллографы Актаком серии АDS-2000 которые включены в Государственный реестр средств измерений з а 49918-12… 06-04-2026

Высоколинейный LNB Ku-диапазона для задач спутниковой связи от Talent Microwave: Компания Talent Microwave представила высокопроизводительный LNB Ku-диапазона TLLNB13.75G15.25G-55-2. 06-04-2026

Одна линейка - 4 модуля камер Диасом под вашу задачу: В конце 2025 года мы расширили свое портфолио и запустили линейку модулей камер на базе сенсоров компании… 02-04-2026

Портативные осциллографы-мультиметры серии ADS-2000: Доступны к поставке все модели цифровых осциллографов-мультиметров серии ADS-2000 включенных в Госреестр СИ за номером… 01-04-2026

EMC Components: TDK launches ultra-small noise suppression filters for audio lines with high noise attenuation in the 5-GHz band: TDK Corporation has announced its latest noise suppression filters of the MAF0603GWY series. These measure only 0.6 mm x 0.3 mm x 0.3 mm L x W x H for use in small consumer devices like smartphones and wearables. Mass production of the new product series is set to begin in April… 07-04-2026

934 MHz: When The Government Really Doesn t Want You To Have CB: In the mid 1970s there were a spate of movies depicting the romance and lifestyle of truck drivers in the southern half of the United States. Over on the other read… 07-04-2026

Star-Shaped Nanostructures Enable Hybrid Energy Storage: What if a material s shape could change how it stores energy Star-like nanostructures enable faster surface-driven storage with hybrid battery capacitor behaviour. Researchers at University at Buffalo have demonstrated how altering the shape of a nanomaterial can significantly change how it stores energy highlighting a new pathway for designing advanced energy storage systems. The study… 07-04-2026

Fungus Inspired Semiconductors For Flexible Electronics: Could pigments from fungi redefine electronics Scientists are uncovering organic materials that enable flexible light-responsive devices with unusual electronic behaviours. Researchers at Oregon State University are advancing organic semiconductor technologies inspired by nature pointing to a future of flexible low cost and potentially more sustainable electronic devices. Building… 07-04-2026

Bio-Hybrid DNA Memristors for Energy-Efficient Data Storage: By embedding synthetic DNA into electronic architectures researchers unlock a class of memory devices capable of simultaneous processing and storage. Researchers at Penn State University have developed a bio inspired approach to next generation data storage by integrating synthetic DNA with semiconductor materials opening the door to memory devices that combine ultra high capacity… 07-04-2026

The Specialty Device Surge Part 2: The Process Control Challenges Of MEMS Co-Packaged Optics And More: Staying inside increasingly narrow process windows as specialty devices scale diversify and enter high-volume production. The post The Specialty Device Surge Part 2: The Process Control Challenges Of MEMS Co-Packaged Optics And More appeared first on Semiconductor Engineering… 07-04-2026

Breaking The Legacy Trap: How Semiconductor Executives Can Accelerate AI Adoption And Transform IT Applications At The Same Time: Deploying AI on top of fragmented siloed inconsistently formatted data produces fragmented unreliable results. The post Breaking The Legacy Trap: How Semiconductor Executives Can Accelerate AI Adoption And Transform IT Applications At The Same Time appeared first on Semiconductor Engineering… 07-04-2026

Enhancing Silicon Reliability With In-System Test And SLM Data: A convergence of DFT techniques and the proliferation of in-silicon monitors can flag potential failures before they occur. The post Enhancing Silicon Reliability With In-System Test And SLM Data appeared first on Semiconductor Engineering… 07-04-2026

AI data Center Providers Seek Power and Bandwidth Promise in CPO: Insights on implementing a test strategy from bench validation to high-volume that enables a seamless path to scale. The post AI data Center Providers Seek Power and Bandwidth Promise in CPO appeared first on Semiconductor Engineering… 07-04-2026

Mid-infrared Ellipsometry For Optical Critical Dimension Metrology: Mid-infrared ellipsometry enabled by tunable quantum cascade lasers and polarization modulation offers a transformative approach to optical critical dimension metrology for advanced semiconductor structures. The post Mid-infrared Ellipsometry For Optical Critical Dimension Metrology appeared first on Semiconductor Engineering… 07-04-2026

AI Accelerators Usher In New Era Of Semiconductor Test: The number and variety of test interfaces coupled with increased packaging complexity are creating an explosion of testing challenges. The post AI Accelerators Usher In New Era Of Semiconductor Test appeared first on Semiconductor Engineering… 07-04-2026

Untrusted Analog Components Add Risks For Critical Infrastructure: Suggested alternative: Identifying counterfeits requires adding certificate processes increasing equipment investments and a lot more coordination. The post Untrusted Analog Components Add Risks For Critical Infrastructure appeared first on Semiconductor Engineering… 07-04-2026

What s Failing At The Interface: In advanced packages the interface is where problems show up but rarely where they begin. The post What s Failing At The Interface appeared first on Semiconductor Engineering… 07-04-2026

Smartwatch AI: The New Era of Gesture Control: Smartwatch AI signals a new era where unseen sensing hints at effortless control transforming how humans interact with devices. A new breakthrough in wearable technology is transforming how humans may interact with digital devices using nothing more than a standard smartwatch. Researchers from Cornell University and KAIST have developed a system called WatchHand that… 07-04-2026

Platform-Led AI Analytics for the Semiconductor Ecosystem: Moving beyond the AI pilot stage and enable adoption of AI across the entire design and manufacturing semiconductor supply chain at scale. The post Platform-Led AI Analytics for the Semiconductor Ecosystem appeared first on Semiconductor Engineering… 07-04-2026

Harnessing Digital Twins And AI/ML For Smarter Semiconductor Test Optimization: Cloud-based virtualization real-time data synchronization and scalable AI/ML deployment can modernize the testing landscape. The post Harnessing Digital Twins And AI/ML For Smarter Semiconductor Test Optimization appeared first on Semiconductor Engineering… 07-04-2026

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