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Новинки каталога: аналоги Analog Devices от 3PEAK RUNIC CHIPANALOG и COREBAI: Склад РУ Электроникс пополнился микросхемами от четырёх брендов: 3PEAK Inc. Jiangsu Runic Technology Co. Shanghai Chipanalog Microelectronics Co. и Corebai Microelectronics Beijing Co . Все четыре производителя выпускают функциональные аналоги компонентов Analog Devices. В поставке операционные усилители прецизионные усилители и цифровые изоляторы. Новинки на складе Поставка охватывает… 28-09-2026

Высоковольтный MOSFET 1700 В / 100 А в изолированном корпусе от AMG Power: AMG Power анонсировала выпуск N-канального MOSFET с напряжением сток-исток 1700 В и непрерывным током стока до 100 А A2G100N1700MT4i. 28-09-2026

SiC-подложки 6 дюймов для мощных СВЧ-транзисторов от Qatron: Qatron объявил о поставках полуизолирующих подложек из карбида кремния SiC диаметром 150 мм для последующей эпитаксии нитрида галлия GaN и изготовления мощных СВЧ-транзисторов. 28-09-2026

XDS батарея для осциллографов АКТАКОМ ADS-6000: Вновь стало возможным применять осциллографы Актаком серии ADS-6000 с полосой пропускания от 60 до 300 МГц для измерений в полевых условиях и на выездных работах. Аккумуляторная XDS-батарея доступна к поставке 28-09-2026

Высоковольтный MOSFET 1700 В / 100 А в изолированном корпусе от AMG Power: AMG Power анонсировала выпуск N-канального MOSFET с напряжением сток-исток 1700 В и непрерывным током стока до 100 А A2G100N1700MT4i. 28-09-2026

Приглашаем на вебинар: Сетевые решения RUICHI для различных объектов: типовые сценарии и комплекты: 8 октября в 11:00 МСК компания РУ Электроникс проведёт вебинар Сетевые решения RUICHI для различных объектов: типовые сценарии и комплекты . Спикер вебинара - Дмитрий Меркушов руководитель направления Видеонаблюдение и сетевое оборудование компании РУ Электроникс . Вебинар посвящён практическому подбору сетевого оборудования для различных объектов: магазинов офисов парковок складов… 25-09-2026

Широкополосная спиральная GNSS-антенна с подавлением помех и усилением до 4 dBiC от Harxon для БПЛА авиационного морского оборудования и транспортных систем Компания Harxon представила компактную широкополосную GNSS-антенну JH003 с круговой поляризацией: Компания Harxon представила компактную широкополосную GNSS-антенну JH003 с круговой поляризацией усилением до 4 dBiC и защитой от внеполосных помех. 25-09-2026

Широкополосная спиральная GNSS-антенна с подавлением помех и усилением до 4 dBiC от Harxon: Компания Harxon представила компактную широкополосную GNSS-антенну JH003 с круговой поляризацией усилением до 4 dBiC и защитой от внеполосных помех. 25-09-2026

EU Begins Enforcing AI Act With Global Implications for American Tech: The European Union has begun enforcing major provisions of its sweeping Artificial Intelligence Act marking a new phase in Brussels effort to regulate the development and use of artificial intelligence around the world. As of August 2 2026 the European Commissions AI Office and national… 29-09-2026

Synthetic Aperture Radar Drone Gets Interferometric Imaging: It s been more than a year since Henrik Forst n built the first iteration of his synthetic-aperture radar SAR imaging drone and he s certainly been productive in the meantime. Not only read… 28-09-2026

Silicon photonics and InP photonic integrated circuit market to grow to 48bn by 2036: Photonic integrated circuits PICs use manufacturing processes developed for the semiconductor industry to miniaturize complex optical functionality onto a chip. PICs offer significant advantages over electronic ICs. Since light travels about 3x faster than electricity PICs can transmit data with much higher throughput. Propagation losses are also typically much smaller compared to resistance… 28-09-2026

Why U.S.-Europe Cooperation Matters for Quantum Leadership: U.S.-Europe collaboration is critical for global quantum leadership combining capital and talent to scale against rising competition. The post Why U.S.-Europe Cooperation Matters for Quantum Leadership appeared first on EE Times… 28-09-2026

Impact of Cu Microstructure On The TSV-Induced Residual Stress Within Silicon Purdue UCLA: Researchers at Purdue University and the UCLA published a technical paper titled Experimental Evidence for the Impact of Copper Microstructure on Residual Stress of Through Silicon Via. Abstract Excerpt: Here we experimentally quantify the impact of Cu microstructure on the TSV-induced residual stress within silicon. A 3- m-diameter TSV array was annealed at 400 C for... read more… 28-09-2026

Places To Visit: Landschaftspark Duisburg-Nord: There are many benefits to spending time in the park but perhaps few of them have a Hackaday angle. There s a park in Germany you might want to make an read… 28-09-2026

Jet Megatextures Demo for ESP32-S3: Mipmapping is a good way to add a lot more detail to a 3D scene without overburdening the rendering hardware with detail that won t be seen by the user. This read… 28-09-2026

TEC raises 450m Series C for reusable spacecraft: The Exploration Company TEC a startup for building reusable spacecrafts has raised 450 million in a Series C finding round which it describes as the largest-ever by a European space The post TEC raises 450m Series C for reusable spacecraft appeared first on Electronics Weekly… 28-09-2026

Wolfspeed adds Premium power substrates to 200mm silicon carbide portfolio: Wolfspeed Inc of Durham NC USA which makes silicon carbide SiC materials and power semiconductor devices has announced the commercial availability of its new Premium 200mm n-type silicon carbide substrate expanding its 200mm SiC materials portfolio with a higher-quality starting material designed to improve yield through reduced defects and greater wafer-shape stability... 28-09-2026

Fraunhofer IAF develops broadband distributed amplifier MMIC for data centers measurement systems and sensors: Fraunhofer Institute for Applied Solid State Physics IAF of Freiburg Germany has developed a broadband distributed amplifier monolithic microwave integrated circuit MMIC chip suitable for use in data centers measurement systems and sensors. Modern data centers high-precision measurement systems and high-resolution radar sensors rely on extremely broadband amplifier chips that feature both… 28-09-2026

The FPGA Chronicles: Exploring the Tang Nano 20K: FPGAs used to be mysterious expensive devices but these days you can buy surprisingly capable boards for very little money. Some years ago I did an FPGA Bootcamp over on read… 28-09-2026

Murata Showcases Powering AI Scalability at the 2026 OCP Global Summit: Murata will join industry leaders at the Open Compute Project OCP Global Summit highlighting how its innovations are powering the future of artificial intelligence AI and accelerating the open compute… 28-09-2026

Automate or fall behind: Igus CEO Felix Brockmeyer on America s manufacturing reckoning: In this full-length interview Design World Managing Editor Mike Santora sits down with Felix Brockmeyer CEO of Igus for a wide-ranging conversation recorded at IMTS 2026 about the forces reshaping American manufacturing. Brockmeyer doesn t hold back diving straight into the labor crisis driving the industry s rush toward automation and explaining why the U.S. still lacks The post Automate… 28-09-2026

Where Robots Do The Housework: .Adoption of vacuum cleaners and lawn-mowing robots is still limited with fewer than 1 in 5 respondents using them in each surveyed national market according to Statista Consumer Insights. The post Where Robots Do The Housework appeared first on Electronics Weekly… 28-09-2026

Calterah Turns UWB Digital Keys into In-Cabin Sensors: Calterah brings UWB keyless anchors into synchronized networks delivering enhanced vehicle safety without adding expensive hardware. The post Calterah Turns UWB Digital Keys into In-Cabin Sensors appeared first on EE Times… 28-09-2026

SignOff Evolves From Design Partner to Custom Silicon Partner: As automotive firms hyperscalers and startups pursue custom chips SignOff is building capabilities that can take designs from architecture closer to finished silicon backed by RISC-V IP EDA expertise foundry and OSAT relationships and an expanding engineering ecosystem. As chip demand spreads beyond traditional semiconductor companies SignOff is quietly expanding its role from executing… 28-09-2026

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