Схемы, платы, компоненты

Виктор Шестаков, 1907 год

День восстания роботов, 2011 год

SDR модули CR-P047/CR-P047P от Cruetech: Макро Групп предлагает SDR модули CR-P047 и CR-P047P под брендом… 20-04-2026

Промышленные eMMC NAND и DDR ИС и модули от Cruetech для встраиваемых систем: Cruetech продолжает укреплять своё предложение высоконадежной памяти для промышленных и коммерческих встраиваемых решений. 17-04-2026

Промышленные столы Актаком АРМ-4х1х с антистатической столешницей. Скидка 15%: Информируем о продлении акции на промышленные столы АКТАКОМ АРМ-4х1х с антистатической ESD-столешницей в рамках которой действует скидка 15% от розничной цены. Новый срок действия - до 01 июня 2026… 16-04-2026

Автомобильный дискретный IGBT на 1200 В от Sunco: Компания Sunco производитель силовой электроники анонсировала новое поколение дискретных автомобильных IGBT-транзисторов напряжением 1200 В в корпусе… 15-04-2026

Аналоговые и mixed-signal ИС для промышленной автомобильной и потребительской электроники от NOVOSENSE Microelectronics: Компания Макро Групп начала сотрудничество с производителем высоконадёжных аналоговых и mixed-signal микросхем для промышленной автомобильной и потребительской электроники NOVOSENSE Microelectronics. 13-04-2026

Развитие направления гражданских БПЛА: решения от Теллур Электроникс: Компания Теллур Электроникс приглашает ознакомиться с новой специализированной страницей посвящённой решениям для разработки и производства гражданских беспилотных летательных аппаратов. В условиях стремительного роста рынка БПЛА и задач импортозамещения мы системно расширяем портфель электронных компонентов и модулей востребованных в таких областях как: мониторинг и безопасность сельское… 13-04-2026

Высоковольтный тестер сопротивления изоляции Актаком АММ-2093: Возобновлены продажи высоковольтного тестера сопротивления изоляции модели АММ-2093 предназначенного для проведения испытаний стойкости изоляции напряжением до 5/6 кВ AC/DC и измерения сопротивления изоляции до… 10-04-2026

Designing a Digital-controlled PFC: Digital-controlled PFC improves efficiency reduces THD and enables advanced control in totem-pole AC/DC power supplies systems. The post Designing a Digital-controlled PFC appeared first on EDN Asia… 21-04-2026

Infineon Retains Top Automotive Chip Supplier Position for 6th Consecutive Year: Infineon leads the automotive semiconductor market in 2025 extending its dominance across regions and MCU segment growth globally. The post Infineon Retains Top Automotive Chip Supplier Position for 6th Consecutive Year appeared first on EDN Asia… 21-04-2026

Cadence and Google Partner to Scale AI-driven Chip Design: The integration of Google s Gemini models with Cadence ChipStack AI Super Agent accelerates next-generation agent-driven design automation. The post Cadence and Google Partner to Scale AI-driven Chip Design appeared first on EDN Asia… 21-04-2026

Growing Aluminium-Copper Alloy Crystals Using Hydrogen: Having molten aluminium interact with atmospheric water forms a source of hydrogen which can be rather problematic if you re trying to cast aluminium parts. As the molten metal cools down read… 21-04-2026

Murata to Showcase Advanced Sensors and Connectivity Innovation at Sensors Converge 2026: Murata a global leader in advanced electronics will exhibit its latest innovations in sensing connectivity and intelligent systems design at Sensors Converge 2026 held May 5-7 in Santa Clara California. 21-04-2026

ROHM Develops 5th Generation SiC MOSFETs with Approx. 30% Lower On-Resistance at High Temperatures: April 21st 2026 ROHM has developed the latest device of its EcoSiC series: the 5th Generation SiC MOSFETs optimized for high efficiency power applications. This technology is ideally suitable for automotive electric powertrain systems such as traction inverters for electric vehicles xEVs as well as power supplies for AI servers and industrial equipment such as data centers. In recent… 21-04-2026

Molex to Acquire Teramount: Molex is accelerating adoption of scalable co-packaged optics deployment for AI infrastructure by acquiring Teramount. The post Molex to Acquire Teramount appeared first on EDN Asia… 21-04-2026

Artilux Unveils Hybrid Optoelectronic Architecture for Next-Gen AI Computing: Artilux Inception delivers significant improvements in both power and area efficiencies without relying on advanced CMOS process nodes and active cooling. The post Artilux Unveils Hybrid Optoelectronic Architecture for Next-Gen AI Computing appeared first on EDN Asia… 21-04-2026

Teradyne Acquires TestInsight: Teradyne Inc. is strengthening its ability to support customer design-in activities and accelerate time to market for the emerging AI and data center markets by acquiring TestInsight a leading provider of semiconductor test development validation and conversion software widely used across the industry. TestInsight s advanced tools and expert team will be pivotal in accelerating the … 21-04-2026

Tim Cook to step down as Apple CEO: Tim Cook will step down as CEO of Apple at the end of August Apple has announced. Senior vice president of Hardware Engineering John Ternus will become CEO on 1 ... The post Tim Cook to step down as Apple CEO appeared first on Electronics Weekly… 21-04-2026

Making the Most Pick-Proof Lock Yet: Throughout the centuries the art of lock-making and lock-picking have been trapped in a constant struggle with basic lock designs being replaced by ever more complex ones that seek to read… 21-04-2026

Vintage Chyron TV Hardware Of course It Runs NetBSD: Perhaps at this point getting NetBSD running on an obscure piece of hardware is a dog-bites-man story and not worth reporting their motto after all is Of course it runs read… 20-04-2026

InPHRED expands into data-center optical interconnect market with InP VCSEL and micro-RC-LED solutions: InPHRED Inc of Boston MA USA a developer of next-generation photonics solutions for consumer sensing and digital health that was founded in 2023 at Yale University has announced its formal expansion into the data-center optical interconnect market extending its nanoporous platform into high-speed connectivity solutions for next-generation AI infrastructure... 20-04-2026

2026 Green Power Challenge: NFC Powers Command Write and Wake of MCU: One of the more interesting categories of our ongoing Green Power Challenge is anything but PV and since the radiated power of Near Field Communication is decidedly not photovoltaic read… 20-04-2026

Positron AI Enters Nvidia Turf With Oracle Deal: Positron AI storms Nvidia s data center turf with Oracle deal and Asimov chip. The post Positron AI Enters Nvidia Turf With Oracle Deal appeared first on EE Times… 20-04-2026

DIY Weather Stations Report In From Chernobyl: You re probably not going to hang out around Chernobyl any time soon. Still knowing the conditions there can both satisfy your curiosity and provide scientific value. To that end Yury read… 20-04-2026