Схемы, платы, компоненты

Срок действия акции на промышленные столы Актаком продлен

До 15 ноября 2026 года на большинство моделей промышленных столов Актаком со стандарной и антистатической ESD столешницей большинства модификаций предоставляется скидка 15% от розничной… 30-09-2026

700 Вт и 63% КПД: NEDITEK представил GaN-усилители Догерти для инфраструктуры 5G-Advanced

Компания NEDITEK объявила о выводе на международный рынок линейки высокомощных СВЧ-усилителей на основе нитрида галлия GaN выполненных по архитектуре Догерти с выходной мощностью до 700 Вт и PAE более… 29-09-2026

Новинки каталога: аналоги Analog Devices от 3PEAK RUNIC CHIPANALOG и COREBAI

Склад РУ Электроникс пополнился микросхемами от четырёх брендов: 3PEAK Inc. Jiangsu Runic Technology Co. Shanghai Chipanalog Microelectronics Co. и Corebai Microelectronics Beijing Co . Все четыре производителя выпускают функциональные аналоги компонентов Analog Devices. В поставке операционные усилители прецизионные усилители и цифровые изоляторы. Новинки на складе Поставка охватывает… 28-09-2026

Высоковольтный MOSFET 1700 В / 100 А в изолированном корпусе от AMG Power

AMG Power анонсировала выпуск N-канального MOSFET с напряжением сток-исток 1700 В и непрерывным током стока до 100 А A2G100N1700MT4i. 28-09-2026

SiC-подложки 6 дюймов для мощных СВЧ-транзисторов от Qatron

Qatron объявил о поставках полуизолирующих подложек из карбида кремния SiC диаметром 150 мм для последующей эпитаксии нитрида галлия GaN и изготовления мощных СВЧ-транзисторов. 28-09-2026

XDS батарея для осциллографов АКТАКОМ ADS-6000

Вновь стало возможным применять осциллографы Актаком серии ADS-6000 с полосой пропускания от 60 до 300 МГц для измерений в полевых условиях и на выездных работах. Аккумуляторная XDS-батарея доступна к поставке 28-09-2026

Высоковольтный MOSFET 1700 В / 100 А в изолированном корпусе от AMG Power

AMG Power анонсировала выпуск N-канального MOSFET с напряжением сток-исток 1700 В и непрерывным током стока до 100 А A2G100N1700MT4i. 28-09-2026

Приглашаем на вебинар: Сетевые решения RUICHI для различных объектов: типовые сценарии и комплекты

8 октября в 11:00 МСК компания РУ Электроникс проведёт вебинар Сетевые решения RUICHI для различных объектов: типовые сценарии и комплекты . Спикер вебинара - Дмитрий Меркушов руководитель направления Видеонаблюдение и сетевое оборудование компании РУ Электроникс . Вебинар посвящён практическому подбору сетевого оборудования для различных объектов: магазинов офисов парковок складов… 25-09-2026

AI Drives Larger Denser Packaging Raising New Challenges for Equipment Makers

At A STAR s Innovate Together 2026 industry experts explored packaging hybrid bonding optical interconnects and process control for AI. The post AI Drives Larger Denser Packaging Raising New Challenges for Equipment Makers appeared first on EE Times… 30-09-2026

A Simple Solution for Streamlining Battery Recycling

Lithium batteries have become the backbone of many modern devices ranging from toothbrushes to semi trucks so what are we going to do with them when these rechargeable cells finally read… 30-09-2026

Film Capacitors: TDK presents DC-link capacitors rated for up to 135 C in automotive and industrial applications

TDK Corporation presents the B3272 A/G/T series of DC-link film capacitors. These are qualified for continuous operation at case temperatures of up to 135 C with no derating required up to 105 C. These components feature an EPN dielectric. 30-09-2026

E-Series GPU IP: The First Step Towards Converged Acceleration

Combine graphics compute and AI on one flexible architecture and one programmable software stack with up to 32 TOPS Int8 per core at 1GHz and the ability to run graphics and AI workloads concurrently. The post E-Series GPU IP: The First Step Towards Converged Acceleration appeared first on Semiconductor Engineering… 30-09-2026

From Caliptra Foundation To Full Production Deployment

Bridging the gap between open-source Root of Trust foundations and enterprise-grade security deployments. The post From Caliptra Foundation To Full Production Deployment appeared first on Semiconductor Engineering… 30-09-2026

Make Your Interface Work For Your AI SoC-A 10 Step Program: IP Solutions And Models

How proven IP verification solutions and virtual platforms enable earlier SW development improve interoperability and streamline deployment of complex AI SoCs and multi-die systems. The post Make Your Interface Work For Your AI SoC A 10 Step Program: IP Solutions And Models appeared first on Semiconductor Engineering… 30-09-2026

Designing Physical AI Systems Under Real-World Constraints

Where latency power reliability and data movement shape system behavior. The post Designing Physical AI Systems Under Real-World Constraints appeared first on Semiconductor Engineering… 30-09-2026

PCIe 8.0 Over UCIe 3.0: Bringing A Proven Protocol Into The Chiplet Era

UCIe standardizes die-to-die communication within a package and allows PCIe traffic to traverse chiplet boundaries with seamless interoperability over standardized interconnects. The post PCIe 8.0 Over UCIe 3.0: Bringing A Proven Protocol Into The Chiplet Era appeared first on Semiconductor Engineering… 30-09-2026

Data Center Energy Trends Force A Rethink Of Chip Power Delivery

Enabling silicon to operate closer to its true performance envelope without excessive guard banding. The post Data Center Energy Trends Force A Rethink Of Chip Power Delivery appeared first on Semiconductor Engineering… 30-09-2026

Rethinking AI Validation

A lifecycle-driven approach for explainable and trustworthy AI by design. The post Rethinking AI Validation appeared first on Semiconductor Engineering… 30-09-2026

Switch Faster Regulate Faster Protect Faster With Performance Line Microcontrollers

How high-speed control precision timing and hardware acceleration enable next-gen PSUs IBCs and BBUs. The post Switch Faster Regulate Faster Protect Faster With Performance Line Microcontrollers appeared first on Semiconductor Engineering… 30-09-2026

Photonics Fundamentals For Electronics Engineers: eBook

What it is why it s important and how it s being used. The post Photonics Fundamentals For Electronics Engineers: eBook appeared first on Semiconductor Engineering… 30-09-2026

When AI agents make decisions trust becomes infrastructure

As AI moves from providing information to making consequential decisions trust can no longer remain an assumption surrounding the system. The post When AI agents make decisions trust becomes infrastructure appeared first on… 30-09-2026

Drone Uses Lightweight Electronics To Lift More

A lightweight electric drone demonstrates how carbon-fibre structures high-power propulsion and careful battery-weight management can push payload capacity far beyond conventional multirotor designs. A lightweight electric drone developed by aerospace engineering students at Texas A M University has demonstrated an unusually high payload-to-aircraft weight ratio carrying a 110-pound payload… 30-09-2026

GaN Device Helps Keep AI Data Centres Cool

A GaN device uses cooling from both sides to manage heat and save space in AI data centre power systems. Renesas Electronics Corporation has launched a 650V gallium nitride GaN device with dual-side cooling for power conversion in 800V high-voltage DC HVDC AI data centre architectures. The TP65H020G4PLSGBD D-Mode device has an on-resistance… 30-09-2026

Cheap Blue Pigment Cuts Platinum From Hydrogen Fuel Cells

A blue pigment-derived catalyst has delivered 902 mW/cm in an anion-exchange membrane fuel cell showing how molecularly engineered iron catalysts could reduce reliance on platinum. Researchers in Japan and Israel have developed a platinum-free fuel-cell catalyst based on blue pigment chemistry that delivered 902 milliwatts per square centimetre mW/cm in an anion-exchange membrane fuel… 30-09-2026