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Адмирал Ушаков Адмирал Ушаков, 1744 год
Петр Николаевич Лебедев Петр Николаевич Лебедев, 1866 год
Разъёмы Y50 по стандартам GJB598A-96  GJB101A-97  для ответственных применений Разъёмы Y50 по стандартам GJB598A-96 GJB101A-97 для ответственных применений
Теллур Электроникс начала поставки цилиндрических соединителей серии Y50 соответствующих китайским военным стандартам GJB598A-96 GJB101A-97 . Разъемам характерны быстрое соединение байонет 1/4 оборота малые вес и размеры высокая плотность контактов значительная устойчивость к вибрации к солевому туману и влаге. Выводы разъёмов предназначены под пайку. Серия Y50 имеет следующие варианты: 19-02-2026
Фотодиодные усиленные приёмники PDA-серии от Thorlabs
Компания Thorlabs предлагает линейку фотодиодных усиленных приёмников PDA-серии представляющих собой готовое решение для регистрации оптического излучения в лабораторных и R D-приложениях. 19-02-2026
Комбинированные осциллографы Актаком 7 в 1 доступны к поставке Комбинированные осциллографы Актаком 7 в 1 доступны к поставке
Доступны к быстрой поставке двух и четырехканальные модели комбинированных осциллографов Актаком 7 в 1 с полосой пропускания 350 и 500 МГц. Приборы включены в Госреестр СИ РФ за номером… 18-02-2026
Актуальная ситуация на рынке памяти в январе-феврале 2026 года от Cruetech
По данным аналитики Cruetech ценовой тренд на индустриальные SSD твердотельные накопители и DRAM-модули сохраняет восходящую динамику и по всей видимости продолжится в течение первого квартала 2026… 18-02-2026
Отладочная плата CRX7Z100 на базе Zynq7000 от Cruetech. Вебинар
Компания Макро Групп центр компетенций по применению ПЛИС и СнК приглашает на вебинар Отладочная плата CRX7Z100 на базе Zynq7000 от торговой марки Cruetech… 18-02-2026
Выставка ЭКСПОЭЛЕКТРОНИКА 2026 в Крокус Экспо 14-16 Апреля 2026
Компания РАДИОТЕХ примет участие в 28-й Международной выставке электроники ExpoElectronica 2026 которая пройдёт с 14 по 16 апреля 2026 года в Московском выставочном центре Крокус Экспо Павильон 3 . На стенде компании посетители выставки смогут: - Ознакомиться с новинками поставляемой продукции - Получить консультации технических специалистов по подбору компонентов для различных... 16-02-2026
Процессор для AIoT применения от Rockchip
Процессор для AIoT RK3562 от Rockchip получил награду Продукт с выдающимися рыночными показателями… 16-02-2026
Дешевле до 50%  Монтажные наконечники для паяльных станций Актаком Дешевле до 50% Монтажные наконечники для паяльных станций Актаком
Снижаем цены до 50% на самые популярные модели наконечников и наконечников-картриджей применяемых в монтажных паяльных станциях Актаком. 13-02-2026
AI Tool For Faster PCB Part Creation AI Tool For Faster PCB Part Creation
An AI tool converts component datasheets into symbols footprints and 3D models in minutes saving time reducing errors and avoiding library work. PCBPartz is live with more than 13 million IPC-7351 verified components and it has now taken a further step with the launch of AI Symbol Expert. The new AI tool automates… 24-02-2026
ASML 1000W light source to deliver 330wph EUV processing by 2030
ASML has developed a 1000W light source which should increase the throughput of its high-NA EUV machine from 220wph to 330wph by 2030. The advance has been achieved by doubling ... The post ASML 1000W light source to deliver 330wph EUV processing by 2030 appeared first on Electronics Weekly… 24-02-2026
Compound semi substrate market growing at 14% CAGR
The compound semiconductor substrate and open epiwafer markets are projected to reach almost 5.2 billion in total by 2031 growing at around 14% CAGR. Automotive electrification drives SiC substrates RF ... The post Compound semi substrate market growing at 14% CAGR appeared first on Electronics Weekly… 24-02-2026
Teledyne digitiser delivers 14Gbyte/s data transfer
Teledyne SP Devices ADQ35  is engineered for use in areas such as swept source optical coherence tomography SS OCT time of flight mass spectrometry distributed fiber-optic sensing LiDAR scientific instrumentation ... The post Teledyne digitiser delivers 14Gbyte/s data transfer appeared first on Electronics Weekly… 24-02-2026
Socionext and Innatera develop always-on human detection device
 Socionext and Innatera have developed a human-presence detection device that combines 60 GHz FMCW radar sensing with neuromorphic edge AI to deliver always-on detection with low power consumption. The chip ... The post Socionext and Innatera develop always-on human detection device appeared first on Electronics Weekly… 24-02-2026
Large-Board Rework Platform For High-Density Assemblies Large-Board Rework Platform For High-Density Assemblies
Enhanced thermal control and precision alignment address growing complexity in advanced PCB repair and rework applications. As board designs grow in size and component density rework processes are under increasing pressure to deliver precision without compromising throughput. A new XL-format rework system by Kurtz Ersa was introduced to address exactly that challengebringing expanded heating… 24-02-2026
Fictiv and MISUMI report highlights AI and onshoring priorities
Fictiv and MISUMI Global released the 11th Annual State of Manufacturing Supply Chain Report based on a survey of more than 300 senior supply chain and manufacturing leaders. The report describes an industry managing ongoing volatility and changing how products are designed sourced and built. The 2026 report points to increased use of AI The post Fictiv and MISUMI report highlights AI… 24-02-2026
Amphenol RF adds Mini-FAKRA connectors
Amphenol RF has introduced USCAR compliant Mini-FAKRA connectors into its portfolio of RF interconnect for  vehicle designs. This multi-port connector is available in a variety of PCB and cable-mount configurations ... The post Amphenol RF adds Mini-FAKRA connectors appeared first on Electronics Weekly… 24-02-2026
16-Zone Reflow Platform Targets Higher Thermal Stability  16-Zone Reflow Platform Targets Higher Thermal Stability 
Advanced convection architecture and smart power control aim to raise profiling precision while cutting operating costs in high-mix SMT lines. A new 16-zone reflow oven configuration by Kurtz Ersa  is positioning itself as a high-performance option for electronics manufacturers seeking tighter thermal control and improved process efficiency in surface-mount production. The HOTFLOW THREE platform… 24-02-2026
QUOD is a Quake-Like in only 64kB QUOD is a Quake-Like in only 64kB
The demoscene is still alive and well and the proof is in this truly awe-inspiring game demo by daivuk : a Quake-like boomer shooter squeezed into a Windows executable of read… 24-02-2026
30 Rupees CAN Bus Transceiver Design 
Transreceiver plays a crucial role in CAN bus communication transmitting data from the MCU to the CAN network. While most MCUs such as the ESP32 have TWAI support they still require an external CAN bus transceiver. These transceivers can be quite expensive so we ll design our own CAN bus module that costs under… 24-02-2026
Electronics Drive Stable Humanoid Walking Electronics Drive Stable Humanoid Walking
A  real-time control system that sharply improves humanoid robot balance accelerating reliable deployment in industrial and electronics-driven environments. Researchers at the Georgia Institute of Technology have unveiled a control framework that significantly improves how two-legged robots handle instability and recover balance  a key bottleneck in deploying humanoid machines outside… 24-02-2026
Thermal Design Reshapes AI Chips Thermal Design Reshapes AI Chips
Thermal constraining technique stabilizes ferroelectric transistors boosting efficiency and endurance for next-gen electronics. A team led by Professor Taesung Kim at Sungkyunkwan University has unveiled a semiconductor design technique that uses thermal forces to dramatically improve next-generation AI chip performance while trimming energy use a development that could help solve one… 24-02-2026
How to Restore your 19th-Century Lancashire Boiler to Hold 120 PSI How to Restore your 19th-Century Lancashire Boiler to Hold 120 PSI
The Industrial Revolution was powered by steam with boilers being a crucial part of each steam engine yet also one of the most dangerous elements due to the high pressures read… 24-02-2026
3D Atomic-Scale Metrology of Strain Relaxation And Roughness in GAAFETs Via Electron Ptychography Cornell ASM TSMC
A new technical paper 3D atomic-scale metrology of strain relaxation and roughness in Gate-All-Around transistors via electron ptychography was published by researchers at Cornell University ASM and TSMC. Abstract Next-generation semiconductor devices are adopting three-dimensional 3D architectures with feature sizes in the few-nanometer regime creating a need for atomic-scale metrology… 24-02-2026
QuiX Quantum Partners with Taiwan s Artilux to Advance Photonic Quantum Computing
QuiX Quantum and Artilux a Taiwan-based developer of advanced semiconductor-based photonic detector technologies have signed a Memorandum of Understanding MoU aimed at strengthening hardware integration improving manufacturability and lowering operational energy requirements in photonic quantum computing systems. As quantum computing matures into real-world applications operating… 24-02-2026