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Микроконтроллер реального времени на ядре Arm Cortex-M52 для силовой электроники от Geehy
Geehy Semiconductor представила серию экономичных высокопроизводительных микроконтроллеров реального времени MCU/DSP на базе платформы G32R5 … 05-11-2026
Новый каталог оптических трансиверов Cruetech: 3000 моделей от DC до 800 Гбит/с Новый каталог оптических трансиверов Cruetech: 3000 моделей от DC до 800 Гбит/с
Опубликован новый каталог оптических трансиверов Cruetech на 2026 год более 3000 моделей в 40 форм-факторах и исполнениях. 02-11-2026
Новый каталог оптических трансиверов Cruetech: 3000 моделей от DC до 800 Гбит/с
Макро Групп подготовила каталог оптических трансиверов бренда Cruetech на 2026 год более 3000 моделей в 40 форм-факторах и исполнениях. 02-11-2026
Аналоговые источники питания Актаком серии APS - в Госреестре СИ РФ до 2031 года Аналоговые источники питания Актаком серии APS - в Госреестре СИ РФ до 2031 года
Приказом Росстандарта 2079 от 14 октября 2026 г. продлены сроки действия утвержденных типов средств измерений на источники питания Актаком APS-1333 APS-1335 APS-1338 APS-2234 APS-2236 APS-3333 APS-3335 зарегистрированных в Госреестре СИ под номером… 30-10-2026
200G QSFP56 трансиверы  DAC и AOC от Cruetech: экономически эффективное масштабирование сетевой инфраструктуры ЦОД 200G QSFP56 трансиверы DAC и AOC от Cruetech: экономически эффективное масштабирование сетевой инфраструктуры ЦОД
Российский бренд Cruetech расширяет линейку поставляемых оптических компонентов и представляет высокопроизводительные решения 200G в форм-факторе QSFP56 с интерфейсом… 28-10-2026
SoC со встроенным драйвером затворов для управления двигателями от Geehy
Geehy Semiconductor представила серию систем на кристалле SoC для управления электродвигателями со встроенным драйвером затворов и стабилизатором LDO G32M3122/3114/3115. 28-10-2026
4-е поколение SiC MOSFET 1700 В  120 А в корпусе TO-247-4L от AMG POWER 4-е поколение SiC MOSFET 1700 В 120 А в корпусе TO-247-4L от AMG POWER
AMG POWER анонсировал выпуск 1700-вольтового SiC MOSFET четвертого поколения с током стока до 120 А и сопротивлением открытого канала 14 мОм при напряжении затвор-исток 18 В A4G120N1700MT4L. 27-10-2026
4-е поколение SiC MOSFET 1700 В 120 А в корпусе TO-247-4L от AMG POWER
AMG POWER анонсировал выпуск 1700-вольтового SiC MOSFET четвертого поколения с током стока до 120 А и сопротивлением открытого канала 14 мОм при напряжении затвор-исток 18 В A4G120N1700MT4L. 27-10-2026
Porting a  Crappy  Flash Game to the IBM 5150 and Beyond Porting a Crappy Flash Game to the IBM 5150 and Beyond
Flash is obsolete and the IBM 5150 is obsolete. Therefore by the transitive property of algebra you should be able to run flash games on IBM s original PC right Okay read… 05-11-2026
Top-emitting efficient deep ultraviolet LEDs
Japan s National Institute of Information and Communications Technology NICT has reported 275nm deep ultraviolet DUV top-emitting aluminium gallium nitride AlGaN light-emitting diodes LEDs with 7.5% external quantum efficiency EQE and 6.5% wall-plug efficiency … 05-11-2026
Adding Network Security To AI HPC And Data Centers
The location of security functions such as MACsec or IPsec has become a key architectural decision. The post Adding Network Security To AI HPC And Data Centers appeared first on Semiconductor Engineering… 05-11-2026
Turning Conv2D Into A Practical GPU Compute Pattern
A reusable optimization mindset for engineers building GPU compute kernels. The post Turning Conv2D Into A Practical GPU Compute Pattern appeared first on Semiconductor Engineering… 05-11-2026
A System-Level Approach To Protecting 3D-IC Signal Integrity
Accurate SI analysis must account for interactions across vertical interconnects interposers silicon bridges package transitions and neighboring high-speed channels. The post A System-Level Approach To Protecting 3D-IC Signal Integrity appeared first on Semiconductor Engineering… 05-11-2026
Fitting AI Models To Edge Applications
Key Takeaways: The first step in right-sizing an AI model for an embedded application is determining its purpose including the target device functions and product features. Designers typically use a mix of compression techniques rather than a single method. Strategies include quantization distillation and pruning. Small language models SLMs and compact edge models require tight... read… 05-11-2026
Why Testing Automated Driving Is Harder Than It Looks
Instead of waiting for rare situations to occur on public roads engineers can create those situations virtually. The post Why Testing Automated Driving Is Harder Than It Looks appeared first on Semiconductor Engineering… 05-11-2026
Why Integrated Gate Drive Regulation Matters For High Reliability Space GaN Designs
Eliminating the need for a separate bias regulator dedicated to the gate driver for a more streamlined power architecture. The post Why Integrated Gate Drive Regulation Matters For High Reliability Space GaN Designs appeared first on Semiconductor Engineering… 05-11-2026
Physical AI Pushes The Limits Of Hardware
Autonomous machines promise to transform industries but memory bottlenecks power constraints specialized architectures and safety requirements are forcing chip designers to rethink the entire system. The post Physical AI Pushes The Limits Of Hardware appeared first on Semiconductor Engineering… 05-11-2026
College Grads And AI
Computer science majors may be in an awkward space EE grads fine for now. The post College Grads And AI appeared first on Semiconductor Engineering… 05-11-2026
Penguin Solutions to sell Cree LED to Transom
Penguin Solutions Inc of Fremont CA USA Penguin Solutions which designs builds and manages next-generation data centers for enterprises sovereign AI initiatives and neocloud providers has agreed to sell its business Cree LED Inc of Durham NC in an all-cash transaction to Transom Capital Group of Los Angeles CA an operations-focused middle-market private equity… 05-11-2026
Infrastructure for AI Data Center: Keeping pace through closer customer collaboration
Infrastructure providers for AI data centers must improve energy efficiency and optimize thermal management in increasingly dense systems while adapting to quickly evolving needs. Close dialogue with component suppliers helps align these needs with technological development. Aline V rit Global Sales Development for AI Data Centers at TDK explains how customer roadmaps inspire her work and… 05-11-2026
YMTC pulls IPO
Yangtze Memory YMTC has put its Shanghai IPO on hold reports Reuters. The company intended to raise 4.9 billion dollars. In a note to employees YMTC says the IPO was The post YMTC pulls IPO appeared first on Electronics Weekly… 05-11-2026
Qualcomm to supply Starlink Mobile s 5G radio equipment
Qualcomm is to supply  SpaceX  with radio equipment baseband units and software for Starlink Mobile s planned nationwide terrestrial 5G network. Starlink Mobile is Musk s attempt to take on the established The post Qualcomm to supply Starlink Mobile s 5G radio equipment appeared first on Electronics Weekly… 05-11-2026
EU to put up 525m for IC design startups
Yesterday  Brussels tech commissioner Henna Virkkunen unveiled a 525 million  aimed at chip startups split into 425 million in grants for developing commercially viable chips and 85 million to build The post EU to put up 525m for IC design startups appeared first on Electronics Weekly… 05-11-2026
The shortage of Systems Thinkers
The shortage of systems thinkers should be at the top of the agenda for senior executives. This is the key recommendation of the Delft Systems Declaration adopted by more than The post The shortage of Systems Thinkers appeared first on Electronics Weekly… 05-11-2026