Схемы, платы, компоненты

Совместимость модуля DS-RK3568 от Диасом с российской операционный системой РЕД ОС

Подтвердили совместимость DS-RK3568 с операционной системой РЕД… 28-04-2026

Модули широкополосных источников света от Box Optronics

Компания Box Optronics запустила серийные поставки модулей широкополосных источников света BSLD-840-7SM-FA-M. 28-04-2026

Выгодное предложение Cнижение цен на импульсные источники питания Актаком

Сообщаем о значительном снижении цен на популярные модели импульсных источников питания Актаком APS-5310 30 В/10 А и APS-3020 30 В/20… 27-04-2026

Радифотоника от Cruetech. Оптоэлектронный модуль 10-100 МГц

Оптоэлектронный модуль 10 100 МГц Cruetech состоит из передатчика и приёмника.  23-04-2026

Скидка 15% на имульсные тестеры обмоток Актаком АМ-3085 и АМ-3083

Акция на импульсные высоковольтные тестеры обмоток Актаком продлена До 1 июня 2026 года со скидкой 15% можно приобрести не только АМ-3085 но и его младшего собрата -АМ-3083. 22-04-2026

Итоги выставки ExpoElectronica 2026: ключевые тренды и новинки РУ Электроникс

Компания  РУ Электроникс приняла участие в 28-й международной выставке ExpoElectronica 2026 которая традиционно является ключевым отраслевым событием в сфере электронной промышленности. В рамках масштабной экспозиции был представлен широкий спектр линеек электронных компонентов RUICH I включая разъёмы дисплеи устройства коммутации клеммники конденсаторы тиристоры и многие другие.… 21-04-2026

Итоги выставки ExpoElectronica 2026

Компания Теллур Электроникс приняла участие в международной выставке ExpoElectronica 2026 которая традиционно является одной из ключевых площадок для демонстрации достижений в области электронной промышленности. В рамках мероприятия наша команда представила актуальные решения и продукцию по направлениям электромеханики микроэлектроники СВЧ датчиков дисплеев и отечественной элементной базы.… 21-04-2026

SUSE Nvidia Launch AI Infra for Enterprise AI Deployment and Sovereignty

The stack includes an ecosystem approach combining SUSE s open-source stack managed service providers and global system integrators. The post SUSE Nvidia Launch AI Infra for Enterprise AI Deployment and Sovereignty appeared first on EE Times… 30-04-2026

ASPEED to Exhibit OBMF-ICP Over USB Solution at OCP EMEA Summit

ASPEED s showcase will feature a unified approach to streamline communication between BMCs and downstream devices. The post ASPEED to Exhibit OBMF-ICP Over USB Solution at OCP EMEA Summit appeared first on EDN Asia… 30-04-2026

Polyn Achieves Successful Tapeout of Automotive Chip

Polyn Technology has taped out a VibroSense engineering chip featuring an analog neuromorphic core for tire friction monitoring. The post Polyn Achieves Successful Tapeout of Automotive Chip appeared first on EDN Asia… 30-04-2026

Transforming DRC Closure At Advanced Nodes

Turning billions of violations into actionable insights. The post Transforming DRC Closure At Advanced Nodes appeared first on Semiconductor Engineering… 30-04-2026

Creating Agentic EDA Methodologies

Current approaches involve multiple tools vendors designs data formats and abstractions. Can agents really use them all The post Creating Agentic EDA Methodologies appeared first on Semiconductor Engineering… 30-04-2026

Foundry Capacity Is Limiting Who Competes At Leading Edge Nodes

The inability to access leading-edge process nodes has created opportunities for small and midsize chip developers in multi-die design but it requires some sophisticated architectural design tradeoffs. The post Foundry Capacity Is Limiting Who Competes At Leading Edge Nodes appeared first on Semiconductor Engineering… 30-04-2026

Unlocking High-Speed Serial Link Signal Integrity With AMI Model

Analyze the effects on eye diagrams BER and timing margins by integrating advanced equalization algorithms into channel simulations. The post Unlocking High-Speed Serial Link Signal Integrity With AMI Model appeared first on Semiconductor Engineering… 30-04-2026

Facilitating Complex SoC Design Through Automation And Integration

The boundaries between IP reuse interconnect design and hardware-software integration are no longer independent. The post Facilitating Complex SoC Design Through Automation And Integration appeared first on Semiconductor Engineering… 30-04-2026

Solving Clock Signal Integrity And Jitter Issues

Traditional simulations lack an understanding of clocking requirements and cannot handle the complete clock network of a large chip. The post Solving Clock Signal Integrity And Jitter Issues appeared first on Semiconductor Engineering… 30-04-2026

From Standards To Systems: The Chiplet Era On Arm

Igniting scalable AMBA-compliant system connectivity. The post From Standards To Systems: The Chiplet Era On Arm appeared first on Semiconductor Engineering… 30-04-2026

Spotlight shines on Women Leaders In Electronics Awards 2026 winners

Last night saw the Women Leaders In Electronics Awards 2026 the Electronics Weekly event showcasing and celebrating the achievements of women in the electronics industry. The awards were presented in ... The post Spotlight shines on Women Leaders In Electronics Awards 2026 winners appeared first on Electronics Weekly… 30-04-2026

NoC Coherency Challenges Balloon With AI SoCs And Chiplets

Complex chips need coherent and non-coherent sub-NoCs to ensure efficient data paths. Correct hierarchy is essential. The post NoC Coherency Challenges Balloon With AI SoCs And Chiplets appeared first on Semiconductor Engineering… 30-04-2026

Lightweight Couplings Enhance Test Benches

New motion-control hardware combines lightweight couplings fail-safe brakes and predictive monitoring to improve precision vibration control and uptime in high-speed automotive drivetrain test environments. Automotive drivetrain test benches are evolving rapidly as electric mobility reshapes speed profiles load conditions and validation routines. To meet these demands a new portfolio… 30-04-2026

AI Robot Safety Gets Urgent

Current AI guardrails are inadequate for physical robots. New multi-layered safety frameworks could become essential as autonomous machines enter homes hospitals and factories worldwide. As AI-powered robots move from labs into real-world workplaces and homes researchers at University of Pennsylvania are warning that today s safety systems are not enough. A new study says methods… 30-04-2026

MEMS Sensor Breaks Pixel Limits

New motion-assisted image sensor combines MEMS actuation with conventional pixels to deliver ultra-high-resolution imaging offering a fresh path beyond shrinking pixel sizes in smartphones cameras and medical devices. A new image sensor architecture could reshape the future of electronics imaging by solving one of the industry s toughest hardware bottlenecks: pixel miniaturization. Researchers 30-04-2026

Ceramic Substrate for Better AI Chip Packaging

A new development in chip packaging could change how AI processors are built making them smaller faster and more stable in data centers. Kyocera Corporation has commercialized a new multilayer ceramic core substrate for advanced semiconductor packages targeting high-performance processors such as xPUs and switch ASICs as AI data centers demand larger denser … 30-04-2026