ARM, RISC-V контроллеры

SD и microSD с кастомизацией прошивки fixed BOM и поставками на протяжении жизненного цикла от Cruetech

Cruetech анонсировал промышленные SD и microSD карты памяти с кастомизацией прошивки фиксированной спецификацией компонентов fixed BOM и долгосрочными обязательствами по поставкам. 02-09-2026

АВМ-4086: профессиональный мультиметр для точных измерений. Закажите сейчас

Настольный мультиметр АВМ-4086 это надежный прибор разработанный для решения широкого круга измерительных задач. Сочетание высокой точности функциональности и доступной цены делает эту модель лидером в своем классе. 01-09-2026

Срок действия акции на промышленные столы Актаком продлен

До 01 октября 2026 года на большинство моделей промышленных столов Актаком со стандарной и антистатической ESD столешницей большинства модификаций предоставляется скидка 15% от розничной… 01-09-2026

Цифровые осциллографы Актаком серии ADS-2000. Снижение цен

Снижены цены на большинство популярных моделей цифровых осциллографов Актаком экономного класса серии ADS-2000. Модельный ряд приборов данной серии представлен 11 моделями с полосами пропускания от 30 до 300 МГц. Большая часть осциллографов серии ADS-2000 включена в Государственный реестр СИ… 31-08-2026

Волноводный переменный аттенюатор на 75-110 ГГц с ослаблением до 40 дБ от Talent Microwave

Компания Talent Microwave начинает выпуск сверхширокополосного волноводного переменного аттенюатора с рабочим диапазоном 75 110 ГГц и диапазоном регулировки ослабления 0 40 дБ модель TLSA… 31-08-2026

SD и microSD с кастомизацией прошивки fixed BOM и поставками на протяжении жизненного цикла от Cruetech

Cruetech анонсировал промышленные SD и microSD карты памяти с кастомизацией прошивки фиксированной спецификацией компонентов fixed BOM и долгосрочными обязательствами по поставкам. 31-08-2026

Успейте заказать профессиональный анализатор спектра АКТАКОМ ASA-2315

Представляем высокоточный анализатор спектра АКТАКОМ ASA-2315. Этот прибор по праву занимает лидирующие позиции в своем классе благодаря передовой цифровой архитектуре ПЧ которая гарантирует невероятную стабильность и малый уровень фазовых шумов менее -85 дБн/Гц . Для профессионалов работающих с современными радиотехническими системами это незаменимый помощник. 28-08-2026

Портативные осциллографы-мультиметры серии ADS-2000

Доступны к поставке все модели цифровых осциллографов-мультиметров серии ADS-2000 включенных в Госреестр СИ за номером… 27-08-2026

Northrop Grumman wins 7m DARPA contract to create diamond-cooled chips

US-based aerospace defense technology company Northrop Grumman Corp has won a 7m contract to create diamond-cooled chips that deliver higher power faster speeds and enhanced performance for military radar and communications... 02-09-2026

US DOE announces 12m funding opportunity to develop space PVs

To accelerate technical innovation and expand domestic manufacturing capabilities for solar panels in space applications the US Department of Energy s DOE Office of Critical Minerals and Energy Innovation has announced a 12m funding opportunity to help to ensure that the next generation of space photovoltaics PV is developed in… 02-09-2026

Compact Filter Improves Wi-Fi And LTE Signal Coexistence

Qorvo s QPQ5230 filter enables Wi-Fi and LTE coexistence in compact wireless devices combining low WLAN loss with steep rejection of adjacent cellular bands for connectivity. Qorvo has introduced the QPQ5230 a high-performance Bulk Acoustic Wave BAW band-pass filter designed to support Wi-Fi and LTE coexistence in compact wireless devices. The component combines low loss… 02-09-2026

New Metamaterial Speaker Sends Sound Directly To Listeners

A new speaker uses metamaterials and ultrasound to beam audio towards individual listeners reducing sound leakage while enabling personalised listening in shared spaces without headphones. Researchers at Pohang University of Science and Technology POSTECH have developed a highly directional single-element speaker that can beam audio towards an individual listener while reducing unwanted sound… 02-09-2026

AI-Designed Materials Give Soft Robots A Stronger Grip

Researchers have developed a soft robotic hand that delicately handles eggs while lifting heavier objects using AI-designed materials and 3D printing methods for greater flexibility. Researchers at the Korea Advanced Institute of Science and Technology KAIST working with partner institutions have developed a soft 3D-printed robotic hand capable of handling fragile eggs while lifting… 02-09-2026

Creating the Greenest Possible Clothing with Living Fungi

Despite the wide variety of fabrics used for our clothing they all share the property of not being living tissues. This could be due to them never having been part read… 02-09-2026

Indian Startup HrdWyr Builds AI-Native SoCs for the Physical World

HrdWyr is developing AI-native SoCs for power management motor control and other applications where AI meets physical systems. The post Indian Startup HrdWyr Builds AI-Native SoCs for the Physical World appeared first on EE Times… 02-09-2026

Tool Simulates EVs To Test Fast Chargers

Can a charger be tested without plugging in an actual EV A virtual EV tool simulates charging conditions to check safety and performance. Fluke has launched the FEV500 an all-in-one testing tool that simulates an electric vehicle to test fast DC Level 3 charging stations for safety communication interoperability and performance. The tool… 02-09-2026

AI Power Demand Drives 650V GaN Chips 

Can GaN help meet AI s growing power demands 650V devices with low on-resistance are entering production for high-efficiency power conversion.  Navitas Semiconductor has begun shipping its fifth-generation GaNFast gallium nitride GaN power semiconductor technology featuring 650 V GaN FETs designed for AI infrastructure high-performance computing industrial electrification and other… 02-09-2026

AI Drives Higher Demands For Chip Testing

What happens when AI chips push semiconductor testing beyond conventional limits These instruments can tackle rising demands for speed connectivity and power.  Teradyne has launched three instruments for its UltraFLEXplus automated test platform to address the growing test requirements of AI and data centre semiconductor devices. The UltraPin5000-EM targets pattern-intensive AI and compute… 02-09-2026

Roadmap outlines intelligent networks beyond today s wireless systems

Researchers propose reasoning-led wireless networks where AI agents interpret intent prioritise information and coordinate communication to support future autonomous systems across connected environments at scale. Researchers at the Hong Kong University of Science and Technology HKUST have proposed a Reasoning-Empowered Task-Oriented Communication TOC framework as a roadmap towards agentic… 02-09-2026

EBook - Accelerate Silicon Design for Physical AI Part 1

A complete path from AI model to trusted silicon to deployable system. The post EBook Accelerate Silicon Design for Physical AI Part 1 appeared first on Semiconductor Engineering… 02-09-2026

Security In The Era Of Quantum Computing

Enable robust cryptographic mechanisms that remain resilient even against quantum-based computational attacks. The post Security In The Era Of Quantum Computing appeared first on Semiconductor Engineering… 02-09-2026

When Edge AI Lies: Fault Injection and False State in Live Perception Pipelines

In edge AI the most dangerous failure may not be a system that stops working but one that continues operating while quietly accepting the wrong version of reality. The post When Edge AI Lies: Fault Injection and False State in Live Perception Pipelines appeared first on Semiconductor Engineering… 02-09-2026

The Evolution Of Intelligent Systems: From Optimization To Automation to AI

Engineering methodologies are evolving toward more integrated and intelligent approaches across three interconnected domains: optimization automation and AI. The post The Evolution Of Intelligent Systems: From Optimization To Automation to AI appeared first on Semiconductor Engineering… 02-09-2026

Blog Review: Sept. 2

Shifting landscape of chip design AI for 3D-IC India boosts semiconductors 6G roadmap. The post Blog Review: Sept. 2 appeared first on Semiconductor Engineering… 02-09-2026