Микроконтроллеры PIC

Выставка ЭКСПОЭЛЕКТРОНИКА 2026 в Крокус Экспо 14-16 Апреля 2026: Компания РАДИОТЕХ примет участие в 28-й Международной выставке электроники ExpoElectronica 2026 которая пройдёт с 14 по 16 апреля 2026 года в Московском выставочном центре Крокус Экспо Павильон 3 . На стенде компании посетители выставки смогут: - Ознакомиться с новинками поставляемой продукции - Получить консультации технических специалистов по подбору компонентов для различных... 16-02-2026

Процессор для AIoT применения от Rockchip: Процессор для AIoT RK3562 от Rockchip получил награду Продукт с выдающимися рыночными показателями… 16-02-2026

Дешевле до 50% Монтажные наконечники для паяльных станций Актаком: Снижаем цены до 50% на самые популярные модели наконечников и наконечников-картриджей применяемых в монтажных паяльных станциях Актаком. 13-02-2026

Процессорные модули Jetson NVIDIA в каталоге Макро Групп: Макро Групп анонсирует начало поставок процессорных модулей NVIDIA… 12-02-2026

Популярные модели токовых клещей Актаком серии АТК: Предлагаем уникальные модели токовых клещей Актаком серии АТК которые долгие годы пользуются повышенной популярностью у профессионалов в области энергетики. Готовы к поставке токоизмерительные клещи -ваттметр АТК-2200 до 1200 кВт универсальная модель АТК-2250 до 2500 А микротоковые клещи АТК-2001 а также токовые клещи с гибким магнитопроводом АТК-2011 и АТК-2012 10-02-2026

Приглашаем посетить наш стенд на ТБ Форум-2026: Компания Макро ЕМС приглашает посетить выставку в рамках международного форума Технологии и безопасность 2026 в Москве. 10-02-2026

Неохлаждаемый инфракрасный модуль с разрешением 1280 1024 от InfiRay: Компания InfiRay анонсировала компактный неохлаждаемый инфракрасный модуль с разрешением 1280 1024 предназначенный для интеграции в современные оптико-электронные системы … 05-02-2026

Наконечники для термофенов паяльных станций Актаком дешевле до 69%: До 69% снижены цены на практически всю номенклатуру сопел для пайки горячим воздухом термофенов паяльных станций и ремонтных центров с термовоздушных каналом 04-02-2026

Temperature Sensors: TDK launches high-reliability automotive NTC thermistors rated for 175 C: TDK Corporation announced today that it has expanded its NTCSP series of NTC thermistors. These components are designed for conductive glue mounting for operation in high temperature environments up to 175… 17-02-2026

Using 3D Printed Breadboards to Accommodate Wide Boards: Although off-the-shelf breadboards are plentiful and cheap they almost always seem to use the same basic design. Although you can clumsily reassemble most of them by removing the voltage rail read… 17-02-2026

Why Wireless Infrastructure Must Be Reinvented for the 6G Era: 6G demands a complete wireless infrastructure overhaul to prevent energy crises. The post Why Wireless Infrastructure Must Be Reinvented for the 6G Era appeared first on EE Times… 17-02-2026

ams OSRAM and Meizhi settle patent disputes over LEDs used in Spider Farmer luminaires: ams OSRAM GmbH of Premstaetten Austria and Munich Germany and Shenzhen Meizhi Optoelectronics Technology Co Ltd have settled the pending LED-related patent disputes in the USA and Germany resolving the proceedings before the US District Court for the District of Massachusetts and the Regional Court of Duesseldorf… 17-02-2026

SDI buys PRP Optoelectronics for 9.3m: SDI Group plc which acquires and develops companies that design and manufacture specialist products for use in lab equipment industrial scientific sensors and industrial scientific products has acquired PRP Optoelectronics Ltd of Swindon UK for 9.3m excluding 2.8m of acquired net cash. The total consideration comprises 11.3m in cash paid on completion and 0.8 0.9m of deferred cash… 17-02-2026

Traction Inverter Reference Design For LEVs: Facing range and motor control issues in light EVs This inverter design claims to cut redesign work and speed up development. Read on to know more Light electric vehicle makers face three core challenges: improving motor efficiency extending driving range and reducing development time. Designing a traction inverter that meets safety standards handles different… 17-02-2026

When Sound Becomes A 3D Printing Tool: By positioning the sound source closer to the surface researchers achieve enhanced resolution and repeatability in microscale 3D printing on deformable substrates. Researchers at Concordia University have developed a new 3D-printing technique known as proximal sound printing that uses focused ultrasound waves to fabricate microscale structures directly onto soft polymers such as silicone.… 17-02-2026

Design Automation For Stretchable Electronics: By uniting predictive modelling with robot driven experimentation researchers accelerate the search for flexible conductors capable of withstanding extreme mechanical strain. Researchers at the University of Maryland have developed an AI-integrated platform that automates the design of stretchable electrodes for wearable electronics and soft robotics. The platform combines robotics machine… 17-02-2026

Six critical trends reshaping 3D IC design in 2026: Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling. The post Six critical trends reshaping 3D IC design in 2026 appeared first on… 17-02-2026

Research Bits: Feb. 17: Analog layout foundation model carbon nanotube sandpaper low-power optical amplifier. The post Research Bits: Feb. 17 appeared first on Semiconductor Engineering… 17-02-2026

Can A Computer Science Student Be Taught To Design Hardware: To fill the talent gap CS majors could be taught to design hardware and the EE curriculum could be adapted or even shortened. The post Can A Computer Science Student Be Taught To Design Hardware appeared first on Semiconductor Engineering… 17-02-2026

The Race Begins For Much Bigger Abstractions: New data centers and massive compute capabilities enable a whole new way of manipulating and using data. The post The Race Begins For Much Bigger Abstractions appeared first on Semiconductor Engineering… 17-02-2026

One-on-One With proteanTecs CEO Shai Cohen: Inside the whirlwind changes across the chip industry. The post One-on-One With proteanTecs CEO Shai Cohen appeared first on Semiconductor Engineering… 17-02-2026

AI Driven Robotic Swarm Fights Fire: A team of AI driven unmanned ground vehicles navigates obstacles locates fires and coordinates suppression tasks in simulated high risk industrial scenarios. Cyborg Dynamics Engineering in collaboration with Griffith University has demonstrated a team of artificial intelligence-powered unmanned ground vehicles capable of autonomously detecting and extinguishing fires. The collaborative robot… 17-02-2026

Mission Critical 5G For Mobile Operations: From lane level positioning to rapid carrier switching the solution can rework the in-vehicle network stack to sustain real time operations under unstable coverage. When vehicles lose connection operations can slow down or stop altogether. To address this Ericsson has launched the Cradlepoint R2400 a new in-vehicle 5G router built to keep public safety… 17-02-2026

Corporate: Powering Next-Gen Mobility: TDK Announces Title Partner of ABB FIA Formula E World Championship - Tokyo E-Prix Night Race: TDK Corporation will serve as the title partner of the Formula E Tokyo E-Prix hereinafter Tokyo E Prix to be held as a night race in Tokyo on July 25 and 26. This edition of the race will be held under the title 2026 TDK Tokyo E-Prix… 17-02-2026