Технологии

Блок питания 5 5 кВт с сертификацией 80 PLUS Ruby для ИИ-серверов от Compuware

Компания Compuware Technology представила серверный блок питания мощностью 5 5 кВт с сертификацией 80 PLUS Ruby CPR-5521-2M1. 07-10-2026

Полупроводниковый оптический усилитель 1064 нм усиление 13 дБ выходная мощность до 10 дБм от FIBERT

FIBERT представляет полупроводниковый оптический усилитель SOA на длину волны 1064 нм с малосигнальным усилением 13 дБ и выходной мощностью до 10 дБм серия FBRT-PISOA. 06-10-2026

Распродажа высоковольтных тестеров обмоток Актаком

До 31 декабря 2026 года действует специальная программа скидок на высоковольтные тестеры обмоток. С выгодой 15% можно приобрести популярные модели высоковольтных тестеров обмоток АМ-3083 до 3000 В и АМ-3085 до 5000… 05-10-2026

Группа Астра и ГК Макро Групп договорились о сотрудничестве в сфере встраиваемых решений

Одноплатные компьютеры PicoS и NanoS а также модули DIASOM будут работать на операционной системе Astra Linux… 02-10-2026

Группа Астра и ГК Макро Групп договорились о сотрудничестве в сфере встраиваемых решений

Одноплатные компьютеры PicoS и NanoS а также модули DIASOM будут работать на операционной системе Astra Linux… 02-10-2026

Топовые клеммные блоки Tianli на складе в Москве.

О компании Tianli: Азиатский лидер топ-уровня Компания Tianli была основана в 1998 году и за более чем 25 лет работы стала одним из ведущих азиатских производителей клеммных блоков. Штаб-квартира и производственные мощности расположены в зоне нового развития залива Ханчжоу Hangzhou Bay New Zone город Нинбо   всего в 2 часах езды от Шанхая. Tianli имеет сертификаты... 02-10-2026

Срок действия акции на промышленные столы Актаком продлен

До 15 ноября 2026 года на большинство моделей промышленных столов Актаком со стандарной и антистатической ESD столешницей большинства модификаций предоставляется скидка 15% от розничной… 30-09-2026

700 Вт и 63% КПД: NEDITEK представил GaN-усилители Догерти для инфраструктуры 5G-Advanced

Компания NEDITEK объявила о выводе на международный рынок линейки высокомощных СВЧ-усилителей на основе нитрида галлия GaN выполненных по архитектуре Догерти с выходной мощностью до 700 Вт и PAE более… 29-09-2026

Hong Kong Electronics Fairs and electronicAsia: Cutting-edge Technologies on Display this October

Hong Kong s major electronics fairs will showcase AI robotics smart wellness digital entertainment and emerging technologies. The post Hong Kong Electronics Fairs and electronicAsia: Cutting-edge Technologies on Display this October appeared first on EDN Asia… 08-10-2026

Wolfspeed receives conditional 1.5bn loan commitment from US Department of War

Wolfspeed Inc of Durham NC USA which makes silicon carbide SiC materials and power semiconductor devices has received a conditional loan commitment letter from the US Department of War DoW through its Office of Strategic Capital OSC for up to 1.5bn of long-term 30-year financing to support the domestic development and production of silicon carbide SiC materials and wide-bandgap 08-10-2026

SuperSharp to lead THEOSCOPE IR Earth observation mission

SuperSharp a specialist in ultra-high resolution thermal infrared TIR imaging from space has been chosen to lead Europe s THEOSCOPE Mission. This is an Earth observation project with 4 million of The post SuperSharp to lead THEOSCOPE IR Earth observation mission appeared first on Electronics Weekly… 08-10-2026

2026 Retrocomputing Challenge: Retro Terminal Bartop Arcade Topper

Retrocomputing is more than just hardware. It s also a feel a vibe and valkyrie0528 s Retro Terminal Bartop Arcade Topper has it in spades. Here s how it happened. The gorgeous device read… 08-10-2026

India: Recognized for sustainability export excellence and innovation

TDK India has received awards from the Electronic Industries Association of India ELCINA in the areas of sustainability exports and technological innovation. 08-10-2026

Rohm Semiconductor Expands Back-End Chip Manufacturing Outsourcing

Rohm Semiconductor retains wafer fabrication in-house as it expands its back-end semiconductor operations and R D footprint in India. The post Rohm Semiconductor Expands Back-End Chip Manufacturing Outsourcing appeared first on EE Times… 08-10-2026

Finding Critical Defects Before They Become Costly Failures: Process Control For Hybrid Bonding And Advanced Packaging

How complementary inspection and metrology techniques can detect smaller defects and distinguish among a wide range of defect types within a unified workflow. The post Finding Critical Defects Before They Become Costly Failures: Process Control For Hybrid Bonding And Advanced Packaging appeared first on Semiconductor Engineering… 08-10-2026

Demonstrating Plasma As A Viable Alternative To KOH For LCP Metallization Applications

How optimized plasma processing can achieve effective surface roughening and activation. The post Demonstrating Plasma As A Viable Alternative To KOH For LCP Metallization Applications appeared first on Semiconductor Engineering… 08-10-2026

Closing The Visibility Gap

More measurements don t eliminate blind spots when each view captures only part of the device. The post Closing The Visibility Gap appeared first on Semiconductor Engineering… 08-10-2026

Multilayer Inductors for Automotive Cameras

Multilayer inductors support automotive power-over-coax systems by reducing noise while carrying power and data through one cable in camera modules. TDK Corporation has expanded its MLJ1608-G series of multilayer inductors for automotive power-over-coax PoC circuits. Automotive PoC allows power and data to be transmitted through a single coaxial cable. The technology is mainly used… 08-10-2026

From Silicon To Systems: Redefining Competitive Advantage Part 3

The next generation of industry leaders may look very different from the last. The post From Silicon To Systems: Redefining Competitive Advantage Part 3 appeared first on Semiconductor Engineering… 08-10-2026

Shift Left Complicates Fab Data Management

Streaming sensor data creates new challenges for advanced process control. The post Shift Left Complicates Fab Data Management appeared first on Semiconductor Engineering… 08-10-2026

From Process Learning To Production Control: Trends In Advanced Packaging And Implications To Characterization And Test

An integrated methodology for accelerating process development and sustaining production control for advanced packaging technologies. The post From Process Learning To Production Control: Trends In Advanced Packaging And Implications To Characterization And Test appeared first on Semiconductor Engineering… 08-10-2026

The FAaST Track: Enabling Advanced Packaging Through Electrical Process Control

The next frontier in process control isn t just visual it s electrical. The post The FAaST Track: Enabling Advanced Packaging Through Electrical Process Control appeared first on Semiconductor Engineering… 08-10-2026

CPO Testing Faces A Moving Target Problem

Test vendors are adapting to changing connector architectures and extreme alignment tolerances as co-packaged optics heads toward mainstream. The post CPO Testing Faces A Moving Target Problem appeared first on Semiconductor Engineering… 08-10-2026

Perspectives On Test: System Level Test For AI Data Centers

Testing every device under real-world conditions has never been more important. The post Perspectives On Test: System Level Test For AI Data Centers appeared first on Semiconductor Engineering… 08-10-2026