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Итоги выставки ExpoElectronica 2026

Компания Теллур Электроникс приняла участие в международной выставке ExpoElectronica 2026 которая традиционно является одной из ключевых площадок для демонстрации достижений в области электронной промышленности. В рамках мероприятия наша команда представила актуальные решения и продукцию по направлениям электромеханики микроэлектроники СВЧ датчиков дисплеев и отечественной элементной базы.… 21-04-2026

SDR модули CR-P047/CR-P047P от Cruetech

Макро Групп предлагает SDR модули CR-P047 и CR-P047P под брендом… 20-04-2026

Промышленные eMMC NAND и DDR ИС и модули от Cruetech для встраиваемых систем

Cruetech продолжает укреплять своё предложение высоконадежной памяти для промышленных и коммерческих встраиваемых решений. 17-04-2026

Промышленные столы Актаком АРМ-4х1х с антистатической столешницей. Скидка 15%

Информируем о продлении акции на промышленные столы АКТАКОМ АРМ-4х1х с антистатической ESD-столешницей в рамках которой действует скидка 15% от розничной цены. Новый срок действия - до 01 июня 2026… 16-04-2026

Автомобильный дискретный IGBT на 1200 В от Sunco

Компания Sunco производитель силовой электроники анонсировала новое поколение дискретных автомобильных IGBT-транзисторов напряжением 1200 В в корпусе… 15-04-2026

Аналоговые и mixed-signal ИС для промышленной автомобильной и потребительской электроники от NOVOSENSE Microelectronics

Компания Макро Групп начала сотрудничество с производителем высоконадёжных аналоговых и mixed-signal микросхем для промышленной автомобильной и потребительской электроники NOVOSENSE Microelectronics. 13-04-2026

Развитие направления гражданских БПЛА: решения от Теллур Электроникс

Компания Теллур Электроникс приглашает ознакомиться с новой специализированной страницей посвящённой решениям для разработки и производства гражданских беспилотных летательных аппаратов. В условиях стремительного роста рынка БПЛА и задач импортозамещения мы системно расширяем портфель электронных компонентов и модулей востребованных в таких областях как: мониторинг и безопасность сельское… 13-04-2026

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Ensure you receive the latest and greatest Gadget Master posts hot and fresh straight into your inbox The post Get the Gadget Master newsletter appeared first on Electronics Weekly… 21-04-2026

AXT announces public offering

AXT Inc of Fremont CA USA which makes gallium arsenide GaAs indium phosphide InP and germanium Ge substrates and raw materials at plants in China intends to offer and sell shares of common stock in a public offering. In connection with the offering the firm also expects to grant the underwriters a 30-day overallotment option to purchase up to an additional 15% of the shares offered… 21-04-2026

Gas Battery Turns Emissions Into Electricity 

What if pollution could power devices A new system generates electricity directly from captured greenhouse gases without needing external energy input. Sungkyunkwan University researchers have developed a gas battery that converts greenhouse gases into electricity during the capture process introducing a new approach to simultaneous emissions reduction and energy generation. Detailed… 21-04-2026

Chip Uses Vibrations for Efficient Power Conversion 

Can vibrations replace magnets in power chips A design that uses piezoelectric resonators can improve efficiency in high voltage data centre systems. University of California San Diego engineers have developed a new chip design that improves DC to DC step down conversion efficiency for power management in data centers targeting the growing energy demands… 21-04-2026

Microwave 3D Printing For Embedded Electronics 

What if electronics could be printed without heat damage A focused microwave process enables complex devices across materials from polymers to living tissue. Rice University researchers have developed a new 3D printing process using focused microwaves that enables the integration of electronic functionalities into multimaterial structures overcoming long standing manufacturing limitations… 21-04-2026

AI Optimises Battery Cell Production Efficiency 

What if battery production could predict outcomes before testing An AI model reshapes manufacturing by analysing data across every stage of the process  BMW Group and University of Zagreb are advancing battery cell production using artificial intelligence through the Insight research project aimed at improving efficiency quality and resource utilisation across the manufacturing value… 21-04-2026

Why Some S3 Videocards Have a Brightness Issue

Once a pioneer in videocards S3 s legacy is today mostly found in details like texture compression as well as the strong presence of S3-branded videocards in the retro-computing world. There s read… 21-04-2026

The Changing ASICs Landscape: the Shift Toward Chip Disaggregation

ASIC design shifts to modular multi-die systems to beat AI-driven complexity. The post The Changing ASICs Landscape: the Shift Toward Chip Disaggregation appeared first on EE Times… 21-04-2026

Chip Industry Technical Paper Roundup: Apr. 21

Neural computers AFM on EUV nanostructures photonic chip packaging extreme-environment photonics SSD emulation for GPU-centric storage ruthenium interconnects DRAM power delivery on CIM silent data corruption LLM training reliability GPU Rowhammer privilege escalation The post Chip Industry Technical Paper Roundup: Apr. 21 appeared first on Semiconductor Engineering… 21-04-2026

Research Bits: Apr. 21

Compute-in-memory: State space models ultra-thin AlScN memory brain-inspired edge AI. The post Research Bits: Apr. 21 appeared first on Semiconductor Engineering… 21-04-2026

Growing ultra-thin magnetic materials on wafers

Researchers grow magnetic materials on wafer-scale surfaces moving beyond flakes and enabling use in spin-based devices sensors and data storage systems. Researchers from the Indian Institute of Science have found a way to grow ultra-thin magnetic materials across centimetre-scale wafers addressing a key limitation that has kept these materials confined to lab experiments. These… 21-04-2026

Reducing Complexity in Chip Design

Chip design takes years large teams and iterations. A new approach uses AI to handle decisions reduce effort and speed up development across the system. Tattvam AI is being built to fundamentally reduce the complexity of chip design enable faster development cycles and make it possible to design the growing range of silicon… 21-04-2026

Improved tools for design and analysis

A design update brings simulation workflows and support across RF digital power quantum and photonics changing how systems are built and tested. Keysight Technologies has released ADS 2026 with updates across circuit simulation EM analysis electrothermal workflows layout and verification. The platform continues to support RF microwave high-speed digital power electronics quantum… 21-04-2026

  Treat the Antenna Gap as Design Space Not Wasted Space. - Dr K. Mithra

As 5G networks densify and massive MIMO scales antenna engineers face persistent mutual coupling in compact arrays. Dr K. Mithra   an Arizona-based independent wireless researcher and inventor explains to EFY s Akanksha Sondhi Gaur how reengineering the inter-element gap rather than increasing spacing. Q. What inspired you to focus on mutual coupling reduction in microstrip… 21-04-2026

Faster Way to Finish Chip Design

A chip design approach brings heat power and signal checks earlier in the process helping find issues reduce rework and improve performance and reliability. Synopsys has introduced Multiphysics Fusion technology bringing Ansys golden multiphysics engines into its EDA tools to address chip design issues linked to electromagnetics thermal and mechanical effects. The first… 21-04-2026

German Chancellor and Siemens CEO slam EU AI regulation

German Chancellor Friedrich Merz and Siemens CEO Roland Busch pictured criticised the EU s approach to regulating industrial AI in speeches at the Hanover Fair. Busch told Bloomberg that most of ... The post German Chancellor and Siemens CEO slam EU AI regulation appeared first on Electronics Weekly… 21-04-2026