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KLS представляет новую линейку водонепроницаемых разъемов USB Type-C с защитой до IPX8

Компания KLS Electronics один из ведущих производителей разъемов и соединителей представила серию новых высоконадежных водонепроницаемых разъемов USB Type-C предназначенных для применения в устройствах требующих защиты от влаги и пыли. Ключевые особенности новых разъемов: - Универсальность: Новинки включают модели с 6 16 и 24 контактами 6P 16P 24P обеспечивающими поддержку... 09-06-2026

Qatron - это теперь и вакуумные СВЧ приборы

Qatron предлагает на российском рынке обширную номенклатуру вакуумных СВЧ-приборов отличающуюся многообразием характеристик и гибкостью исполнения. 09-06-2026

Итоги выставки Газ. Нефть. Технологии - 2026

С 26 по 29 мая 2026 года компания Теллур Электроникс приняла участие в международной выставке Газ. Нефть. Технологии 2026 которая прошла в Уфе и традиционно собрала ведущих представителей нефтегазовой отрасли промышленности и приборостроения. В течение четырех дней специалисты компании проводили встречи с действующими и потенциальными партнерами обсуждали актуальные задачи предприятий… 04-06-2026

Модуль охлаждения полупроводников от A-MEC

A-MEC представляет модуль охлаждения полупроводников оснащённый двумя алюминиевыми радиаторами и двумя вентиляторами. 03-06-2026

Герметичные разъёмы ZH28 аналоги СНЦ28

Компания Теллур Электроникс начала поставки герметичных цилиндрических соединителей ZH28. Данные разъёмы фиксируются квадратным фланцем на приборную панель под 4 винта и имеют изолятор из стеклянного спая. Являются аналогом российской серии СНЦ28. Аналог ZH28 Российский артикул СНЦ28 ZH28-10/18B-1-b-B СНЦ28-10/18В-1-б-В ZH28-10/18B-1-B СНЦ28-10/18В-1-В ZH28-10/22B-1-b-B СНЦ28-10/22В-1-б-В… 02-06-2026

Официальный сайт Neditek полностью обновлён: новая структура новые каталоги и раздел о качестве

Компания Neditek NEDI Technology Co. Ltd. в апреле 2026 запустила полностью новую версию официального сайта. 01-06-2026

Коннекторы до 500 C и 200 МПа для геофизического оборудования от Sunkye

Sunkye разработала специальные версии высокотемпературных соединителей для работы при температуре до… 28-05-2026

4-канальный приемопередающий модуль трансивера X-диапазона от Hisiwell

Компания Hisiwell представляет SiP-трансивер System in Package transceiver с четырьмя независимыми радиочастотными каналами X-диапазона модуль HX9X40210G20. 27-05-2026

AI-Driven Memory Shortage Upends IT Budgets

IT departments find that purchasing servers and computers has become much more difficult because of surging memory prices and shortages. The post AI-Driven Memory Shortage Upends IT Budgets appeared first on EE Times… 10-06-2026

ROHM launches new top-side-cooling package for SiC MOSFETs

ROHM has developed the TSC3PAK 14.00mm x 18.58mm x 3.50mm package for silicon carbide SiC MOSFETs. Mass production began… 10-06-2026

SemiQ expands high-thermal-performance QSiC Dual3 module range for SSTs and AC-DC converters in AI data-center power systems

SemiQ Inc of Lake Forest CA USA which designs develops and manufactures silicon carbide SiC power semiconductors and 150mm SiC epitaxial wafers for high-voltage applications has expanded its QSiC Dual3 family of half-bridge MOSFET modules adding high-thermal-performance options with AlN aluminium nitride substrates and pre-applied TIM thermal interface material as well as… 10-06-2026

Building Multi-Agent Systems For ASIC Flows

How agents can be used to divide and conquer IC design problems. The post Building Multi-Agent Systems For ASIC Flows appeared first on Semiconductor Engineering… 10-06-2026

PCIe Benefits From AI Despite Scaling Protocols

CXL is also gaining traction in AI processing while MIPI and others are growing at the edge. The post PCIe Benefits From AI Despite Scaling Protocols appeared first on Semiconductor Engineering… 10-06-2026

CPO Will Dominate Scale-Up: Link Budgets For dB And Are Key

Optical interconnects are needed to boost GPU throughput and utilization. The post CPO Will Dominate Scale-Up: Link Budgets For dB And Are Key appeared first on Semiconductor Engineering… 10-06-2026

TSMC May revenue up 30% YoY

TSMC s may revenue was 30% up YoY 2026 at 13.3 billion. It was an increase of 1.5% on April. Revenue for January through May 2026 was   62 billion TSMC says ... The post TSMC May revenue up 30% YoY appeared first on Electronics Weekly… 10-06-2026

Altera Expands Partner Ecosystem for Agilex 9 Direct RF Series FPGAs

Altera is collaborating Mercury Systems and VadaTech to expand its Agilex 9 FPGA ecosystem for next-generation defense platforms. The post Altera Expands Partner Ecosystem for Agilex 9 Direct RF Series FPGAs appeared first on EDN Asia… 10-06-2026

HKUST Partners with CalmCar to Establish Physical AI Innovation Center

The center aims to build a new-generation physical AI technology foundation capable of understanding predicting reasoning and decision-making. The post HKUST Partners with CalmCar to Establish Physical AI Innovation Center appeared first on EDN Asia… 10-06-2026

MacDermid Alpha Enables Reliable Ultra-fine Feature Printing at Production Scale

MacDermid Alpha s ALPHA OM-377 is a no-clean solder paste engineered for ultra-fine feature printing in advanced electronics assemblies. The post MacDermid Alpha Enables Reliable Ultra-fine Feature Printing at Production Scale appeared first on EDN Asia… 10-06-2026

Win Semi qualifies 0.12 μm GaN-on-SiC NP12-0B process for 40V operstion

Win Semiconductors of Taiwan the world s largest pure-play compound semiconductor foundry has qualified NP12-0B for 40V operation. This 0.12 μm gate-length GaN-on-SiC technology integrates multiple transistor improvements providing high ruggedness ... The post Win Semi qualifies 0.12 μm GaN-on-SiC NP12-0B process for 40V operstion appeared first on Electronics Weekly… 10-06-2026

Pairing SiC MOSFETS and gate drivers

onsemi has announced its Elite Pairing Studio an online design tool that pairs SiC MOSFETs and gate drivers for power electronics applications including AI datacentres EVs and industrial systems. ... The post Pairing SiC MOSFETS and gate drivers appeared first on Electronics Weekly… 10-06-2026

26-cells-in-series channel battery monitor

TI has introduced the industry s highest-cell-count battery monitor with an integrated electrochemical impedance spectroscopy EIS engine bringing predictive intelligence comprehensive data and real-time diagnostics to battery monitoring in EV and ... The post 26-cells-in-series channel battery monitor appeared first on Electronics Weekly… 10-06-2026

Nexperia and Semikron Danfoss hook up on SiC-based modules

Nexperia and Semikron Danfoss have signed an MoU to explore a strategic collaboration on SiC-based power modules for automotive traction inverter applications. The collaboration aims to combine Nexperia s expertise in ... The post Nexperia and Semikron Danfoss hook up on SiC-based modules appeared first on Electronics Weekly… 10-06-2026

Integrated test cell for KGD screening

Teradyne has announced an integrated test cell  supporting known good device KGD screening for devices used in AI and data center applications developed in collaboration with Tokyo Electron TEL . The ... The post Integrated test cell for KGD screening appeared first on Electronics Weekly… 10-06-2026

Re-Enable all Compute Units on the PS5-like BC-250 Cryptomining Card

The custom APU at the core of Sony s PlayStation 5 hasn t just been quietly powering these game consoles but also made their way onto cryptomining cards around 2023 which are read… 10-06-2026