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Срок действия акции на промышленные столы Актаком продлен: До 15 ноября 2026 года на большинство моделей промышленных столов Актаком со стандарной и антистатической ESD столешницей большинства модификаций предоставляется скидка 15% от розничной… 30-09-2026

700 Вт и 63% КПД: NEDITEK представил GaN-усилители Догерти для инфраструктуры 5G-Advanced: Компания NEDITEK объявила о выводе на международный рынок линейки высокомощных СВЧ-усилителей на основе нитрида галлия GaN выполненных по архитектуре Догерти с выходной мощностью до 700 Вт и PAE более… 29-09-2026

Новинки каталога: аналоги Analog Devices от 3PEAK RUNIC CHIPANALOG и COREBAI: Склад РУ Электроникс пополнился микросхемами от четырёх брендов: 3PEAK Inc. Jiangsu Runic Technology Co. Shanghai Chipanalog Microelectronics Co. и Corebai Microelectronics Beijing Co . Все четыре производителя выпускают функциональные аналоги компонентов Analog Devices. В поставке операционные усилители прецизионные усилители и цифровые изоляторы. Новинки на складе Поставка охватывает… 28-09-2026

Высоковольтный MOSFET 1700 В / 100 А в изолированном корпусе от AMG Power: AMG Power анонсировала выпуск N-канального MOSFET с напряжением сток-исток 1700 В и непрерывным током стока до 100 А A2G100N1700MT4i. 28-09-2026

SiC-подложки 6 дюймов для мощных СВЧ-транзисторов от Qatron: Qatron объявил о поставках полуизолирующих подложек из карбида кремния SiC диаметром 150 мм для последующей эпитаксии нитрида галлия GaN и изготовления мощных СВЧ-транзисторов. 28-09-2026

XDS батарея для осциллографов АКТАКОМ ADS-6000: Вновь стало возможным применять осциллографы Актаком серии ADS-6000 с полосой пропускания от 60 до 300 МГц для измерений в полевых условиях и на выездных работах. Аккумуляторная XDS-батарея доступна к поставке 28-09-2026

Высоковольтный MOSFET 1700 В / 100 А в изолированном корпусе от AMG Power: AMG Power анонсировала выпуск N-канального MOSFET с напряжением сток-исток 1700 В и непрерывным током стока до 100 А A2G100N1700MT4i. 28-09-2026

Приглашаем на вебинар: Сетевые решения RUICHI для различных объектов: типовые сценарии и комплекты: 8 октября в 11:00 МСК компания РУ Электроникс проведёт вебинар Сетевые решения RUICHI для различных объектов: типовые сценарии и комплекты . Спикер вебинара - Дмитрий Меркушов руководитель направления Видеонаблюдение и сетевое оборудование компании РУ Электроникс . Вебинар посвящён практическому подбору сетевого оборудования для различных объектов: магазинов офисов парковок складов… 25-09-2026

Sheety Turns Spreadsheets Into Binaries For Some Reason: Ever wanted a spreadsheet as an executable with a built-in terminal interface No Well that s a pity because Roberto Alsina s Sheety project does exactly that. Sheety compiles spreadsheet definitions into read… 30-09-2026

TSMC looking to build six fabs in Texas: TSMC is reported to be considering an investment in Texas which could be bigger than its planned 265 billion investment in Arizona. The Texas investment is said to be for The post TSMC looking to build six fabs in Texas appeared first on Electronics Weekly… 30-09-2026

Top-side cooling mount thick film power resistor comes in D PAK package: Vishay s automotive grade top-side cooling mount thick film power resistor the Vishay Sfernice D2TO35S comes in the surface-mount TO-263 D PAK package. Designed for automotive applications it improves thermal The post Top-side cooling mount thick film power resistor comes in D PAK package appeared first on Electronics Weekly… 30-09-2026

CHIIPS 39 - CHIIPs with Andrea Barrett of RS Group: Don t miss the latest episode of our Electronics Weekly podcast CHIIPS. It features Andrea Barrett the chief sustainability officer of RS Group. CHIIPS is brought to you by our editor Caroline The post CHIIPS 39 CHIIPs with Andrea Barrett of RS Group appeared first on Electronics Weekly… 30-09-2026

AI Drives Larger Denser Packaging Raising New Challenges for Equipment Makers: At A STAR s Innovate Together 2026 industry experts explored packaging hybrid bonding optical interconnects and process control for AI. The post AI Drives Larger Denser Packaging Raising New Challenges for Equipment Makers appeared first on EE Times… 30-09-2026

A Simple Solution for Streamlining Battery Recycling: Lithium batteries have become the backbone of many modern devices ranging from toothbrushes to semi trucks so what are we going to do with them when these rechargeable cells finally read… 30-09-2026

Film Capacitors: TDK presents DC-link capacitors rated for up to 135 C in automotive and industrial applications: TDK Corporation presents the B3272 A/G/T series of DC-link film capacitors. These are qualified for continuous operation at case temperatures of up to 135 C with no derating required up to 105 C. These components feature an EPN dielectric. 30-09-2026

E-Series GPU IP: The First Step Towards Converged Acceleration: Combine graphics compute and AI on one flexible architecture and one programmable software stack with up to 32 TOPS Int8 per core at 1GHz and the ability to run graphics and AI workloads concurrently. The post E-Series GPU IP: The First Step Towards Converged Acceleration appeared first on Semiconductor Engineering… 30-09-2026

From Caliptra Foundation To Full Production Deployment: Bridging the gap between open-source Root of Trust foundations and enterprise-grade security deployments. The post From Caliptra Foundation To Full Production Deployment appeared first on Semiconductor Engineering… 30-09-2026

Make Your Interface Work For Your AI SoC-A 10 Step Program: IP Solutions And Models: How proven IP verification solutions and virtual platforms enable earlier SW development improve interoperability and streamline deployment of complex AI SoCs and multi-die systems. The post Make Your Interface Work For Your AI SoC A 10 Step Program: IP Solutions And Models appeared first on Semiconductor Engineering… 30-09-2026

Designing Physical AI Systems Under Real-World Constraints: Where latency power reliability and data movement shape system behavior. The post Designing Physical AI Systems Under Real-World Constraints appeared first on Semiconductor Engineering… 30-09-2026

PCIe 8.0 Over UCIe 3.0: Bringing A Proven Protocol Into The Chiplet Era: UCIe standardizes die-to-die communication within a package and allows PCIe traffic to traverse chiplet boundaries with seamless interoperability over standardized interconnects. The post PCIe 8.0 Over UCIe 3.0: Bringing A Proven Protocol Into The Chiplet Era appeared first on Semiconductor Engineering… 30-09-2026

Data Center Energy Trends Force A Rethink Of Chip Power Delivery: Enabling silicon to operate closer to its true performance envelope without excessive guard banding. The post Data Center Energy Trends Force A Rethink Of Chip Power Delivery appeared first on Semiconductor Engineering… 30-09-2026

Rethinking AI Validation: A lifecycle-driven approach for explainable and trustworthy AI by design. The post Rethinking AI Validation appeared first on Semiconductor Engineering… 30-09-2026

Switch Faster Regulate Faster Protect Faster With Performance Line Microcontrollers: How high-speed control precision timing and hardware acceleration enable next-gen PSUs IBCs and BBUs. The post Switch Faster Regulate Faster Protect Faster With Performance Line Microcontrollers appeared first on Semiconductor Engineering… 30-09-2026

Photonics Fundamentals For Electronics Engineers: eBook: What it is why it s important and how it s being used. The post Photonics Fundamentals For Electronics Engineers: eBook appeared first on Semiconductor Engineering… 30-09-2026