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Новинки каталога: аналоги Analog Devices от 3PEAK RUNIC CHIPANALOG и COREBAI: Склад РУ Электроникс пополнился микросхемами от четырёх брендов: 3PEAK Inc. Jiangsu Runic Technology Co. Shanghai Chipanalog Microelectronics Co. и Corebai Microelectronics Beijing Co . Все четыре производителя выпускают функциональные аналоги компонентов Analog Devices. В поставке операционные усилители прецизионные усилители и цифровые изоляторы. Новинки на складе Поставка охватывает… 28-09-2026

Высоковольтный MOSFET 1700 В / 100 А в изолированном корпусе от AMG Power: AMG Power анонсировала выпуск N-канального MOSFET с напряжением сток-исток 1700 В и непрерывным током стока до 100 А A2G100N1700MT4i. 28-09-2026

SiC-подложки 6 дюймов для мощных СВЧ-транзисторов от Qatron: Qatron объявил о поставках полуизолирующих подложек из карбида кремния SiC диаметром 150 мм для последующей эпитаксии нитрида галлия GaN и изготовления мощных СВЧ-транзисторов. 28-09-2026

XDS батарея для осциллографов АКТАКОМ ADS-6000: Вновь стало возможным применять осциллографы Актаком серии ADS-6000 с полосой пропускания от 60 до 300 МГц для измерений в полевых условиях и на выездных работах. Аккумуляторная XDS-батарея доступна к поставке 28-09-2026

Высоковольтный MOSFET 1700 В / 100 А в изолированном корпусе от AMG Power: AMG Power анонсировала выпуск N-канального MOSFET с напряжением сток-исток 1700 В и непрерывным током стока до 100 А A2G100N1700MT4i. 28-09-2026

Приглашаем на вебинар: Сетевые решения RUICHI для различных объектов: типовые сценарии и комплекты: 8 октября в 11:00 МСК компания РУ Электроникс проведёт вебинар Сетевые решения RUICHI для различных объектов: типовые сценарии и комплекты . Спикер вебинара - Дмитрий Меркушов руководитель направления Видеонаблюдение и сетевое оборудование компании РУ Электроникс . Вебинар посвящён практическому подбору сетевого оборудования для различных объектов: магазинов офисов парковок складов… 25-09-2026

Широкополосная спиральная GNSS-антенна с подавлением помех и усилением до 4 dBiC от Harxon для БПЛА авиационного морского оборудования и транспортных систем Компания Harxon представила компактную широкополосную GNSS-антенну JH003 с круговой поляризацией: Компания Harxon представила компактную широкополосную GNSS-антенну JH003 с круговой поляризацией усилением до 4 dBiC и защитой от внеполосных помех. 25-09-2026

Широкополосная спиральная GNSS-антенна с подавлением помех и усилением до 4 dBiC от Harxon: Компания Harxon представила компактную широкополосную GNSS-антенну JH003 с круговой поляризацией усилением до 4 dBiC и защитой от внеполосных помех. 25-09-2026

Navitas awarded ALATTIS US Army project to develop 10kV power semiconductors: Gallium nitride GaN and silicon carbide SiC power semiconductor firm Navitas Semiconductor Corp of Torrance CA USA has been awarded the ALATTIS Accelerated Large-Area 10kV SiC IGBT program to develop next-generation 10kV silicon carbide SiC power semiconductor technology... 29-09-2026

Metal Gear Solid Moves From PlayStation to ESP32: If you haven t heard of Metal Gear you probably haven t played video games these last few decades. The original Metal Gear dates back to 1987 and launched on the MSX read… 29-09-2026

IBM Details Quantum AI Developments in India: At SEMICON India 2026 IBM s Rahul Rao details India s role in quantum scaling Qiskit education and AI accelerators. The post IBM Details Quantum AI Developments in India appeared first on EE Times… 29-09-2026

TSMC OIP: Chip Industry Growth Blows Past Forecast: Aggressive prediction of 1T by 2030 was 700B too low. Here s why. The post TSMC OIP: Chip Industry Growth Blows Past Forecast appeared first on Semiconductor Engineering… 29-09-2026

Why Verification Needs a Thread Not More Fragments: Why traceability at scale is so critical. The post Why Verification Needs a Thread Not More Fragments appeared first on Semiconductor Engineering… 29-09-2026

Chip Industry Technical Paper Roundup: Sept. 29: A7 CFET vs. A10 NSFETs wafer-scale sub-5nm MoS transistors multi-kW power delivery for 3D HI copper microstructure and TSV residual stress Rowhammer attacks on GPUs gate-level RTL Trojan localization concurrent HBM and host-memory access for LLM inference agent-driven chip design using HLS. The post Chip Industry Technical Paper Roundup: Sept. 29 appeared first on Semiconductor Engineering 29-09-2026

Moore s Law AI: Applying Agentic AI Across Chip Design: Moores Lab AI bets on domain expertise to speed the design process. The post Moore s Law AI: Applying Agentic AI Across Chip Design appeared first on Semiconductor Engineering… 29-09-2026

Rethinking RTL flows with AI-driven hybrid formal verification: Here is how an AI-assisted workflow uses machine learning to prioritize review of thousands of properties in a chip design. The post Rethinking RTL flows with AI-driven hybrid formal verification appeared first on… 29-09-2026

Stacked Semiconductor Layers Bring Local Memory To Wearables: Researchers developed stacked semiconductor devices with tunable ionic memory enabling wearable systems to process motion signals locally while achieving over 90% classification accuracy in simulations. KAIST researchers working with UNIST and POSTECH have developed a stacked AI chip architecture that gives wearable electronics local memory for processing time-dependent signals. The research… 29-09-2026

Muscle Cells Power Thin Swimming Robot: A robot uses a layer of muscle cells and light to swim turn and move through water for monitoring applications. MIT engineers have built a swimming robot powered by a single layer of skeletal muscle cells. The robot uses light to control two fins allowing it to swim turn and change speed in water.… 29-09-2026

Silicon-Based Power Platform Raises Power Density: The new architecture integrates power devices directly into a silicon wafer targeting smaller cooler and more efficient power systems for AI infrastructure EVs and industrial equipment. onsemi has introduced the Embedded Power Platform EPP a new power-device integration and packaging architecture designed to address the growing need for compact thermally efficient power delivery… 29-09-2026

Low-Power SoC for Small Connected Devices: The SoC supports Bluetooth Thread Zigbee and Matter for asset trackers smart home devices sensors and other connected products. Nordic Semiconductor has introduced the nRF54LC10A a low-power multiprotocol system-on-chip SoC for small connected products. The device supports Bluetooth Low Energy LE Bluetooth Channel Sounding Thread Zigbee and Matter and combines a microcontroller… 29-09-2026

Edge AI Comes to Bluetooth Modules: New wireless modules combine Bluetooth LE multi-protocol connectivity expanded memory and local AI acceleration to simplify smarter low-power embedded devices. Ezurio has launched its BL54LM20 Series a new family of wireless modules designed to add edge AI and multi-protocol connectivity to Bluetooth LE products. The series includes the BL54LM20A and BL54LM20B modules along with… 29-09-2026

Mechanical Synapses Power Flexible Electronics: A battery-free neuromorphic device combines tactile sensing memory and learning in flexible electronics pointing toward low-power wearables that can process movement signals locally. Researchers at Dongguk University South Korea have developed a self-powered artificial synapse that combines sensing memory and learning in a flexible electronic device. The architecture eliminates the need… 29-09-2026

ESP32 E-Paper Screen Turns Fridge Into Family Shopping List: An open-source project turns an ESP32-based e-paper device into a shared shopping list that family members can update from their phones while keeping the list available offline. A small e-paper screen on the fridge can serve as a shared household shopping list with family members adding items from their phones. An open-source project uses… 29-09-2026

AMD buys World Labs for 8.2bn: AMD is to buy World Labs an AI model and research lab led by AI pioneer Dr. Fei-Fei. The acquisition will strengthen AMD s ability to develop AI hardware software and The post AMD buys World Labs for 8.2bn appeared first on Electronics Weekly… 29-09-2026