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Совместимость модуля DS-RK3568 от Диасом с российской операционный системой РЕД ОС

Подтвердили совместимость DS-RK3568 с операционной системой РЕД… 28-04-2026

Модули широкополосных источников света от Box Optronics

Компания Box Optronics запустила серийные поставки модулей широкополосных источников света BSLD-840-7SM-FA-M. 28-04-2026

Выгодное предложение Cнижение цен на импульсные источники питания Актаком

Сообщаем о значительном снижении цен на популярные модели импульсных источников питания Актаком APS-5310 30 В/10 А и APS-3020 30 В/20… 27-04-2026

Радифотоника от Cruetech. Оптоэлектронный модуль 10-100 МГц

Оптоэлектронный модуль 10 100 МГц Cruetech состоит из передатчика и приёмника.  23-04-2026

Скидка 15% на имульсные тестеры обмоток Актаком АМ-3085 и АМ-3083

Акция на импульсные высоковольтные тестеры обмоток Актаком продлена До 1 июня 2026 года со скидкой 15% можно приобрести не только АМ-3085 но и его младшего собрата -АМ-3083. 22-04-2026

Итоги выставки ExpoElectronica 2026: ключевые тренды и новинки РУ Электроникс

Компания  РУ Электроникс приняла участие в 28-й международной выставке ExpoElectronica 2026 которая традиционно является ключевым отраслевым событием в сфере электронной промышленности. В рамках масштабной экспозиции был представлен широкий спектр линеек электронных компонентов RUICH I включая разъёмы дисплеи устройства коммутации клеммники конденсаторы тиристоры и многие другие.… 21-04-2026

Итоги выставки ExpoElectronica 2026

Компания Теллур Электроникс приняла участие в международной выставке ExpoElectronica 2026 которая традиционно является одной из ключевых площадок для демонстрации достижений в области электронной промышленности. В рамках мероприятия наша команда представила актуальные решения и продукцию по направлениям электромеханики микроэлектроники СВЧ датчиков дисплеев и отечественной элементной базы.… 21-04-2026

Hackaday Europe: Last Round of Speakers Workshops

If you don t already have your tickets to Hackaday Europe pick them up now. The clock is ticking Today we d like to announce our keynote speaker the remainder of our read… 28-04-2026

Microarchitecture Tailored to 3D-Stacked Near-Memory Processing LLM Decoding U. of Edinburg Peking U. Cambridge et al.

A new technical paper Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling Co-Design was published by researchers at University of Edinburgh Peking University University of Cambridge University of Chinese Academy of Sciences and the Hong Kong University of Science and Technology. Abstract Large language model LLM decoding is a major… 28-04-2026

Rethinking ESD Protection for System-On-Integrated Chiplets UC Riverside

A new technical paper In-SoIC ESD Protection for Chiplet-Based 3D Microsystems: Future Research Directions was published by researchers at the University of California Riverside. Abstract Heterogeneous integration opens a pathway to three-dimensional chiplet-based microsystem chips. Electrostatic discharge reliability is a major challenge to future smart chips featuring rich functionalities 28-04-2026

Alumina Nanowires Improve Thermal Management in Advanced Packaging Georgia Tech et al.

A new technical paper Epoxy Composites Reinforced with Long Al2O3 Nanowires for Enhanced Thermal Management in Advanced Semiconductor Packaging was published by researchers at the Georgia Institute of Technology and National Cheng Kung University. Abstract The rapid increase in heat flux in advanced 2.5D/3D semiconductor packaging places stringent demands on thermal interface materials… 28-04-2026

Mapping and Routing Fault-Tolerant Quantum Circuits Onto Chiplet Architectures TU Munich

A new technical paper Chipmunq: A Fault-Tolerant Compiler for Chiplet Quantum Architectures was published by researchers at the Technical University of Munich. Abstract As quantum computing advances toward fault-tolerance through quantum error correction modular chiplet architectures have emerged to provide the massive qubit counts required while overcoming fabrication limits of monolithic… 28-04-2026

Leveraging Agentic AI Techniques to Improve Formal Verification Infineon et al.

A new technical paper Agentic AI-based Coverage Closure for Formal Verification was published by researchers at Infineon and the NIT Jalandhar. Abstract Coverage closure is a critical requirement in Integrated Chip IC development process and key metric for verification sign-off. However traditional exhaustive approaches often fail to achieve full coverage within project timelines. This… 28-04-2026

Reflectometry-Based Technique for Characterising Complex Thin-Film Structures Aalto U. et al.

A new technical paper Characterisation of Complex Multilayer Nanostructures with High Aspect Ratio was recent published by researchers at Aalto University University of Eastern Finland Chipmetrics OY and VTT MIKES. Abstract Deposition studies of deep vertical dips on semiconductor wafers can create problems at an industrial manufacturing scale since cross-sectioning requires a lot… 28-04-2026

A Tube Amplifier That s Oven Ready

The problem with tube based audio is that it has so often been hijacked by people for whom the bragging rights of having a tube amplifier outweigh the benefits or read… 28-04-2026

The system architect s sketchbook: The tree knows

Great systems like great trees know what they need. The post The system architect s sketchbook: The tree knows appeared first on… 28-04-2026

The GPS III Rollout is Almost Complete But What is it

Considering how integral it is to our modern way of life you could be excused for thinking that the Global Positioning System GPS is a product of the smartphone era. read… 28-04-2026

Google s TPU 8t and TPU 8i address agentic AI

Google has announced its eighth-generation TPUs Tensor Processing Units the TPU 8t and TPU 8i which are specialised ASICs for AI. They are specifically designed for AI training TPU 8t ... The post Google s TPU 8t and TPU 8i address agentic AI appeared first on Electronics Weekly… 28-04-2026

Precision lasers boost safety and efficiency in smart factories

Lidar systems enable precise obstacle detection distance measurement and real-time mapping for safer interaction between humans and robots. The post Precision lasers boost safety and efficiency in smart factories appeared first on… 28-04-2026

Input Capacitor Challenges in High-Density PD and GaN Chargers - YMIN Capacitor Solutions 

High-density PD and GaN chargers push input capacitor limits. YMIN aluminum electrolytic capacitors improve ESR ripple and reliability in compact designs. The post Input Capacitor Challenges in High-Density PD and GaN Chargers YMIN Capacitor Solutions  appeared first on EE Times… 28-04-2026

Arm AI analysis toolkit

Arm has launched a performance analysis toolkit for software and AI development called Performix which gives developers and AI agents system-wide visibility to identify inefficiencies and optimise workloads while fitting ... The post Arm AI analysis toolkit appeared first on Electronics Weekly… 28-04-2026

Tenstorrent Unveils Next-Gen Servers for Fast Tokens No Disaggregation Needed

The world is talking about specialized specialized specialized and that should be terrifying them because as models change that specialized hardware is not going to work said Tenstorrent CEO Jim Keller. The post Tenstorrent Unveils Next-Gen Servers for Fast Tokens No Disaggregation Needed appeared first on EE Times… 28-04-2026

Stock Market Shrugs Off War

Between February 28th when the U.S. and Israel first launched airstrikes on Iran and March 30th the S P 500 dropped almost 8%. On March 31 the sentiment changed however when ... The post Stock Market Shrugs Off War appeared first on Electronics Weekly… 28-04-2026