ВходНаше всё Теги codebook 无线电组件 Поиск Опросы Закон Четверг
7 мая
О смысле всего сущего0xFF Средства и методы разработки Мобильная и беспроводная связь Блошиный рынокОбъявления
МикроконтроллерыPLD, FPGA, DSP AVRPICARM, RISC-VТехнологии Кибернетика, автоматика, протоколы Схемы, платы, компоненты
1109 1108 1107 1106 1105 1104 1103 1102 1101 1100
Новая тема
День Радио День Радио, 1895 год
Решения для розничной торговли от AUO Решения для розничной торговли от AUO
Компания Теллур Электроникс предлагает к поставке дисплеи производителя AUO одного из ведущих разработчиков современных экранных решений для различных отраслей включая ритейл. Компания AUO предлагает экологичные и инновационные решения для интеллектуальной розничной торговли которые обеспечивают измеримые результаты: повышение вовлеченности клиентов автоматизацию сервисов и оптимизацию рентаб 06-05-2026
16-канальный разветвитель мощности 0 5-6 ГГц 30 Вт от Freflex
Высокопроизводительный 16-канальный пассивный разветвитель мощности работающий в диапазоне 0 5-6 ГГц представляет собой новейшее решение для многоканального распределения ВЧ/СВЧ-сигналов. 06-05-2026
Кастомизированный шлейф для подключения к OrangePi 5 Кастомизированный шлейф для подключения к OrangePi 5
Кастомизированный шлейф который позволяет подключить наши модули DS-CIMX напрямую к платформе OrangePi… 05-05-2026
SDR модуль CR-P151Q от Cruetech
SDR модуль на СнК AMD XCZU15EG-2FFVB1156I - CR-P151Q под брендом… 04-05-2026
Совместимость модуля DS-RK3568 от Диасом с российской операционный системой РЕД ОС Совместимость модуля DS-RK3568 от Диасом с российской операционный системой РЕД ОС
Подтвердили совместимость DS-RK3568 с операционной системой РЕД… 28-04-2026
Модули широкополосных источников света от Box Optronics
Компания Box Optronics запустила серийные поставки модулей широкополосных источников света BSLD-840-7SM-FA-M. 28-04-2026
Выгодное предложение Cнижение цен на импульсные источники питания Актаком Выгодное предложение Cнижение цен на импульсные источники питания Актаком
Сообщаем о значительном снижении цен на популярные модели импульсных источников питания Актаком APS-5310 30 В/10 А и APS-3020 30 В/20… 27-04-2026
Industrial AI: How Factories Learn to Live With Uncertainty
Industrial AI is moving beyond controlled environments with factories deploying systems designed to manage operational uncertainty. The post Industrial AI: How Factories Learn to Live With Uncertainty appeared first on EE Times… 07-05-2026
32Gbps ReDriver Targets Smart Cockpits 32Gbps ReDriver Targets Smart Cockpits
New four-channel automotive ReDriver improves 32Gbps signal integrity for AI-driven cockpit platforms supporting PCIe 5.0 SAS4 and CXL while reducing jitter power consumption and PCB design complexity. A new automotive-grade four-channel linear ReDriver by Diode Incorporated has been launched to address growing signal-integrity challenges in next-generation smart cockpit platforms integrating 07-05-2026
This Az-El Mount Is Worth Following This Az-El Mount Is Worth Following
Communication with satellites often involves the use of high-gain directional antennas coupled with careful positioning to find and track the target. With a geostationary satellite the mount is either fixed read… 07-05-2026
AI Helps Robots Learn Faster AI Helps Robots Learn Faster
Researchers have developed an AI training method that enables robots to transfer skills learned in simulation into real-world tasks more efficiently reducing dependence on costly physical training data. Researchers  at Aston University have developed a new AI-based training framework that allows robots to transfer skills learned in laboratory simulations into real-world environments with… 07-05-2026
Algorithm Designs RF Chips That Look Like QR Codes 
An algorithm that can design RF chips in days instead of months. The resulting layouts look like QR codes and outperform conventional approaches.  Researchers at the USC Viterbi School of Engineering have developed an algorithmic framework for designing radio frequency integrated circuits RFICs enabling the discovery of unconventional chip layouts that traditional design approaches… 07-05-2026
Dual Switches for High-Bandwidth Signal Routing Dual Switches for High-Bandwidth Signal Routing
Dual high-speed switches route PCIe 6.0 and USB4 v2.0 signals delivering up to 34 GHz bandwidth while enduring extreme industrial temperatures. Toshiba has introduced the TDS5C212MX and TDS5B212MX new 2:1 multiplexer and 1:2 demultiplexer switches designed for next generation high speed interfaces including PCIe 6.0 and USB4 Version 2.0. The devices are aimed at applications 07-05-2026
Geometry Solves the Thick Battery Speed Trap  Geometry Solves the Thick Battery Speed Trap 
A 3D printed interlocking electrode kills dead zones. More storage faster charging and 7 500 cycles later without changing the material itself.  A research team led by engineers and scientists at Lawrence Livermore National Laboratory LLNL has developed a 3D printed electrode design aimed at improving electrochemical energy storage devices such as rechargeable batteries and supercapacitors. 07-05-2026
Solving AI s Hidden Receiver Validation Crisis Solving AI s Hidden Receiver Validation Crisis
A new receiver test solution automates the impossible calibration at 128 GT/s. What engineers couldn t see before is now within reach.  Keysight Technologies has introduced a new PCIe 7.0 Receiver Test application expanding its validation portfolio to support end-to-end transmitter and receiver testing for next-generation compute AI and data center applications. The solution addresses… 07-05-2026
The Emergence Of Electronics Digital Twins For Software-Defined Vehicles
Why it s no longer sufficient to simulate a physical vehicle or subsystem. The post The Emergence Of Electronics Digital Twins For Software-Defined Vehicles appeared first on Semiconductor Engineering… 07-05-2026
Securing Chiplet-Based Platforms: Distributed Trust With Centralized Authority
A security model where every chiplet can prove identity boot correctly and communicate securely without becoming the weak link. The post Securing Chiplet-Based Platforms: Distributed Trust With Centralized Authority appeared first on Semiconductor Engineering… 07-05-2026
Powering AI At Scale: Why 3D-ICs Demand A New Approach To Power Integrity
Connectivity density and power delivery complexity have made power integrity one of the most critical constraints in modern system design. The post Powering AI At Scale: Why 3D-ICs Demand A New Approach To Power Integrity appeared first on Semiconductor Engineering… 07-05-2026
How OCP S.O.L.I.D. Completes The Data Center Security Picture
A framework that establishes concrete device-specific security requirements upfront and verifies them at the end. The post How OCP S.O.L.I.D. Completes The Data Center Security Picture appeared first on Semiconductor Engineering… 07-05-2026
Building AI Without Guardrails
The semiconductor ecosystem is wrestling with fragmented standards IP exposure and the urgent need for runtime assurance. The post Building AI Without Guardrails appeared first on Semiconductor Engineering… 07-05-2026
2.5D 3D 3.5D
Balancing performance manufacturability cost and thermal efficiency in ways neither traditional planar designs nor purely vertical stacks can. The post 2.5D 3D 3.5D appeared first on Semiconductor Engineering… 07-05-2026
What Is Power Usage Effectiveness PUE In Data Centers
A common metric overlooks the energy wasted by inefficient server AC/DC power conversion. The post What Is Power Usage Effectiveness PUE In Data Centers appeared first on Semiconductor Engineering… 07-05-2026
Beyond the Clinic: A Blueprint For Developing Reliable Edge AI-Enabled Medical Devices
Developing AI-guided patient-operated home ultrasound probes that can produce a reliable medical image. The post Beyond the Clinic: A Blueprint For Developing Reliable Edge AI-Enabled Medical Devices appeared first on Semiconductor Engineering… 07-05-2026