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SiC MOSFET на 1200 В 75 А 30 мОм в корпусе TOLT с верхним отводом тепла от AMG Power

AMG Power анонсировал производства карбид-кремниевых МОП-транзисторов транзисторов на 1200 В с сопротивлением 30 мОм в корпусе TOLT с отводом тепла через верхнюю поверхность. 26-03-2026

Приглашаем на выставку ЭкспоЭлектроника-2026

Приглашаем посетить наш стенд компании Макро Групп на выставке ЭкспоЭлектроника-2026… 25-03-2026

Многоканальные паяльные станции Актаком доступны к поставке

Информируем о доступности поставки с короткими сроками широкого ассортимента многоканальных паяльных станций - ремонтных комплексов Актаком различного функционального назначения. 24-03-2026

Высокомощные разъёмы стандарта OCP M-CRPS от Oupiin

Компания Oupiin представила высокомощных разъёмов соответствующие стандарту OCP M-CRPS  серию… 23-03-2026

Преобразователи уровня К5017ПУ от АО НЗПП Восток

Серия К5017ПУ разработанная и производимая АО НЗПП Восток представляет собой линейку современных двунаправленных преобразователей логических уровней предназначенных для согласования цифровых сигналов между микросхемами и устройствами работающими при разных напряжениях. Микросхемы позволяют безопасно и эффективно устанавливать соединения между цифровыми устройствами что критически важно… 20-03-2026

Мотореле A-MEC

A-MEC представил мотореле с возможностью переключения тока и напряжения 100 А/250 В AC MR02-100… 20-03-2026

Приглашаем на выставку ExpoElectronica 2026

Рады сообщить что компания РУ Электроникс станет участником международной выставки электроники ExpoElectronica 2026 . Ждем вас с 14 по 16 апреля в Москве  на крупнейшем отраслевом событии в России и ЕАЭС чтобы обсудить новинки текущие проекты и перспективы сотрудничества. Выставка пройдет в Москве в МВЦ Крокус Экспо . Получить билет на выставку. Что ждет вас на выставке ExpoElectronica … 19-03-2026

SDR модули CR-P401D и CR-P501D от Cruetech

Компания Макро Групп предлагает SDR модули от бренда Cruetech CR-P401D… 18-03-2026

Switching Converter Reference Design

A single platform brings multiple DC-DC regulators together helping you test performance compare topologies validate behavior and move from evaluation to design integration. The Building Block Solutions Switchers BBS-SW reference design from Microchip is designed to help engineers quickly evaluate and compare different DC-DC switching regulators in one place. It brings together multiple… 26-03-2026

Advanced 3D Sensor for High-Precision Glass Inspection

Explore how a high-speed 3D sensor is transforming the inspection of reflective and transparent surfaces in manufacturing. SmartRay has expanded its ECCO X sensor family with the new ECCO X 050G a high-precision 3D scanning solution specifically designed for reflective and transparent surfaces such as glass. The launch represents a major step forward… 26-03-2026

MES Configuration Implementation - Entry Professional At Schneider Electric In Ahmednagar

APPLY HERE Location: Ahmednagar Company: Schneider Electric Position Title: Deputy Manager Manufacturing Automation and Digitalisation Education: B.E/ B.Tech Electrical/ Electronics/ Instrumentation and Control Experience: 2 5 years Work Location: Ahmednagar Key Responsibilities/Deliverables Functional Competencies 26-03-2026

3D Printed Wire Stripper Uses PLA Blades

One might think that Da Rius s mostly 3D printed wire stripper would count its insulation-shearing blades among the small number of metal parts required but that turns out to not be read… 26-03-2026

Motor-Free Actuator for Fast Motion

This actuator skips motors and still moves in under a second bending and returning on its own pointing to new ways to build robotic and space systems. A smart material-based actuator developed at KAIST operates in less than a second without using a motor offering a new option for robotics and space structures that… 26-03-2026

Catalyst That Could Change Fuel Cells Forever

A nickel catalyst defies precious metals unlocking high-performance fuel cells that could transform energy for vehicles generators and remote power systems. Researchers at Cornell University have developed a nickel-based catalyst that enables high-performance fuel cells without relying on precious metals. Designed for alkaline environments the catalyst maintains strong hydrogen oxidation… 26-03-2026

Cracking the Code of Next-Gen Batteries

Researchers reveal how tiny metallic dendrites sabotage solid-state batteries and uncover a path to safer energy-dense power for advancing devices. MIT researchers have uncovered why solid-state batteries long hailed as safer and more energy-dense alternatives to lithium-ion are prone to short-circuiting. Using a novel visualization technique the team directly observed metallic dendrites… 26-03-2026

Platform Powering the Brain-Inspired Revolution

A unified platform that can bring spiking neural networks together accelerating neuromorphic AI from fragmented research to real-world edge deployment. Innatera has introduced Synfire an open community driven platform designed to unify the neuromorphic computing ecosystem and accelerate real world edge AI deployment. The platform addresses fragmentation across tools models and deployment… 26-03-2026

High-speed storage for digital creators

Have you faced storage issues while working with large files or running AI models locally This storage helps keep work running and avoids delays. Team Group Inc. has introduced the T-CREATE CLASSIC H514 M.2 PCIe 5.0 SSD to address demand for data storage in the generative AI era. Built on the PCIe Gen5… 26-03-2026

Ultrasonic Welding System Expands Power Assembly

A welding system that can remove heat consumables and process complexity enabling cleaner manufacturing and evolving power module designs. Kulicke Soffa has introduced ASTERION-TW an ultrasonic terminal welding system designed for next generation power module manufacturing. The system brings solid-state ultrasonic welding as an alternative to conventional mass-reflow processes targeting… 26-03-2026

The 6G clock ticking: Why silicon architecture for 2030 must start in 2026

While 6G is anticipated to take off commercially by 2030 the work-back schedule reveals a tight timeline for wireless developers. The post The 6G clock ticking: Why silicon architecture for 2030 must start in 2026 appeared first on… 26-03-2026

AI Workloads Are Turning The Data Center Network Into A Combined Memory And Storage Fabric

Inference is reshaping data center architecture introducing a new and less forgiving set of network requirements. The post AI Workloads Are Turning The Data Center Network Into A Combined Memory And Storage Fabric appeared first on Semiconductor Engineering… 26-03-2026

IP Requirements Evolve For 3D Multi-Die Designs

Vertical signal paths create complex parasitic interactions that are harder to model and control. The post IP Requirements Evolve For 3D Multi-Die Designs appeared first on Semiconductor Engineering… 26-03-2026

Importance Of Hardware Security Verification In Pre-Silicon Design

As hardware systems grow in complexity security can no longer rely on assumptions or isolated checks. The post Importance Of Hardware Security Verification In Pre-Silicon Design appeared first on Semiconductor Engineering… 26-03-2026

Memory Wall Gets Higher

With SRAM failing to scale in recent process nodes the industry must assess its impact on all forms of computing. There are no easy solutions on the horizon. The post Memory Wall Gets Higher appeared first on Semiconductor Engineering… 26-03-2026

Precision In Depth: Extraction Workflows For CFETs And Buried Power Rails

Robust extraction empowers semiconductor innovation at the most complex nodes. The post Precision In Depth: Extraction Workflows For CFETs And Buried Power Rails appeared first on Semiconductor Engineering… 26-03-2026