Моя конференция

Аналоговые и mixed-signal ИС для промышленной автомобильной и потребительской электроники от NOVOSENSE Microelectronics

Компания Макро Групп начала сотрудничество с производителем высоконадёжных аналоговых и mixed-signal микросхем для промышленной автомобильной и потребительской электроники NOVOSENSE Microelectronics. 13-04-2026

Развитие направления гражданских БПЛА: решения от Теллур Электроникс

Компания Теллур Электроникс приглашает ознакомиться с новой специализированной страницей посвящённой решениям для разработки и производства гражданских беспилотных летательных аппаратов. В условиях стремительного роста рынка БПЛА и задач импортозамещения мы системно расширяем портфель электронных компонентов и модулей востребованных в таких областях как: мониторинг и безопасность сельское… 13-04-2026

Высоковольтный тестер сопротивления изоляции Актаком АММ-2093

Возобновлены продажи высоковольтного тестера сопротивления изоляции модели АММ-2093 предназначенного для проведения испытаний стойкости изоляции напряжением до 5/6 кВ AC/DC и измерения сопротивления изоляции до… 10-04-2026

Интеллектуальные ИС для дымовых газовых и комбинированных датчиков безопасности от 3Think. Вебинар

Компания Макро Групп приглашает на технический вебинар посвящённый специализированным решениям в области систем безопасности на базе интеллектуальных микросхем компании… 10-04-2026

Приглашаем посетить наш стенд на 31-ой Международной выставке Securika Moscow

Компания Макро ЕМС приглашает посетить 31-ую Международную выставку технических средств охраны и оборудования для обеспечения безопасности и противопожарной защиты Securika Moscow 2026 в Москве. 09-04-2026

Модуль камеры DS-CAR0234-22 на базе сенсора ON Semi

Запустили серийное производство модуля камеры DS-CAR0234-22 на базе сенсора… 07-04-2026

Разъёмы JCDw аналоги ОНП-ЖИ СНП339

Теллур Электроникс предлагает малогабаритные низкочастотные прямоугольные соединители JCDw. Разъёмы соответствуют стандарту GJB2446A MIL-C-83513 предназначены для внутреннего монтажа и являются аналогом российских серий ОНП-ЖИ и СНП339. th td padding: 5px Аналог JCDw Российский артикул ОНП-ЖИ / СНП339 JCDw-21TJ-N1 ОНП-ЖИ-8-21/46х8-В38-1 / СНП339-21ВП118-1 JCDw-21ZK-N1Q ОНП-ЖИ-8-21/46х8-Р2 07-04-2026

High-performance infrared photodiode for optical systems

A photodiode detects infrared light and supports communication sensing and measurement systems used in electronic devices. Hamamatsu Photonics has introduced the S15152 Si PIN photodiode for systems that require fast and accurate infrared light detection. The device is built for optical communication and measurement setups where both response speed and signal accuracy are important.… 15-04-2026

Inverter Platforms Enable Efficient Motion Control

Faster switching and reduced losses are helping engineers design compact motor drive systems for robotics and electric mobility applications. Efficient Power Conversion has introduced two 3-phase BLDC motor drive inverter evaluation platforms designed for high-power motion control applications such as robotics industrial automation and light electric mobility systems. Supporting motor drive… 15-04-2026

Silanna UV adds TO-39 flat-window package to SF1 and SN3 series of UV-C LEDs

Silanna UV of Brisbane Australia which provides far-UVC light sources for water quality sensors gas sensors disinfection and HPLC high-performance liquid chromatography applications has released an additional package type: a TO-39 flat-window package for its high-performance SF1 series Far-UVC 235nm and SN3 series Deep-UVC 255nm LEDs. This latest development expands the firm… 15-04-2026

Flexible Interconnects for High Speed RF Systems

As system density increases adaptable cable solutions are helping maintain signal integrity while allowing precise routing across complex RF layouts. Amphenol RF has expanded its portfolio of pre-configured cable assemblies with additional standard lengths for its SMA plug to SMA jack configuration designed on 0.085 inch conformable cable. The offering is aimed at high-frequency applications 15-04-2026

Tools to build high-density chip systems

The process design kits open early access to high-density chip connections giving you a way to test build and push multi-chip systems toward real use cases. The NanoIC pilot line led by imec has released two interconnect process design kits PDKs that allow early design of high-density chip-to-chip systems beyond 2nm. These kits give… 15-04-2026

Robotic Vision Intelligence for Modern Factory Logistics

From inspection to movement integrated systems are enabling smarter decisions reducing manual effort and improving efficiency across manufacturing logistics. Hikrobot is advancing manufacturing operations with an integrated portfolio of machine vision and robotics solutions aimed at improving efficiency flexibility and visibility across production and intralogistics environments. As product… 15-04-2026

DOOM on a Fancy Smart Toaster

Although toasters should be among the most boring appliances in a household with perhaps just a focus on making their toasting more deterministic rather than somewhere between still frozen read… 15-04-2026

How Europe Actually Finances Semiconductor Investments

As Europe s semiconductor ambitions shift from policy announcements to real industrial projects a less visible question is coming into focus: How do those projects actually get financed The post How Europe Actually Finances Semiconductor Investments appeared first on EE Times… 15-04-2026

When Motor Control Gets a Secure Upgrade

From motor drives to data centers an integrated approach is helping reduce complexity while improving responsiveness efficiency and long term system security. Microchip Technology has expanded its dsPIC33A digital signal controller portfolio with the introduction of the dsPIC33AK256MPS306 family targeting high-density AI data center power complex motor control and intelligent sensing… 15-04-2026

Inductors: TDK enables compact 1250 V DC converter designs with a new high-voltage common-mode choke

TDK Corporation presents the B82722V6 B040 series of new compact high-voltage current-compensated ring-core double chokes. Designed primarily for rated DC voltages of up to 1250 V 630 V AC these compact common-mode chokes 23 x 15.5 x 24 mm effectively suppress EMI in next-generation applications. 15-04-2026

Why More CPUs Are Needed For Agentic AI

General-purpose processing demands will multiply once machines are talking to machines. The post Why More CPUs Are Needed For Agentic AI appeared first on Semiconductor Engineering… 15-04-2026

Blog Review: Apr. 15

eUSB2-V2 advances capacitor demystification custom AI chips GaN chiplet prompts and infrastructure. The post Blog Review: Apr. 15 appeared first on Semiconductor Engineering… 15-04-2026

AI Growing Impact On Chip Design And EDA Tools

Demand for faster design and more automation grows from key customers. The post AI Growing Impact On Chip Design And EDA Tools appeared first on Semiconductor Engineering… 15-04-2026

AI speeds up quantum processor development

New AI models address quantum computing challenges improving calibration and error correction while enabling faster processing and accurate systems for real use. NVIDIA has introduced a new family of open-source quantum AI models called Ising to improve how quantum processors are calibrated and corrected for errors. The models address two key challenges in quantum… 15-04-2026

Quantum Sensors Enable Multitasking Measurement of Multiple Properties

Quantum sensors enable multitasking measurement of multiple properties simultaneously improving precision and unlocking advanced sensing applications in science. Quantum sensors are emerging as powerful tools capable of detecting extremely small signals that traditional technologies cannot capture. Hence researchers at Massachusetts Institute of Technology have developed a new approach that… 15-04-2026

Focused Microwave 3D Electronics Printing

Focused microwave-based 3D printing enables precise localised heating of electronic materials allowing complex multi-material devices to be fabricated in a single process without damaging surrounding structures. A new electronics manufacturing technique using focused microwaves is redefining how 3D-printed devices are built enabling complex multi-material structures that were previously… 15-04-2026