Caxapa

Срок действия акции на промышленные столы Актаком продлен: До 15 ноября 2026 года на большинство моделей промышленных столов Актаком со стандарной и антистатической ESD столешницей большинства модификаций предоставляется скидка 15% от розничной… 30-09-2026

700 Вт и 63% КПД: NEDITEK представил GaN-усилители Догерти для инфраструктуры 5G-Advanced: Компания NEDITEK объявила о выводе на международный рынок линейки высокомощных СВЧ-усилителей на основе нитрида галлия GaN выполненных по архитектуре Догерти с выходной мощностью до 700 Вт и PAE более… 29-09-2026

Новинки каталога: аналоги Analog Devices от 3PEAK RUNIC CHIPANALOG и COREBAI: Склад РУ Электроникс пополнился микросхемами от четырёх брендов: 3PEAK Inc. Jiangsu Runic Technology Co. Shanghai Chipanalog Microelectronics Co. и Corebai Microelectronics Beijing Co . Все четыре производителя выпускают функциональные аналоги компонентов Analog Devices. В поставке операционные усилители прецизионные усилители и цифровые изоляторы. Новинки на складе Поставка охватывает… 28-09-2026

Высоковольтный MOSFET 1700 В / 100 А в изолированном корпусе от AMG Power: AMG Power анонсировала выпуск N-канального MOSFET с напряжением сток-исток 1700 В и непрерывным током стока до 100 А A2G100N1700MT4i. 28-09-2026

Высоковольтный SiC MOSFET 1700 В / 100 А в изолированном корпусе от AMG Power: AMG Power анонсировала выпуск N-канального SiC MOSFET с напряжением сток-исток 1700 В и непрерывным током стока до 100 А A2G100N1700MT4i. 28-09-2026

SiC-подложки 6 дюймов для мощных СВЧ-транзисторов от Qatron: Qatron объявил о поставках полуизолирующих подложек из карбида кремния SiC диаметром 150 мм для последующей эпитаксии нитрида галлия GaN и изготовления мощных СВЧ-транзисторов. 28-09-2026

XDS батарея для осциллографов АКТАКОМ ADS-6000: Вновь стало возможным применять осциллографы Актаком серии ADS-6000 с полосой пропускания от 60 до 300 МГц для измерений в полевых условиях и на выездных работах. Аккумуляторная XDS-батарея доступна к поставке 28-09-2026

Высоковольтный SiC MOSFET 1700 В / 100 А в изолированном корпусе от AMG Power: AMG Power анонсировала выпуск N-канального SiC MOSFET с напряжением сток-исток 1700 В и непрерывным током стока до 100 А A2G100N1700MT4i. 28-09-2026

Space Forge deemed Awardable for US DARPA ERIS Marketplace: Space Forge Inc which as a branch of Space Forge Ltd of Cardiff Wales UK operates from Florida s Space Coast says that its Microgravity Semiconductor Manufacturing: Enabling Extreme Performance Electronics solution has achieved Awardable status through the US Defense Advanced Research Projects Agency DARPA Expedited Research Innovation System ERIS Marketplace... 01-10-2026

SDR- Lets You Patch Together Your Setup: It is often helpful to think of a radio as a series of interconnected functional blocks hence the use of block diagrams to convey how a given radio operates. Julian Haag read… 01-10-2026

The Hidden Challenges of Edge AI Design: As models evolve faster than silicon cycles chip architects must balance flexible compute data movement and defense-in-depth security. The post The Hidden Challenges of Edge AI Design appeared first on Semiconductor Engineering… 01-10-2026

AI-Defined Vehicles Push Compute Memory And Validation Limits: The shift from software-defined to AI-defined vehicles raises questions about whether the hardware can keep up. The post AI-Defined Vehicles Push Compute Memory And Validation Limits appeared first on Semiconductor Engineering… 01-10-2026

Turning Edge AI Data Into Real-Time Action: On-device AI can deliver faster insights greater autonomy and less cloud traffic but only with the right infrastructure. The post Turning Edge AI Data Into Real-Time Action appeared first on Semiconductor Engineering… 01-10-2026

Memory At The Edge: Non-Volatile Memory Challenges And Requirements For Humanoid Robots: Distributed NVM supports high-endurance telemetry logging functional safety and time-sensitive networking where resilience is critical. The post Memory At The Edge: Non-Volatile Memory Challenges And Requirements For Humanoid Robots appeared first on Semiconductor Engineering… 01-10-2026

Open Security Foundations Are Only The Beginning: Deploying Caliptra Hardware in Production: Roots of trust are beginning to assume a broader role as platform security orchestrators. The post Open Security Foundations Are Only The Beginning: Deploying Caliptra Hardware in Production appeared first on Semiconductor Engineering… 01-10-2026

Why LLMs Are The Best Thing To Happen To Chip Design: Moving beyond RTL to a new representation that allows engineers to express intent more intuitively. The post Why LLMs Are The Best Thing To Happen To Chip Design appeared first on Semiconductor Engineering… 01-10-2026

Mitigating Threats With Pre-Silicon Security Verification: The types of threats that must be mitigated and a process to verify that designs are secure in real-world deployment. The post Mitigating Threats With Pre-Silicon Security Verification appeared first on Semiconductor Engineering… 01-10-2026

Crossing Chiplet Boundaries With PCIe Over UCIe: Observe how protocol intent becomes die-to-die activity and how link-state transitions affect transaction behavior. The post Crossing Chiplet Boundaries With PCIe Over UCIe appeared first on Semiconductor Engineering… 01-10-2026

LLM Performance And Acceleration: Part 1: Time to First Token Inter-Token Latency and how they apply to the two main stages of LLM compute. The post LLM Performance And Acceleration: Part 1 appeared first on Semiconductor Engineering… 01-10-2026

US Executive Order On Energy Grid Supply Chain Security: Compliance with trade restrictions is no longer about proving where a device was built but about how the product works. The post US Executive Order On Energy Grid Supply Chain Security appeared first on Semiconductor Engineering… 01-10-2026

Ethernet in automation: Industrial networking entering a new phase: Today s industrial networks enable communication across machines robots vision systems edge platforms and cloud applications. The post Ethernet in automation: Industrial networking entering a new phase appeared first on… 01-10-2026

DigiKey s Factory Tomorrow Season 6 Explores AI Infra Industrial Connectivity Smart Manufacturing: Season 6 of DigiKey s Factory Tomorrow series highlights how manufacturers and suppliers are building the foundation for next-gen industrial production. The post DigiKey s Factory Tomorrow Season 6 Explores AI Infra Industrial Connectivity Smart Manufacturing appeared first on EDN Asia… 01-10-2026

Optical Interconnect Scaling Becomes an Architectural Challenge: Future optical bandwidth gains will depend on combining wavelength spatial modulation and integration techniques across systems. The post Optical Interconnect Scaling Becomes an Architectural Challenge appeared first on EDN Asia… 01-10-2026

Film Capacitors For Automotive And Industrial Applications: Film capacitors for power converters inverters and charging systems can operate at high temperatures and handle electrical stress during operation. TDK has introduced the B3272 A/G/T series of DC-link film capacitors with rated DC voltages from 800 V to 1200 V and capacitance values from 1.0 µF to 60 µF. The capacitors can operate… 01-10-2026

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