Моя конференция

Специальные цены на измерители RLC Актаком АМ-3123 и АМ-3125

Вступило в действие специальное предложение на портативные измерители RLC Актаком АМ-3123 10 кГц и АМ-3125 100 кГц . До 31 декабря 2026 года данные позиции можно приобрести со скидкой 20% от розничной цены. Приборы в Госреестре СИ до 2029… 18-09-2026

Отладочный набор CRVP1502P на AMD Versal Premium с 4 400G QSFP-DD и PCIe Gen 5 от Cruetech

Cruetech анонсирует отладочный набор CRVP1502P на базе СнК из линейки AMD Versal Premium для разработки систем высокоскоростной передачи данных видеообработки… 17-09-2026

Резервный источник питания 33 кВт переключение 2 мс автономность 90 с для ИИ-серверов от Compuware Technology

Compuware Technology представила модульный резервный источник питания BBU Shelf Battery Backup Unit Shelf мощностью до 33 кВт с временем переключения на резервное питание не более 2 мс модель CBR-3332-1S1. 17-09-2026

Осциллографы Актаком серии ADS-6000 с полосой до 300 МГц

Доступны к поставке с короткими сроками двух- и четырехканальные модели цифровых осциллографов Актаком серии ADS-6000 которые могут использоваться в сфере метрологического контроля и надзора. Список моделей в новости. 15-09-2026

10.09.2026: Новинка на складе пластиковые корпуса Берлион аналоги Gainta по более выгодным ценам

Представляем новую линейку корпусов для РЭА от производителя Берлион . Изделия являются функциональными аналогами Gainta обеспечивая прямую замену без необходимости внесения изменений в конструкцию устройства а невысокая цена позволяет существенно оптимизировать бюджет закупки. Пробная партия доступна для предварительного заказа... 15-09-2026

Arm микроконтроллер для FOC-управления двигателями от Geehy

Geehy Semiconductor представила специализированный микроконтроллер управления электродвигателями G32F031 первый продукт новой платформы… 14-09-2026

Суперконденсаторы ионисторы АО Элеконд : особенности преимущества и области применения

Компания Теллур Электроникс предлагает к поставке суперконденсаторы ионисторы производства АО Элеконд одного из ведущих российских производителей конденсаторной техники. Суперконденсаторы сочетают высокую ёмкость способность отдавать большие токи и длительный срок службы. Благодаря этим характеристикам они широко применяются в системах резервного питания силовой электронике транспортных… 11-09-2026

Приглашение на выставку РАДЭЛ: Радиоэлектроника и приборостроение 2026 .

Приглашаем вас посетить стенды компании Макро Групп на ключевой отраслевой выставке РАДЭЛ: Радиоэлектроника и приборостроение 2026… 10-09-2026

Reverse Engineering A Sony Car Stereo LCD

For his own reasons Jose Luis Monteiro aka emsyscode decided he needed to drive the LCD on a Sony CDX-A250 car stereo s front panel using an Arduino. There s probably a read… 20-09-2026

A Bandpass Filter Pulls In The Signals

It s an unfortunate side effect of proximity to a large transmitter that the received signal can overload a receiver s front end even when tuned to other frequencies. Rfrht s had this read… 20-09-2026

No GPU No Problem: Flagship LLMs on a GPU-less Teenaged Server

There are lots of reasons to run LLMs locally from privacy concerns to just wanting to futz about with the technology but if you want to run the big models read… 20-09-2026

Teardown and Repair of an Insoma Water Timer

Water timers are nifty devices that can water the lawn at set times or keep that vegetable garden from turning into a dustbowl. When electronupdate timer refused to output water read… 20-09-2026

Laser Your Way into Debug Mode on the RP2350

The RP2350 is actually a pretty secure chip all things considered. It has secure boot ARMv8 s TrustZone to split secure and non-secure execution and you can permanently disable debug read… 20-09-2026

A Hotspot Becomes A Handheld

A Linux handheld computer is in theory easy and inexpensive given the availability of single-board computers but in practice the budget invariably edges well into three figures. There s an interesting read… 20-09-2026

Predicting Thermal Conductivity in Advanced BEOL Interconnect Stacks Peking University

Researchers at Peking University published a technical paper titled Predictive Structure to Thermal Conductivity Modeling Framework for BEOL Interconnect Stacks in Advanced Technology Nodes Enabled by Extensive Layer Resolved Thermal Measurements. Abstract Excerpt: The increasing structural complexity of BEOL interconnect stacks in advanced integrated circuits demands a structure-aware… 19-09-2026

Agentic AI Automates Design-Rule Repair While Preserving Layout Equivalence Purdue University

Researchers at Purdue University published a technical paper titled DRC-Aid: Design-Rule Correction via Agentic Framework utilizing Inference-Time Large Language Models. Abstract Excerpt: We present DRC-Aid a closed-loop agentic framework that automates local DRC repair by formulating it as verification-in-the-loop search. To constrain the combinatorial geometric repair space a deterministic 19-09-2026

Coreboot Hikes the Bay Trail to DRAM Initialization

This article is written on an open-source operating system but not an open-source machine the BIOS isn t open-source and even if it were supported by the coreboot project formerly read… 19-09-2026

Reinforcement Learning Cuts Routing Violations in Dense Chip Layouts NYU

Researchers at New York University published a technical paper titled Routing Dense Layouts with History-Aware Offline Reinforcement Learning using LSTM. Abstract Excerpt: Detailed routing remains a dominant runtime bottleneck in physical design due to increasing complexity of design rules. Modern routers can struggle to resolve persistent violations under dense operating conditions. While… 19-09-2026

Chiplet Co-Design Framework Reduces Energy and Design Costs for AI Accelerators University of Michigan

Researchers at the University of Michigan published a technical paper titled Fengshui: Demystifying Chiplet Ecosystem and Bespoke Neural Network Accelerator Codesign. Abstract Excerpt: This paper introduces Fengshui a chiplet ecosystem and accelerator co-design framework that jointly optimizes chiplet pool composition and bespoke application-specific integrated circuit BASIC design. Find… 19-09-2026

Open Benchmark Evaluates AI Thermal Models for 2.5D and 3D ICs UTS TU Munich ShanghaiTech

Researchers at the University of Technology Sydney ShanghaiTech University and Technical University of Munich published a technical paper titled IC-ThermBench: An Open Progressive Benchmark for Generalizable 2.5D/3D-IC Thermal Learning. Abstract Excerpt: We introduce IC-ThermBench an open and progressive benchmark that combines established 3D-IC steady-state transient and industrial… 19-09-2026

AI in Chip Design: From Code Generation to EDA Orchestration University of Edinburgh

Researchers at the University of Edinburgh published a technical perspective titled LLMs in Digital EDA: A perspective on shifting roles from Generation to Orchestration. Abstract Excerpt: In this Perspective we instead define three hierarchical roles that reveal how capability accumulates: a Generator that produces design artifacts in a single pass an Agent that refines outputs... read… 19-09-2026

Unified Chiplet Network Scales Neuromorphic Computing Systems Heidelberg University

Researchers at Heidelberg University published a technical paper titled A Unified Interconnection Network for Chiplet-Based Scaling of the BrainScaleS Neuromorphic System. Abstract Excerpt: To overcome the challenges of scaling analog designs chiplet-based designs offer a promising approach with cost and flexibility advantages over monolithic scaling. Implementing a chiplet-based BSS-2… 19-09-2026

Teaching a Robot Hand to Walk

Although it wasn t apparently designed with this in mind it seems particularly fortuitous that this walking robotic hand was released in time for Halloween. Designed by researchers from ETH Zurich read… 19-09-2026

What are Your Indispensable Software Skills

Using tools properly takes skill and this goes for software tools as well as hardware. You don t just buy a paintbrush and on day one paint the Mona Lisa. Similarly read… 19-09-2026