Технологии

Многоканальные паяльные станции Актаком доступны к поставке: Информируем о доступности поставки с короткими сроками широкого ассортимента многоканальных паяльных станций - ремонтных комплексов Актаком различного функционального назначения. 24-03-2026

Высокомощные разъёмы стандарта OCP M-CRPS от Oupiin: Компания Oupiin представила высокомощных разъёмов соответствующие стандарту OCP M-CRPS серию… 23-03-2026

Преобразователи уровня К5017ПУ от АО НЗПП Восток: Серия К5017ПУ разработанная и производимая АО НЗПП Восток представляет собой линейку современных двунаправленных преобразователей логических уровней предназначенных для согласования цифровых сигналов между микросхемами и устройствами работающими при разных напряжениях. Микросхемы позволяют безопасно и эффективно устанавливать соединения между цифровыми устройствами что критически важно… 20-03-2026

Мотореле A-MEC: A-MEC представил мотореле с возможностью переключения тока и напряжения 100 А/250 В AC MR02-100… 20-03-2026

Приглашаем на выставку ExpoElectronica 2026: Рады сообщить что компания РУ Электроникс станет участником международной выставки электроники ExpoElectronica 2026 . Ждем вас с 14 по 16 апреля в Москве на крупнейшем отраслевом событии в России и ЕАЭС чтобы обсудить новинки текущие проекты и перспективы сотрудничества. Выставка пройдет в Москве в МВЦ Крокус Экспо . Получить билет на выставку. Что ждет вас на выставке ExpoElectronica … 19-03-2026

SDR модули CR-P401D и CR-P501D от Cruetech: Компания Макро Групп предлагает SDR модули от бренда Cruetech CR-P401D… 18-03-2026

SDR модули CR-P401D и CR-P501D от Cruetech: Компания Макро Групп предлагает SDR модули на базе СнК Zynq MP-SOC от бренда Cruetech CR-P401D… 18-03-2026

DIASOM на выставке АВТОМАТИЗАЦИЯ. ЭЛЕКТРОНИКА. ЭЛЕКТРОТЕХ. СВЕТ: DIASOM представил свою продукцию на международной выставке АВТОМАТИЗАЦИЯ. ЭЛЕКТРОНИКА. ЭЛЕКТРОТЕХ. СВЕТ 17 19 марта 2026 года в Минске. 17-03-2026

Get the Gadget Master newsletter: Ensure you receive the latest and greatest Gadget Master posts hot and fresh straight into your inbox The post Get the Gadget Master newsletter appeared first on Electronics Weekly… 24-03-2026

Direct Pressure Advance Measurement For Fast Calibration: Some people love fiddling with their 3D printers others love printing. Some fiddle so they can spend more time printing which is probably where this latest project comes in: an read… 24-03-2026

433 MHz RF Signal Strength Detector: The 433 MHz RF Signal Strength Detector is a circuit designed to sense and measure the intensity of radio frequency signals in the 433 MHz ISM band. This band is commonly used by devices such as wireless modules e.g. HC-12 RF remote controls wireless doorbells and IoT transmitters. The circuit explained in this documentation… 24-03-2026

OXIDE and Vexlum partner on high-power deep UV lasers for quantum computing and semiconductor manufacturing: OXIDE Corp of Yamanashi Japan which specializes in optical crystals and frequency-conversion technology and Finland-based laser developer and manufacturer Vexlum which was spun off from Tampere University of Technology s Optoelectronics Research Centre in 2017 have officially entered into a strategic partnership agreement. The collaboration focuses on the development and manufacturing… 24-03-2026

XR Brings Humans and Robots Closer on the Factory Floor: European project MASTER is turning immersive tech into a tool for sophisticated and safe human-robot teamwork in warehouses. The post XR Brings Humans and Robots Closer on the Factory Floor appeared first on EE Times… 24-03-2026

B. Tech Intern At General Electric In Bengaluru: APPLY HERE Location: Bengaluru Company: General Electric As a Research Intern you will be working with scientists in GE Aerospace Research to develop search and recommendation systems to improve the productivity of our Engineering teams. Your responsibilities will include developing and implementing algorithms to process Aerospace domain data for recommendation systems design experiments… 24-03-2026

Superconducting Chips Enable Portable Terahertz Imaging Applications: A new chip uses terahertz waves to explore materials in ways not possible before hinting at advancements in science healthcare and security research. The researchers from the University of Glasgow the University of Tsukuba and Japan s National Institute of Advanced Industrial Science and Technology have developed the lightweight superconducting chip which they claim could… 24-03-2026

Disposable Vape Becomes Breath-Activated Synth: Makers and hardware hackers have been collecting disposable vapes for some time now usually to salvage their batteries or the unique displays many models now come with. But you can read… 24-03-2026

GiantEye Enables High-Resolution Computer Tomography of Massive Objects: A new high-energy CT system allows detailed inspection of large objects enabling non-destructive testing of complex components while maintaining their original orientation and structure. Non-destructive testing NDT allows engineers to inspect objects without opening or dismantling them. Traditionally only items that fit inside conventional scanners could be analysed limiting testing… 24-03-2026

Demystifying 3D ICs: A practical framework for heterogeneous integration: The move toward 3D ICs and heterogeneous integration overcomes limitations of 2D scaling by integrating multiple specialized chiplets. The post Demystifying 3D ICs: A practical framework for heterogeneous integration appeared first on… 24-03-2026

2D Oxyhalides Revolutionize Semiconductor Chip Manufacturing: A surprising ultrathin material is challenging long-standing limits in chip fabrication hinting at a new way to shape nanoscale circuits with greater precision and resilience. An international team of researchers led by Saptarshi Das Ackley Professor at Pennsylvania State University has reported a new approach to semiconductor patterning using an atomically thin material chromium oxychloride 24-03-2026

Chip Industry Technical Paper Roundup: Mar. 24: Natural-language chip design automotive semiconductor risk assessment wafer-on-wafer hybrid bonding rad-hard NAND neuromorphic computing monolithic 3D DRAM ECC-aware chiplet interconnects AI system validation with digital twins. The post Chip Industry Technical Paper Roundup: Mar. 24 appeared first on Semiconductor Engineering… 24-03-2026

Research Bits: Mar. 24: Dual-modulated transistor graphene FET biosensors more robust printed transistors. The post Research Bits: Mar. 24 appeared first on Semiconductor Engineering… 24-03-2026

GaN system for smaller chargers: A new GaN approach changes power design cuts size and heat supports higher output and points to smaller chargers and wider use across devices. Renesas has introduced a GaN-based Half-Wave LLC platform for AC/DC and power adapters targeting designs from 500W and above. The platform supports compact power systems and helps move beyond… 24-03-2026

Alibaba launches 5nm RISC-V CPU for inference: Alibaba s research arm Damo Academy has launched a RISC-V based CPU for AI inference which can be customised to a user s workload and is claimed to be the highest-performing RISC-V ... The post Alibaba launches 5nm RISC-V CPU for inference appeared first on Electronics Weekly… 24-03-2026

Foundry capacity underutilised but revenues and market share growing: Semiconductor wafer demand 12 equivalent reached 8.7 million wpm last year says Yole Group with the foundry industry earning 47% of all wafer manufacturing revenue worth 181 billion last year ... The post Foundry capacity underutilised but revenues and market share growing appeared first on Electronics Weekly… 24-03-2026