Технологии

Выставка ЭКСПОЭЛЕКТРОНИКА 2026 в Крокус Экспо 14-16 Апреля 2026

Компания РАДИОТЕХ примет участие в 28-й Международной выставке электроники ExpoElectronica 2026 которая пройдёт с 14 по 16 апреля 2026 года в Московском выставочном центре Крокус Экспо Павильон 3 . На стенде компании посетители выставки смогут: - Ознакомиться с новинками поставляемой продукции - Получить консультации технических специалистов по подбору компонентов для различных... 16-02-2026

Процессор для AIoT применения от Rockchip

Процессор для AIoT RK3562 от Rockchip получил награду Продукт с выдающимися рыночными показателями… 16-02-2026

Дешевле до 50% Монтажные наконечники для паяльных станций Актаком

Снижаем цены до 50% на самые популярные модели наконечников и наконечников-картриджей применяемых в монтажных паяльных станциях Актаком. 13-02-2026

Процессорные модули Jetson NVIDIA в каталоге Макро Групп

Макро Групп анонсирует начало поставок процессорных модулей NVIDIA… 12-02-2026

Популярные модели токовых клещей Актаком серии АТК

Предлагаем уникальные модели токовых клещей Актаком серии АТК которые долгие годы пользуются повышенной популярностью у профессионалов в области энергетики. Готовы к поставке токоизмерительные клещи -ваттметр АТК-2200 до 1200 кВт универсальная модель АТК-2250 до 2500 А микротоковые клещи АТК-2001 а также токовые клещи с гибким магнитопроводом АТК-2011 и АТК-2012 10-02-2026

Приглашаем посетить наш стенд на ТБ Форум-2026

Компания Макро ЕМС приглашает посетить выставку в рамках международного форума Технологии и безопасность 2026 в Москве. 10-02-2026

Неохлаждаемый инфракрасный модуль с разрешением 1280 1024 от InfiRay

Компания InfiRay анонсировала компактный неохлаждаемый инфракрасный модуль с разрешением 1280 1024 предназначенный для интеграции в современные оптико-электронные системы … 05-02-2026

Наконечники для термофенов паяльных станций Актаком дешевле до 69%

До 69% снижены цены на практически всю номенклатуру сопел для пайки горячим воздухом термофенов паяльных станций и ремонтных центров с термовоздушных каналом 04-02-2026

EXAIR introduces Intellistat static eliminator

The patented Intellistat is EXAIR s latest static elimination device. It is designed to use minimal compressed air while providing controlled blow-off and effective static decay. The Intellistat is rated ISO 14644-1 Class 5 for cleanroom environments. It produces ionized airflow to help remove dust and reduce static charges during production. Made from static-dissipative polycarbonate the … 18-02-2026

First Automotive Microcontroller With AI Acceleration 

A microcontroller runs AI in the vehicle supports real time tasks combines functions in one unit and reduces hardware and wiring. Software-defined vehicles need more computing power at the edge. STMicroelectronics has introduced Stellar P3E its first automotive microcontroller with built-in AI acceleration. The device is designed to handle real-time AI tasks inside vehicles… 18-02-2026

Wi-Fi 7 Moves To The IoT

What s behind the widespread adoption of extremely high-throughput wireless. The post Wi-Fi 7 Moves To The IoT appeared first on Semiconductor Engineering… 18-02-2026

Small Power Chips For Cars

Smaller stronger and built for tough car systems these power devices promise better performance reliable mounting and space savings. ROHM has expanded its lineup of low-voltage 40V/60V MOSFETs for automotive applications by introducing new products that adopt the HPLF5060 package. These devices are designed for use in main inverter control circuits electric pumps … 18-02-2026

Blog Review: Feb. 18

Agentic disruption data center PUE scaling AI RTOS dropping toast. The post Blog Review: Feb. 18 appeared first on Semiconductor Engineering… 18-02-2026

Router-in-a-Package Design Combining HBM4 Chiplets and In-Package Optics Technion Berkeley UCSD

A new technical paper Scaling Routers with In-Package Optics and High-Bandwidth Memories was posted by researchers at Technion UC Berkeley and UC San Diego. Abstract This paper aims to apply two major scaling transformations from the computing packaging industry to internet routers: the heterogeneous integration of high-bandwidth memories HBMs and chiplets as well as in-package... read… 18-02-2026

Measuring Current Flow In High Power Installations

Designed for electrical diagnostics the clampmeter combines wide current ranges voltage measurement and transient capture in a compact portable unit. KUSAM-MECO has introduced the KM 9999A a 1000A AC/DC digital clampmeter with inrush current measurement designed for electrical testing across industrial and commercial applications. The instrument features a 6000-count LCD display a 42… 18-02-2026

Securing The External RF Connections

Built on RG 316 coaxial cable the cable assemblies can bridge internal MMCX ports with panel mounted IP67 connectors in exposed or vehicular installations. Amphenol RF has expanded its cable assembly portfolio with the addition of new MMCX straight and right angle plug assemblies aimed at wireless communication modules. The new options are built… 18-02-2026

AI in 2026: Enabling smarter more responsive systems at the edge

After years of rapid advancement in cloud centric AI training and inference the industry is reaching an edge AI tipping point. The post AI in 2026: Enabling smarter more responsive systems at the edge appeared first on… 18-02-2026

Automotive Shunt ICs For Voltage Stability

Designed for inverter and battery management platforms the shunt reference architecture supports consistent A to D conversion across varying thermal environments. ABLIC has introduced the S-19760/1 Series automotive shunt reference ICs designed to deliver highly stable and accurate reference voltages for vehicle electronics. The device can achieve 0.1% output voltage accuracy and an output… 18-02-2026

3nm TCAM Architecture For Automotive SoCs

The shrunken TCAM design can bring configurable macros staged search logic and safety partitioning within automotive focused system-on-chip environments. Renesas Electronics Corporation has developed a configurable ternary content-addressable memory TCAM   built on a 3 nm FinFET process combining high memory density low power consumption and enhanced functional safety for automotive… 18-02-2026

Nvidia sells the last of its stake in Arm

Nvidia has sold off the last of its stake in Arm In 2024 Nvidia had  1.96 million Arm shares worth approximately   280 million. In February 2025 Nvidia reduced its holding ... The post Nvidia sells the last of its stake in Arm appeared first on Electronics Weekly… 18-02-2026

Globalfoundries and Renesas hook up for fab

GlobalFoundries and Renesas have announced an expanded strategic collaboration through a multi billion-dollar manufacturing partnership that broadens Renesas access to GF technologies. Under this partnership Renesas will gain further access to ... The post Globalfoundries and Renesas hook up for fab appeared first on Electronics Weekly… 18-02-2026

Imec s record -breaking ADC

Imec has unveiled a 7 bit 175GS/s ADC that combines a record-small footprint 250 x 250µm and low conversion energy with one of the fastest sampling speeds ever reported. As such ... The post Imec s record -breaking ADC appeared first on Electronics Weekly… 18-02-2026

ams OSRAM s OSP to become international standard

OSP the Open System Protocol developed by ams OSRAM for dynamic lighting and intelligent vehicle networks is on its way to becoming an international standard. ISO s Technical Committee TC 22 ... The post ams OSRAM s OSP to become international standard appeared first on Electronics Weekly… 18-02-2026

Mouser signs ic-Haus

Mouser  has signed a distribution agreement with iC-Haus  the developer and manufacturer of ASSPs and custom chips. Among ic-Haus products are: The iC-PZ2656  a high-resolution reflective absolute encoder  is a ... The post Mouser signs ic-Haus appeared first on Electronics Weekly… 18-02-2026