Программируемая логика и ЦОС

МиГ-29, 1977 год

Распродажа высоковольтных тестеров обмоток Актаком: До 31 декабря 2026 года действует специальная программа скидок на высоковольтные тестеры обмоток. С выгодой 15% можно приобрести популярные модели высоковольтных тестеров обмоток АМ-3083 до 3000 В и АМ-3085 до 5000… 05-10-2026

Группа Астра и ГК Макро Групп договорились о сотрудничестве в сфере встраиваемых решений: Одноплатные компьютеры PicoS и NanoS а также модули DIASOM будут работать на операционной системе Astra Linux… 02-10-2026

Группа Астра и ГК Макро Групп договорились о сотрудничестве в сфере встраиваемых решений: Одноплатные компьютеры PicoS и NanoS а также модули DIASOM будут работать на операционной системе Astra Linux… 02-10-2026

Топовые клеммные блоки Tianli на складе в Москве.: О компании Tianli: Азиатский лидер топ-уровня Компания Tianli была основана в 1998 году и за более чем 25 лет работы стала одним из ведущих азиатских производителей клеммных блоков. Штаб-квартира и производственные мощности расположены в зоне нового развития залива Ханчжоу Hangzhou Bay New Zone город Нинбо всего в 2 часах езды от Шанхая. Tianli имеет сертификаты... 02-10-2026

Срок действия акции на промышленные столы Актаком продлен: До 15 ноября 2026 года на большинство моделей промышленных столов Актаком со стандарной и антистатической ESD столешницей большинства модификаций предоставляется скидка 15% от розничной… 30-09-2026

700 Вт и 63% КПД: NEDITEK представил GaN-усилители Догерти для инфраструктуры 5G-Advanced: Компания NEDITEK объявила о выводе на международный рынок линейки высокомощных СВЧ-усилителей на основе нитрида галлия GaN выполненных по архитектуре Догерти с выходной мощностью до 700 Вт и PAE более… 29-09-2026

Новинки каталога: аналоги Analog Devices от 3PEAK RUNIC CHIPANALOG и COREBAI: Склад РУ Электроникс пополнился микросхемами от четырёх брендов: 3PEAK Inc. Jiangsu Runic Technology Co. Shanghai Chipanalog Microelectronics Co. и Corebai Microelectronics Beijing Co . Все четыре производителя выпускают функциональные аналоги компонентов Analog Devices. В поставке операционные усилители прецизионные усилители и цифровые изоляторы. Новинки на складе Поставка охватывает… 28-09-2026

Высоковольтный MOSFET 1700 В / 100 А в изолированном корпусе от AMG Power: AMG Power анонсировала выпуск N-канального MOSFET с напряжением сток-исток 1700 В и непрерывным током стока до 100 А A2G100N1700MT4i. 28-09-2026

Continuity testing in semiconductor ATE: Fundamentals and test methods: Continuity testing is the first test performed in any semiconductor test flow verifying that a device under test DUT is properly connected to automatic test equipment ATE . The post Continuity testing in semiconductor ATE: Fundamentals and test methods appeared first on… 06-10-2026

Chip Industry Technical Paper Roundup: Oct. 6: Low-contact-resistance WSe transistors backside clock meshes for 2nm GAAFETs row-parallel processing in DRAM HBF for high-throughput LLM serving formal security analysis of CAN XL abstraction and validation from physical devices to RTL. The post Chip Industry Technical Paper Roundup: Oct. 6 appeared first on Semiconductor Engineering… 06-10-2026

Advancing The CFET-Based Device Roadmap: Novel Integration Modules And Standard Cell Configurations: Part 2: Towards scalable sCFET standard cell architectures: split-gate devices a 5T 1 CFET SRAM bit cell and improved back-end-of-line routability. The post Advancing The CFET-Based Device Roadmap: Novel Integration Modules And Standard Cell Configurations appeared first on Semiconductor Engineering… 06-10-2026

Tiny Sensor Tracks Motion Along Three Axes: Can a tiny sensor track movement in three directions A nanoparticle-based design brings three-axis magnetic sensing to spaces where conventional sensors struggle. Researchers at the Korea Institute of Machinery and Materials KIMM have developed a magnetic sensor that can detect magnetic fields along the x y and z axes. The technology is designed for applications 06-10-2026

Build Your Own 4G Phone: A 4G phone lets users write software make calls send texts add hardware modules and build functions without soldering. CircuitMess a Croatian electronics kit maker is selling the MAKERphone 2.0 a build-it-yourself 4G phone that users can program in MicroPython or Arduino C and extend with plug-in hardware. The phone accepts a SIM card… 06-10-2026

AI Racks Move Towards Direct Power Conversion: As AI servers demand more power rack architectures are shifting to higher voltages. A reference design demonstrates direct conversion from 800V DC to 6V. Navitas Semiconductor and Microchip Technology have developed an 800V DC-to-6V DC reference design for AI data centre racks based on the Open Compute Project s OCP 800V DC architecture. The design… 06-10-2026

Thermal Payload Maps Earth From Space: What if satellites could map heat rather than just capture images A compact payload is set to collect temperature data from Earth s surface. Ahmedabad-based SatLeo Labs is preparing to launch TAPAS-1 a 3kg thermal-imaging payload designed to capture temperature information from Earth s surface. The payload is intended to help identify temperature variations across large… 06-10-2026

Battery IC Uses EIS To Check Cell Health: A battery monitoring IC uses EIS to check cell health detect abnormalities estimate lifetime and reduce heat during measurements. Nuvoton Technology will begin providing samples of the KA85010UA a 26-cell battery monitoring IC with built-in electrochemical impedance spectroscopy EIS . The IC uses EIS to detect changes inside battery cells for battery degradation diagnosis state-of-health… 06-10-2026

Larger Pixels Target High-Speed Vision: How can vision systems capture fast-moving objects without losing image detail A larger-pixel global shutter sensor targets demanding industrial environments. OMNIVISION has introduced a 12-megapixel backside-illuminated global shutter CMOS image sensor for factory automation and intelligent transportation systems. The OG12S10 uses 3.45-micron pixels and a global shutter architecture which… 06-10-2026

Atom-Thin Material Advances Transistor Technology: A new two-dimensional semiconductor material could address a major limitation in next-generation chip design enabling smaller transistors improved switching performance and potentially lower-power electronics. An atomically thin semiconductor made from boron carbon and nitrogen could help overcome a key challenge in developing smaller more energy-efficient transistors. The material boron… 06-10-2026

Modular Test Instrument Simplifies Circuit Debugging: A programmable electronics testing platform combines signal measurement logic analysis and waveform generation with expandable modules for customised testing and prototyping. Picotronix is a modular mixed-signal test instrument designed to help electronics engineers measure signals analyse digital circuits and generate waveforms using a single platform. Developed by Thort Werx Pty Ltd … 06-10-2026

Tiny Capacitors Stabilise Power in Compact Electronics: A miniaturised three-terminal component reduces PCB mounting area by 64% helping designers maintain stable power delivery in space-constrained high-performance electronic devices. Murata Manufacturing has started mass production of its LLD series three-terminal low-equivalent series inductance ESL multilayer ceramic capacitors MLCCs measuring just 0.6 0.3 mm. The components occupy… 06-10-2026

Flat Mirror Enables Retinal Projection in Smart Glasses: A 150-nm mirror directs laser light onto the retina while keeping smart glasses transparent and suitable for daily use. TDK Corporation has demonstrated a direct retinal projection display for smart glasses using a meta-optic mirror. The mirror is 150 nm thick uses nanoscale reflectors and can be embedded directly into a lens. The mirror… 06-10-2026

Arm vs Qualcomm episode 2: Yesterday a second trial in the Qualcomm vs Arm legal marathon opened in Delaware. It is before a jury and slated to last five days. The original Qualcomm vs Arm The post Arm vs Qualcomm episode 2 appeared first on Electronics Weekly… 06-10-2026

SkyeChip becomes Rapidus design associate: SkyeChip the Malaysian IP developer and IC design house has joined the Rapidus Collaborative Open Rapid Ecosystem as one of 17 inaugural design solution associates. SkyeChip which is listed on The post SkyeChip becomes Rapidus design associate appeared first on Electronics Weekly… 06-10-2026

MOSAIC-G integrates UK 5G tech: Aerix Antevia Networks Spry Fox Networks Noema Signal Labs Attocore RANsemi Liverpool 5G and Bath North East Somerset Council have launched MOSAIC-5G Multi-vendor Open System Architecture for Integrated Connectivity . The post MOSAIC-G integrates UK 5G tech appeared first on Electronics Weekly… 06-10-2026