Caxapa

Павел Михайлович Третьяков, 1893 год

Коннекторы до 500 C и 200 МПа для геофизического оборудования от Sunkye: Sunkye разработала специальные версии высокотемпературных соединителей для работы при температуре до… 28-05-2026

4-канальный приемопередающий модуль трансивера X-диапазона от Hisiwell: Компания Hisiwell представляет SiP-трансивер System in Package transceiver с четырьмя независимыми радиочастотными каналами X-диапазона модуль HX9X40210G20. 27-05-2026

Квантово-каскадные лазеры Фабри-Перо от Thorlabs: Компания Thorlabs анонсировала квантово-каскадный лазер Фабри-Перо… 26-05-2026

Применение высокоскоростных CAN FD трансиверов Xinluda XL1042: В автомобильной электронике и промышленной автоматизации традиционные CAN-трансиверы всё чаще становятся узким местом: они не справляются с высокоскоростной передачей CAN FD страдают от помех и перегрузок в многозвенных сетях. Трансивер Xinluda XL1042 решает эти проблемы сочетая высокую скорость надёжную защиту и гибкость применения. Микросхема полностью соответствует ISO 11898-2/5. Она работае 25-05-2026

Разъемы GX16 от RUICHI в пластиковом корпусе уже на складе: Семейство малогабаритных цилиндрических разъемов GX компании RUICHI пополнилось новыми моделями. В самом востребованном типоразмере GX 16 появились варианты в пластиковом корпусе. Это более бюджетные решения по сравнению со стандартными GX 16 M в металлическом корпусе. Кроме того они имеют существенно меньший вес в среднем 30-50% на комплект что очень важно для носимых устройств и мобильных… 22-05-2026

Акция на имульсные тестеры обмоток Актаком АМ-3085 и АМ-3083 завершается: Срок действия акции на импульсные высоковольтные тестеры обмоток Актаком подходит к завершению Только до 1 июня 2026 года можно приобрести не только АМ-3085 но и его младшего собрата АМ-3083 со скидкой… 21-05-2026

NFC-микросхема для бесконтактной идентификации от 3Think: Компания 3Think Semiconductors представила стандартную NFC-микросхему предназначенную для широкого круга приложений: розничная торговля игровая индустрия потребительская электроника … 21-05-2026

Understanding Phase Noise and Its Impact on RF System Performance: A practical introduction to phase noise concepts explaining how oscillator instability affects RF systems and how phase noise is measured analyzed and reported. What Attendees will Learn What phase noise is and why it matters Learn how real-world oscillators differ from ideal ones why short-term frequency instability arises and why phase variations typically have a much greater impact… 28-05-2026

Chiplets Ecosystems and Europe s Post-Fab Semiconductor Strategy: Can Europe realistically compete on leading-edge fabs alone Maria Marced said. No. The post Chiplets Ecosystems and Europe s Post-Fab Semiconductor Strategy appeared first on EE Times… 28-05-2026

Testing LFP Battery Failure Modes With Overcharging: As great as batteries are it s essential to understand their risks and how to keep them from going spicy. Recently there has been a bit of a fuss about the read… 28-05-2026

Taming the beast: Memory efficiency in an AI/crypto world: The careful selection of energy-efficient components like voltage regulators plays a vital role in reducing energy use of a data center. The post Taming the beast: Memory efficiency in an AI/crypto world appeared first on… 28-05-2026

Swapping Out Chiplets: I/Os Vs. Compute: Multi-die assemblies give chip architects the option to change some dies while keeping the rest of the system intact but which is best to keep The post Swapping Out Chiplets: I/Os Vs. Compute appeared first on Semiconductor Engineering… 28-05-2026

Toward Agentic Verification: Using AI agents for verifying designs holds huge potential but can it deliver And what comes next The post Toward Agentic Verification appeared first on Semiconductor Engineering… 28-05-2026

Observability Is Essential For Modern Silicon: What on-die visibility reveals and why it s especially important for AI automotive aerospace and advanced packaging. The post Observability Is Essential For Modern Silicon appeared first on Semiconductor Engineering… 28-05-2026

Automating Traditional PCB Layout Verification With Electrically Based Design Rule Checks: Going beyond traditional spacing and distance checks to incorporate signal integrity power integrity electromagnetic interference and high voltage safety rules. The post Automating Traditional PCB Layout Verification With Electrically Based Design Rule Checks appeared first on Semiconductor Engineering… 28-05-2026

Using SystemC TLM Modeling To Solve AI Data Movement Challenges: Understanding whether the interconnect can support the workload before the design reaches RTL. The post Using SystemC TLM Modeling To Solve AI Data Movement Challenges appeared first on Semiconductor Engineering… 28-05-2026

Foundation Model For Physics: The Next Layer Of Intelligence For Engineering: Making validated physics reasoning continuously available across the engineering workflow. The post Foundation Model For Physics: The Next Layer Of Intelligence For Engineering appeared first on Semiconductor Engineering… 28-05-2026

Faster Verification Debug With AI: Automate a wide range of tasks including waveform inspection logfile analysis and source code navigation. The post Faster Verification Debug With AI appeared first on Semiconductor Engineering… 28-05-2026

Wafer-Scale vs. Chiplets: The New War Part 1: The chip that broke all the rules. The post Wafer-Scale vs. Chiplets: The New War Part 1 appeared first on Semiconductor Engineering… 28-05-2026

The Shape Of Prompts: Exploring Their Effect On Inference Infrastructure: Aligning GPU memory storage and network resources in a balanced and efficient configuration. The post The Shape Of Prompts: Exploring Their Effect On Inference Infrastructure appeared first on Semiconductor Engineering… 28-05-2026

A Scalable Answer To Advanced-Node Characterization: The growing pain no library team can ignore. The post A Scalable Answer To Advanced-Node Characterization appeared first on Semiconductor Engineering… 28-05-2026

Chip Cooling Technique for AI: A new in-package cooling innovation tackles rising heat challenges in 3D-stacked memory chips improving thermal efficiency and stability for AI workloads while enabling higher bandwidth and denser chip architectures. As AI workloads push memory systems to their performance limits thermal management is emerging as a critical bottleneck in next-generation chip design. SK hynix… 28-05-2026

Space AI Compute Advancement: AI computing platform is pushing edge intelligence into orbit enabling real-time onboard data processing for satellites reducing latency and enhancing autonomous decision-making in harsh space environments. A new space-focused AI computing architecture is advancing onboard intelligence for satellites and orbital systems enabling high-performance processing directly in space rather than… 28-05-2026

Моя конференция