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Кастомизированный шлейф для подключения к OrangePi 5: Кастомизированный шлейф который позволяет подключить наши модули DS-CIMX напрямую к платформе OrangePi… 05-05-2026

SDR модуль CR-P151Q от Cruetech: SDR модуль на СнК AMD XCZU15EG-2FFVB1156I - CR-P151Q под брендом… 04-05-2026

Совместимость модуля DS-RK3568 от Диасом с российской операционный системой РЕД ОС: Подтвердили совместимость DS-RK3568 с операционной системой РЕД… 28-04-2026

Модули широкополосных источников света от Box Optronics: Компания Box Optronics запустила серийные поставки модулей широкополосных источников света BSLD-840-7SM-FA-M. 28-04-2026

Выгодное предложение Cнижение цен на импульсные источники питания Актаком: Сообщаем о значительном снижении цен на популярные модели импульсных источников питания Актаком APS-5310 30 В/10 А и APS-3020 30 В/20… 27-04-2026

Радифотоника от Cruetech. Оптоэлектронный модуль 10-100 МГц: Оптоэлектронный модуль 10 100 МГц Cruetech состоит из передатчика и приёмника. 23-04-2026

Скидка 15% на имульсные тестеры обмоток Актаком АМ-3085 и АМ-3083: Акция на импульсные высоковольтные тестеры обмоток Актаком продлена До 1 июня 2026 года со скидкой 15% можно приобрести не только АМ-3085 но и его младшего собрата -АМ-3083. 22-04-2026

Hardware Design Power Electronics Internship At Emiant Innovations In Vadodara: APPLY HERE ON LINKEDIN Location: Vadodara Company: Emiant Innovations Pvt Ltd What You ll Do Must-Have Good-to-Have Not Mandatory Why Join a Startup Who Should Apply Stipend: INR 10 000-12 000 per month Eligibility 06-05-2026

SiTime TCXO enhances GPUs: SiTime is sampling the Elite 2 Super-TCXO which aims to increase GPU utilisation and improve compute efficiency in AI datacentres by delivering better time synchronisation. The chip targets a 1.5 ... The post SiTime TCXO enhances GPUs appeared first on Electronics Weekly… 06-05-2026

Two tape-outs for Weebit ReRAM: Weebit Nano says that two of its customers have taped out SoCs using its ReRAM IP and one customer has a prototype already manufactured and functional.. Overlord Labs has integrated ... The post Two tape-outs for Weebit ReRAM appeared first on Electronics Weekly… 06-05-2026

1-cell Li-ion battery protection IC in a WLCSP package.: Nisshinbo Micro Devices has brought out 1-cell Li-ion battery protection ICs in a WLCSP package. The NB7130 is equipped with all standard safety features such as overcharge/over-discharge voltage charge/discharge overcurrent ... The post 1-cell Li-ion battery protection IC in a WLCSP package. appeared first on Electronics Weekly… 06-05-2026

Sensor Software Speeds IMU Development: A new evaluation platform streamlines inertial sensor design with AI-driven analytics real-time visualisation and automated workflows cutting complexity and accelerating time-to-market for next-generation smart and connected devices. A new software evaluation platform from TDK Corporation is aiming to simplify and accelerate inertial sensor development by bringing analytics visualization … 06-05-2026

Ionogel Material Redefines Soft Electronics Durability: A new ionogel combines extreme strength with skin-like softness enabling durable wearable electronics that can withstand heavy loads while maintaining flexibility for biomedical sensing and next-generation electronic applications. A research team led by Professor Lizhi Xu from the Department of Mechanical Engineering under the Faculty of Engineering at the University of Hong Kong HKU… 06-05-2026

Using Hamster Power to Charge a Phone: It seems fair to say that hamsters are a somewhat divisive pet between their fluffiness high-strung nature short lifespan and incessant squeaking that sounds like some electronic device is trying read… 06-05-2026

AI Will Not replace Engineers But It Will Remove Their Repetitive Work - Suresh Kumar Muthusamy Zettaone Technologies: PCB design has moved beyond component placement. AI now generates symbols footprints and translates designs across multiple CAD tools automatically. Nidhi Agarwal and Saba Aafreen from EFY speak with Suresh Kumar Muthusamy of Zettaone Technologies to explore the technology strategy and vision behind PCBPartz a platform redefining PCB design workflows and automation. Q. What… 06-05-2026

SiGe Chip Hits 500Gbps Barrier: A silicon-germanium chip reaches 500Gbps data speeds redefining high-frequency performance and signalling a major shift for next-generation electronics high-speed interconnects and data-intensive computing infrastructure worldwide. A silicon-germanium SiGe chip has achieved a record-breaking 500Gbps data transmission speed setting a new benchmark for high-frequency semiconductor performance. 06-05-2026

Earthworms Don t Bio-Accumulate Microplastics So There May be Hope For Us: Microplastics absolutely saturate the Earth s environment and that s probably not a good thing unless you re looking for a sediment marker for the Anthropocene period. On the other hand environmental contamination read… 06-05-2026

Top Ten Lenders To Datacentre Companies: Thanks to TMT Finance for this one the ten biggest lenders to datacentre companies last year: Sumitomo Mitsui Banking Corporation SMBC Mitsubishi UFG Bank MUFG J.P. Morgan Morgan Stanley ... The post Top Ten Lenders To Datacentre Companies appeared first on Electronics Weekly… 06-05-2026

Defeating the Works By Design s Unpickable Lock: Even though the very concept of an unpickable lock is as plausible as making water not be wet this doesn t take away from the intellectual thrill of devising solutions to read… 06-05-2026

A Detailed Evaluation of A Production Server With High-End MRDIMM Main Memory BSC Micron Intel UPC: A new technical paper Performance and Energy Benefits of MRDIMMs was published by researchers at Barcelona Supercomputing Center Universitat Politecnica de Catalunya Micron and Intel Corporation. Abstract Multiplexed Rank DIMMs MRDIMMs have recently emerged as memory devices that enable higher bandwidth without increasing DRAM chip frequencies. This paper presents a detailed performance 06-05-2026

GPU Power Prediction Tool for AI Workloads MIT IBM: A new technical paper EnergAIzer: Fast and Accurate GPU Power Estimation Framework for AI Workloads was published by researchers at MIT and IBM Research. Abstract As AI workloads drive increases in datacenter power consumption accurate GPU power estimation is critical for proactive power management. However existing power models face a scalability bottleneck not in the... read more… 05-05-2026

Pre-Silicon Verification and Validation Methodology Targeting Robust RISC-V Chip Designs BSC: A new technical paper Verification and Validation V V -in-the-Loop for RISC-V Design: The Holistic Vision of BZL was published by researchers at Barcelona Supercomputing Center. Abstract The Barcelona Zetascale Lab BZL project aims to strengthening Europe s capacity in the design and manufacture of RISC-V based high-performance computing chips. In this context we present a holistic… 05-05-2026

Foundry-Compatible Grating Couplers Using an Inverse Design Framework Yale: A new technical paper Multimode grating couplers via foundry-compliant inverse design was published by researchers at Yale University. Abstract We apply a systematic inverse design approach to discover foundry-compliant multilayer grating couplers that can efficiently couple a number of independent waves from free space to on-chip propagating modes. For visible- and near-infrared couplers… 05-05-2026

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