Caxapa

Изменение компонентной базы шести оптических трансиверов APAC Opto: APAC Opto переводит шесть моделей оптических трансиверов на микросхему Semtech GN25L95 которая выполняет функции драйвера лазера и усилителя приёмника. 21-10-2026

1700 В 200 А 13 мОм паразитная индуктивность 20 нГн: трехфазный SiC MOSFET-модуль от AMG POWER: AMG POWER представил трехфазный SiC MOSFET-модуль на 1700 В и 200 А с сопротивлением сток-исток в открытом состоянии 13 мОм и паразитной индуктивностью 20 нГн A3G200N1700MEK6F. 20-10-2026

1700 В 200 А 13 мОм паразитная индуктивность 20 нГн: трехфазный SiC MOSFET-модуль от AMG POWER: AMG POWER представил трехфазный SiC MOSFET-модуль на 1700 В и 200 А с сопротивлением сток-исток в открытом состоянии 13 мОм и паразитной индуктивностью 20 нГн A3G200N1700MEK6F. 20-10-2026

20.10.2026: Новое поступление электронных компонентов KLS: Рады сообщить о поступлении на склад новой партии электронных компонентов производства KLS ведущего китайского производителя электронных компонентов. Продукция доступна для отгрузки со склада в Москве с 20.10.2026. В данной поставке представлены следующие компоненты: Полупроводники и диоды KLS: Диоды BAV99 более 1 5 млн шт. RS1M транзисторы BC817-40 защитные диоды SMBJ36CA SMCJ33A диоды.. 20-10-2026

Микроконтроллеры для оптических модулей от GigaDevice: igaDevice представила две серии микроконтроллеров для управления оптическими модулями: GD32E512 с тактовой частотой до 120 МГц и GD32E252 для низкоскоростных и промышленных применений. 19-10-2026

eMMC Cruetech: стабильные поставки и запас компонентов в условиях нестабильного рынка: Cruetech предлагает eMMC ёмкостью от 4 до 64 ГБ на базе NAND Flash памяти с ячейками MLC… 16-10-2026

Снижение цен на промышленные столы и тумбочки Актаком: На 15% снижены цены на большинство моделей промышленных столов Актаком со стандарной и антистатической ESD столешницей всех модификаций а также тумбочки Актаком. 15-10-2026

Фемтосекундные лазеры с длиной волны 1030 и 515 нм и мощностью до 20 Вт от JPT: Компания JPT представила фемтосекундные лазеры со средней выходной мощностью до 20 Вт длиной волны 1030 и 515 нм и пассивным воздушным охлаждением: Jetlit 20 IR и Jetlit… 14-10-2026

How Goodram Validates DRAM and SSD Reliability in Europe: Explore Goodram s European approach to DRAM and SSD testing from burn-in to platform validation for reliable industrial and embedded systems. The post How Goodram Validates DRAM and SSD Reliability in Europe appeared first on EE Times… 22-10-2026

Hacking a network switch for management enhancements: Interim steps to the end destination are often wise. And non-bleeding-edge gear can be made wiser in the process too. The post Hacking a network switch for management enhancements appeared first on… 22-10-2026

Why embedded engineering is becoming a bottleneck for industrial automation: Industrial automation is increasingly becoming a strategic priority for manufacturers with robotics AI and connected production systems promising productivity flexibility and resilience writes Payam Pajoohi of PHYTEC. Despite this adopting The post Why embedded engineering is becoming a bottleneck for industrial automation appeared first on Electronics Weekly… 22-10-2026

Floating-Point Addition and Subtraction on Intel s 8087: Although you can do basic floating point format operations like addition and subtraction just fine on any CPU having specialized hardware for it can provide a significant speed boost. Here read… 22-10-2026

Everspin Expands MRAM Push into AI Servers Data Centers Satellite Systems: In an exclusive interview Everspin CEO Sanjeev Aggarwal discusses MRAM opportunities amid NOR flash supply constraints. The post Everspin Expands MRAM Push into AI Servers Data Centers Satellite Systems appeared first on EE Times… 22-10-2026

Trying to Get Linux Running on a Nokia E6: The Nokia E6 is a smartphone from back in the old days when Symbian was a thing. fluffleswaffled has been doing the work to get the ancient handset running Linux read… 22-10-2026

Temperature Sensors: TDK presents robust and easy-to-mount NTC systems for demanding industrial applications with voltages up to 4000 V: TDK Corporation announces the expansion of its NTC temperature sensor portfolio with the M704 ordering code: B57704M0103A001 and M705 ordering code: B57705M0103A001 series engineered for reliable temperature measurement in high-voltage environments. 22-10-2026

Beyond The EPE Budget: Building The Next Generation Of Computational Lithography: Why better models richer metrology explainable AI and cross-industry collaboration must come together to extend semiconductor scaling. The post Beyond The EPE Budget: Building The Next Generation Of Computational Lithography appeared first on Semiconductor Engineering… 22-10-2026

PVTW: Extending Silicon Characterization From PVT To Real-World Workload: Two devices operating at exactly the same voltage frequency and temperature can behave differently depending on what they are being asked to do. The post PVTW: Extending Silicon Characterization From PVT To Real-World Workload appeared first on Semiconductor Engineering… 22-10-2026

Chip Scaling Moves Beyond The Transistor: SEMICON West 2026: Advanced packaging photonics test and AI are increasingly intertwined very different conversations ahead. The post Chip Scaling Moves Beyond The Transistor appeared first on Semiconductor Engineering… 22-10-2026

How Self-Aligned CFET Technology Could Extend CMOS Scaling Beyond 10: A process sequence for SRAM and logic that delivers higher performance through larger effective channel width and improved electrostatics at smaller nodes. The post How Self-Aligned CFET Technology Could Extend CMOS Scaling Beyond 10 appeared first on Semiconductor Engineering… 22-10-2026

Stacked-Die Multi-Chip Architectures: The Tradeoff Between Scaling And Power Delivery: Integrated voltage regulators reduce current density provide higher regulation bandwidth and reduce reliance on large decoupling capacitor networks. The post Stacked-Die Multi-Chip Architectures: The Tradeoff Between Scaling And Power Delivery appeared first on Semiconductor Engineering… 22-10-2026

What Breaks When Packaging Moves From Wafer To Panel: Engineers are discovering many things they thought were process assumptions were actually wafer assumptions. The post What Breaks When Packaging Moves From Wafer To Panel appeared first on Semiconductor Engineering… 22-10-2026

Foundries And OSATs Increasingly Overlap: Advanced packaging growth and capacity constraints are pushing more onto OSATs. The post Foundries And OSATs Increasingly Overlap appeared first on Semiconductor Engineering… 22-10-2026

Hydrogen truck for Dakar Rally: Toyota is to enter a hydrogen-powered truck pictured with driver Dania Akeel in the January 2027 Dakar Rally. The truck is a hydrogen fuel cell version of the ICE Hilux The post Hydrogen truck for Dakar Rally appeared first on Electronics Weekly… 22-10-2026

Flapping Airplanes raises 1bn: Flapping Airplanes a one year-old San Francisco AI neolab has raised 1 billion at a 6 billion valuation before it has put a product on the market. Neolab denotes an The post Flapping Airplanes raises 1bn appeared first on Electronics Weekly… 22-10-2026

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