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«Дружба» «Дружба», 1964 год
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UNIX UNIX , 1973 год
Снижение цен на промышленные столы и тумбочки Актаком Снижение цен на промышленные столы и тумбочки Актаком
На 15% снижены цены на большинство моделей промышленных столов Актаком со стандарной и антистатической ESD столешницей всех модификаций а также тумбочки Актаком. 15-10-2026
Фемтосекундные лазеры с длиной волны 1030 и 515 нм и мощностью до 20 Вт от JPT
Компания JPT представила фемтосекундные лазеры со средней выходной мощностью до 20 Вт длиной волны 1030 и 515 нм и пассивным воздушным охлаждением: Jetlit 20 IR и Jetlit… 14-10-2026
Плата распределения питания до 4000 Вт с пятью разъёмами 12V-2x6 для ИИ-серверов от Compuware
Compuware Technology представила плату распределения питания мощностью до 4000 Вт с пятью разъёмами 12V-2x6 для серверов искусственного интеллекта CPR-4021-2H3. 13-10-2026
Программируемые электронные нагрузки серии АТН-8ххх доступны к поставке Программируемые электронные нагрузки серии АТН-8ххх доступны к поставке
Доступны к поставке программируемые электронные нагрузки Актаком постоянного тока мощностью от 200 до 3600 Вт c максимальным входным током до 480 А и напряжением до 500 В. Приборы включены в Государственный реестр средств измерений за номером… 12-10-2026
Блок питания 5 5 кВт с сертификацией 80 PLUS Ruby для ИИ-серверов от Compuware
Компания Compuware Technology представила серверный блок питания мощностью 5 5 кВт с сертификацией 80 PLUS Ruby CPR-5521-2M1. 07-10-2026
Полупроводниковый оптический усилитель 1064 нм усиление 13 дБ выходная мощность до 10 дБм от FIBERT
FIBERT представляет полупроводниковый оптический усилитель SOA на длину волны 1064 нм с малосигнальным усилением 13 дБ и выходной мощностью до 10 дБм серия FBRT-PISOA. 06-10-2026
Распродажа высоковольтных тестеров обмоток Актаком Распродажа высоковольтных тестеров обмоток Актаком
До 31 декабря 2026 года действует специальная программа скидок на высоковольтные тестеры обмоток. С выгодой 15% можно приобрести популярные модели высоковольтных тестеров обмоток АМ-3083 до 3000 В и АМ-3085 до 5000… 05-10-2026
HEADS UP - Dstl trialling safe usage of head-mounted military technology
The UK s Defence Science and Technology Laboratory Dstl has been trialling in a HEADS UP project a human-centred design approach to novel technologies that are worn or carried. The post HEADS UP Dstl trialling safe usage of head-mounted military technology appeared first on Electronics Weekly… 15-10-2026
Beyond software patching: how CHERI can limit the blast radius in long-life CNI systems
Critical National Infrastructure CNI products may remain in service for 10 or even 20 years. During that time software changes attack techniques evolve and regulation becomes more demanding writes Jim The post Beyond software patching: how CHERI can limit the blast radius in long-life CNI systems appeared first on Electronics Weekly… 15-10-2026
A Thermal Camera That Uses WebUSB A Thermal Camera That Uses WebUSB
When creating a peripheral for a mobile phone an obvious path is to create a companion app with which to talk to it. But as we all know today s app read… 15-10-2026
Small Volumes Big Impact: Europe s Hidden Role in Advanced Chipmaking
A Fraunhofer IMS Nanofabrication partnership illustrates how Europe s low-volume semiconductor manufacturing can support the world s most advanced chipmaking. The post Small Volumes Big Impact: Europe s Hidden Role in Advanced Chipmaking appeared first on EE Times… 15-10-2026
TSMC has 47bn revenue Q3
TSMC reported  Q3 revenues up 41.2% YoY and 17.2% QoQ at 46.72 billion Gross margin for the quarter was 66.4% operating margin was 58.7% and net profit margin was 51.1%. The post TSMC has 47bn revenue Q3 appeared first on Electronics Weekly… 15-10-2026
UK Space Agency backs UK ADR mission for space debris removal
The UK Space Agency UKSA is backing an Active Debris Removal ADR mission to remove two defunct satellites and release them lower into the atmosphere where they will naturally burn The post UK Space Agency backs UK ADR mission for space debris removal appeared first on Electronics Weekly… 15-10-2026
onsemi s EliteSiC hybrid power module technology used in Sungrow s PowerTitan 3.0 energy storage platform
Intelligent power and sensing technology firm onsemi of Scottsdale AZ USA says that its latest EliteSiC silicon carbide SiC hybrid power module technology has been adopted by renewable energy technology firm Sungrow for its PowerTitan 3.0 energy storage platform. The integration enables improved efficiency and enhanced system performance for utility-scale battery energy storage systems BESS… 15-10-2026
Microchip adds radiation-tolerant GaN point-of-load converter to space power portfolio
Microchip Technology Inc of Chandler AZ USA has launched the POL-05-20S-T a radiation-tolerant point-of-load POL converter designed to address the demanding power requirements of space processing applications. The new device uses gallium nitride GaN power devices to deliver up to 20A of output current with high efficiency and power… 15-10-2026
Building An M7 Pan Tilt Head Controller Building An M7 Pan Tilt Head Controller
The Soonpho M7 Pan Tilt Head is a useful photography tool for remotely aiming a decently-sized camera. Only Kyle Housley wanted a little more control than was available out of read… 15-10-2026
Grid Modernization s Hidden Cost: A Growing Attack Surface Few Are Watching
Grid modernization is expanding the energy sector s cyberattack surface while limited visibility across IT and OT networks leaves connected assets exposed. The post Grid Modernization s Hidden Cost: A Growing Attack Surface Few Are Watching appeared first on EE Times… 15-10-2026
Beyond The Specification: What Really Determines PCIe Retimer Reach
Multiple interacting factors span silicon design controller intelligence channel quality and the transmission medium itself. The post Beyond The Specification: What Really Determines PCIe Retimer Reach appeared first on Semiconductor Engineering… 15-10-2026
Strengthening Advanced-Node Interconnects Through Automated Via Insertion
Short-resilient via insertion improves reliability and performance. The post Strengthening Advanced-Node Interconnects Through Automated Via Insertion appeared first on Semiconductor Engineering… 15-10-2026
Building AI Infrastructure For Greater Choice And Flexibility
Open interfaces and interoperability allow designers to choose technologies based on the needs of the system. The post Building AI Infrastructure For Greater Choice And Flexibility appeared first on Semiconductor Engineering… 15-10-2026
AMBA C2C: Moving Forward With A Converged AMBA Foundation For C2C Connectivity
Extending chiplet connectivity across AXI and CHI with scalable protocol subsets interoperability and flexible transport support. The post AMBA C2C: Moving Forward With A Converged AMBA Foundation For C2C Connectivity appeared first on Semiconductor Engineering… 15-10-2026
Why Open-Weight AI Matters
Proprietary models still hold the edge but open-weight models add more flexibility for deploying AI. The post Why Open-Weight AI Matters appeared first on Semiconductor Engineering… 15-10-2026
Agentic AI Alters The CPU-GPU Balance
Agentic workloads increase CPU demand while reasoning models MoE architectures and reservoir computing fuel AI acceleration. The post Agentic AI Alters The CPU-GPU Balance appeared first on Semiconductor Engineering… 15-10-2026