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Выставка ЭКСПОЭЛЕКТРОНИКА 2026 в Крокус Экспо 14-16 Апреля 2026
Компания РАДИОТЕХ примет участие в 28-й Международной выставке электроники ExpoElectronica 2026 которая пройдёт с 14 по 16 апреля 2026 года в Московском выставочном центре Крокус Экспо Павильон 3 . На стенде компании посетители выставки смогут: - Ознакомиться с новинками поставляемой продукции - Получить консультации технических специалистов по подбору компонентов для различных... 16-02-2026
Процессор для AIoT применения от Rockchip
Процессор для AIoT RK3562 от Rockchip получил награду Продукт с выдающимися рыночными показателями… 16-02-2026
Дешевле до 50%  Монтажные наконечники для паяльных станций Актаком Дешевле до 50% Монтажные наконечники для паяльных станций Актаком
Снижаем цены до 50% на самые популярные модели наконечников и наконечников-картриджей применяемых в монтажных паяльных станциях Актаком. 13-02-2026
Процессорные модули Jetson NVIDIA в каталоге Макро Групп
Макро Групп анонсирует начало поставок процессорных модулей NVIDIA… 12-02-2026
Популярные модели токовых клещей Актаком серии АТК Популярные модели токовых клещей Актаком серии АТК
Предлагаем уникальные модели токовых клещей Актаком серии АТК которые долгие годы пользуются повышенной популярностью у профессионалов в области энергетики. Готовы к поставке токоизмерительные клещи -ваттметр АТК-2200 до 1200 кВт универсальная модель АТК-2250 до 2500 А микротоковые клещи АТК-2001 а также токовые клещи с гибким магнитопроводом АТК-2011 и АТК-2012 10-02-2026
Приглашаем посетить наш стенд на ТБ Форум-2026
Компания Макро ЕМС приглашает посетить выставку в рамках международного форума Технологии и безопасность 2026 в Москве. 10-02-2026
Неохлаждаемый инфракрасный модуль с разрешением 1280 1024 от InfiRay
Компания InfiRay анонсировала компактный неохлаждаемый инфракрасный модуль с разрешением 1280 1024 предназначенный для интеграции в современные оптико-электронные системы … 05-02-2026
Наконечники для термофенов паяльных станций Актаком дешевле до 69% Наконечники для термофенов паяльных станций Актаком дешевле до 69%
До 69% снижены цены на практически всю номенклатуру сопел для пайки горячим воздухом термофенов паяльных станций и ремонтных центров с термовоздушных каналом 04-02-2026
Secure Vision Chip For CCTV Secure Vision Chip For CCTV
A vision chip runs on-device video analytics with edge AI and hardware security reducing cloud use in CCTV systems. Here is what it brings. Mindgrove Technologies plans to release its V2600 system-on-chip in late 2026 for CCTV and surveillance systems that require built-in security and on-device processing. The chip is designed to run video… 17-02-2026
High-side driver powers through disturbances
With 4V minimum operating voltage ST s VNQ9050LAJ 4-channel automotive high-side driver powers through disturbances including extreme cold cranking operation down to 2.7V. This resilience when exposed to severe transients meets ... The post High-side driver powers through disturbances appeared first on Electronics Weekly… 17-02-2026
Performing an Autopsy on 15 Dead Battle Born LFP Batteries Performing an Autopsy on 15 Dead Battle Born LFP Batteries
Because size matters when it comes to statistics Will Prowse decided to not just bank on his handful of failed Battle Born LFP batteries when it came to documenting their read… 17-02-2026
Next-Level Mobile Photography Starts Here Next-Level Mobile Photography Starts Here
A 200MP sensor with 0.5µm pixels targets zoom cameras supports fast processing and low-light capture. How does pixel size affect performance Samsung has launched a new 200MP image sensor called ISOCELL HP5. It is the first sensor to use 0.5µm pixels. The company plans to use it in upcoming smartphones. The HP5 is mainly… 17-02-2026
120 kW Grid-Tied Inverter Test Platform  120 kW Grid-Tied Inverter Test Platform 
The high-capacity automated system strengthens North India s access to advanced standards-compliant solar inverter validation infrastructure. India s rapidly expanding solar market has gained a significant boost with the introduction of a 120 kW grid-tied inverter GTI test system by Exeliq Tech Solutions designed to meet rising compliance safety and performance validation demands. The… 17-02-2026
Edge AI Platform With Real-Time Intelligence Edge AI Platform With Real-Time Intelligence
The new edge-first system integrates industrial AI software with GPU-accelerated infrastructure to reduce latency protect data and fast-track adoption across manufacturing clusters. India s push to embed artificial intelligence into factories and critical infrastructure is getting a new edge-focused boost with the launch of YodaEdge a pre-integrated platform designed to run AI workloads… 17-02-2026
AI Chips Optimize Yeast Protein Coding AI Chips Optimize Yeast Protein Coding
MIT s AI system boosts precision protein drug production cutting development costs by learning the language of genetic sequences. In a move that signals deeper convergence between artificial intelligence and bio-manufacturing electronics researchers at the Massachusetts Institute of Technology MIT have developed an advanced large language model-based tool that could significantly reduce… 17-02-2026
A Lidar That Sees Motion In 4D A Lidar That Sees Motion In 4D
This 4D LiDAR sensor sees all around tracks speed and distance together and helps machines move safely in tight spaces. Let us find out more Aeva has introduced Omni a short-range 4D LiDAR sensor for physical AI systems that need awareness in close spaces. Omni provides a 360-degree horizontal and 90-degree vertical field… 17-02-2026
Ultra-Compact Radar Chip Advances 6G Ultra-Compact Radar Chip Advances 6G
0.24 mm low-power FMCW design targets 6G sensing-communication convergence in edge electronics. Tokyo scientists have unveiled a tiny radar-on-chip prototype that could reshape future wireless hardware for beyond-5G and 6G ecosystems marrying sensing with communications in a power-lean design.  Developed at Japan s Institute of Science Tokyo the new chip packs a high-precision Frequency-Modulat 17-02-2026
New Class Of Semiconductors Made Of Germanium-Tin Alloy University of Edinburgh et al.
A new technical paper High Pressure and Compositionally Directed Route to a Hexagonal GeSn Alloy Class was published by researchers at the University of Edinburgh GFZ Helmholtz Centre for Geosciences the University of Lille Grenoble Alpes University the University of Bayreuth and the European Synchrotron facility. Abstract Despite their electronic dominance cubic diamond structured… 17-02-2026
What the FDA s 2026 Wellness Device Update Means for Wearables What the FDA s 2026 Wellness Device Update Means for Wearables
With more and more sensors being crammed into the consumer devices that many of us wear every day the question of where medical devices begin and end and how they read… 17-02-2026
Less Power and Higher Performance With A Nanolaser With Extreme Dielectric Confinement DTU
A new technical paper titled A nanolaser with extreme dielectric confinement was published by researchers at Technical University of Denmark DTU . Abstract The interaction between light and matter can be enhanced by spatially concentrating the light field and extending photon dwell time. Plasmonic structures can provide strong light confinement but suffer from ohmic losses. Recent... read… 17-02-2026
Electromechanical polishing of semiconductor wafers
ELECTROCHEMICAL polishing of wafers of semiconducting material is claimed to be faster  more efficient and to offer a 50% saving in cost over conventional methods So 65 years ago started ... The post Electromechanical polishing of semiconductor wafers appeared first on Electronics Weekly… 17-02-2026
A Basic Guide To Shielding A Basic Guide To Shielding
GreatScott has recently been tinkering in the world of radio frequency emissions going so far as to put their own designs in a proper test chamber to determine whether they read… 17-02-2026
Chip Assembler ASE Sees Advanced Packaging Sales Doubling
ASE expects advanced packaging sales to double on AI chip demand. The post Chip Assembler ASE Sees Advanced Packaging Sales Doubling appeared first on EE Times… 17-02-2026
The Race Begins For Much Bigger Abstractions
New data centers and massive compute capabilities enable a whole new way of manipulating and using data. The post The Race Begins For Much Bigger Abstractions appeared first on Semiconductor Engineering… 17-02-2026